JPS59104559U - Multilayer printed circuit board with reference pattern - Google Patents

Multilayer printed circuit board with reference pattern

Info

Publication number
JPS59104559U
JPS59104559U JP19766782U JP19766782U JPS59104559U JP S59104559 U JPS59104559 U JP S59104559U JP 19766782 U JP19766782 U JP 19766782U JP 19766782 U JP19766782 U JP 19766782U JP S59104559 U JPS59104559 U JP S59104559U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
multilayer printed
reference pattern
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19766782U
Other languages
Japanese (ja)
Inventor
敏 遠藤
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP19766782U priority Critical patent/JPS59104559U/en
Publication of JPS59104559U publication Critical patent/JPS59104559U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図は本考案による基準パターン入り多層プリント基板の
平面図を示す。The figure shows a plan view of a multilayer printed circuit board with a reference pattern according to the present invention.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 多層プリント基板において、各層のパターン配線の熱分
布と比較する基準パターンを前記各層毎に設け、該基準
パターンの所要箇所を前記多層プリント基板の表層ある
いは裏層に設けた熱分布測定用ランドと接続してなるこ
とを特徴とする基準パターン入り多層プリント基板。In a multilayer printed circuit board, a reference pattern is provided for each layer to compare the heat distribution of the pattern wiring of each layer, and required locations of the reference pattern are connected to lands for heat distribution measurement provided on the surface layer or back layer of the multilayer printed circuit board. A multilayer printed circuit board with a reference pattern.
JP19766782U 1982-12-29 1982-12-29 Multilayer printed circuit board with reference pattern Pending JPS59104559U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19766782U JPS59104559U (en) 1982-12-29 1982-12-29 Multilayer printed circuit board with reference pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19766782U JPS59104559U (en) 1982-12-29 1982-12-29 Multilayer printed circuit board with reference pattern

Publications (1)

Publication Number Publication Date
JPS59104559U true JPS59104559U (en) 1984-07-13

Family

ID=30423121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19766782U Pending JPS59104559U (en) 1982-12-29 1982-12-29 Multilayer printed circuit board with reference pattern

Country Status (1)

Country Link
JP (1) JPS59104559U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6262477U (en) * 1985-10-07 1987-04-17

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6262477U (en) * 1985-10-07 1987-04-17

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