JPS62178564U - - Google Patents
Info
- Publication number
- JPS62178564U JPS62178564U JP6708686U JP6708686U JPS62178564U JP S62178564 U JPS62178564 U JP S62178564U JP 6708686 U JP6708686 U JP 6708686U JP 6708686 U JP6708686 U JP 6708686U JP S62178564 U JPS62178564 U JP S62178564U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- printed wiring
- wiring board
- component side
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図のイ及びロは、各々この考案の一実施例
によるプリント配線基板の半田面及び部品面を示
す図、第２図イ及びロは、各々従来のプリント配
線基板の半田面及び部品面を示す図である。
１：基板、２：電源もしくはグランド回路パタ
ーン、３：信号回路パターン、１０：基板、１１
ａ，１１ｂ：電源もしくはグランド回路パターン
、１２ａ，１２ｂ，１２ｃ：信号回路パターン、
１３ａ，１３ｂ，１３ｃ：余剰パターン、１４：
電源もしくはグランド回路パターン、１５ａ，１
５ｂ：信号回路パターン、１６ａ，１６ｂ：余剰
パターン。
Figures 1A and 2B are views showing the solder side and component side of a printed wiring board according to an embodiment of the present invention, and Figure 2A and 2B are views showing the solder side and component side of a conventional printed wiring board, respectively. FIG. 1: Board, 2: Power supply or ground circuit pattern, 3: Signal circuit pattern, 10: Board, 11
a, 11b: power supply or ground circuit pattern, 12a, 12b, 12c: signal circuit pattern,
13a, 13b, 13c: surplus pattern, 14:
Power supply or ground circuit pattern, 15a, 1
5b: Signal circuit pattern, 16a, 16b: Surplus pattern.
Claims (1)
ント配線基板において、前記半田面及び部品面の
前記パターンの分布を均一にし、かつ前記半田面
と前記部品面とのパターン布設面積を同一にする
余剰パターンを布設したことを特徴とするプリン
ト配線基板。 In a printed wiring board on which a pattern is laid on a solder side and a component side, an extra pattern that makes the distribution of the pattern on the solder side and the component side uniform, and makes the pattern laying area on the solder side and the component side the same. A printed wiring board characterized by being installed with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6708686U JPS62178564U (en) | 1986-05-02 | 1986-05-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6708686U JPS62178564U (en) | 1986-05-02 | 1986-05-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62178564U true JPS62178564U (en) | 1987-11-12 |
Family
ID=30905671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6708686U Pending JPS62178564U (en) | 1986-05-02 | 1986-05-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62178564U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09107159A (en) * | 1996-10-07 | 1997-04-22 | Hokuriku Electric Ind Co Ltd | Circuit board and method of manufacture |
| JP2014049648A (en) * | 2012-08-31 | 2014-03-17 | Yazaki Corp | Printed wiring board |
| JP2018515941A (en) * | 2015-05-08 | 2018-06-14 | アジャイル・パワー・スイッチ・３・ディー−インテグレイション・エイ・ピー・エス・アイ・３・ディー | Semiconductor power device and method for assembling semiconductor power device |
-
1986
- 1986-05-02 JP JP6708686U patent/JPS62178564U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09107159A (en) * | 1996-10-07 | 1997-04-22 | Hokuriku Electric Ind Co Ltd | Circuit board and method of manufacture |
| JP2014049648A (en) * | 2012-08-31 | 2014-03-17 | Yazaki Corp | Printed wiring board |
| JP2018515941A (en) * | 2015-05-08 | 2018-06-14 | アジャイル・パワー・スイッチ・３・ディー−インテグレイション・エイ・ピー・エス・アイ・３・ディー | Semiconductor power device and method for assembling semiconductor power device |
| US10714428B2 (en) | 2015-05-08 | 2020-07-14 | Agile Power Switch 3D—Integration Apsi3D | Semiconductor power device and a method of assembling a semiconductor power device |