JPH0399469U - - Google Patents
Info
- Publication number
- JPH0399469U JPH0399469U JP9813290U JP9813290U JPH0399469U JP H0399469 U JPH0399469 U JP H0399469U JP 9813290 U JP9813290 U JP 9813290U JP 9813290 U JP9813290 U JP 9813290U JP H0399469 U JPH0399469 U JP H0399469U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- circuit conductor
- thick
- board
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 12
- 239000002131 composite material Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 1
Description
図−１は本考案の一実施例に係る複合回路基板
の要部を示す斜視図、図−２は同基板のスルーホ
ール部分の断面図、図−３は同基板の製造方法を
示す説明図、図−４は従来の複合回路基板の要部
を示す斜視図、図−５は同基板の製造方法を示す
説明図、図−６は厚肉回路導体の打抜加工による
回路パターンの一例を示す平面図である。
１１……厚肉回路導体、１２……薄肉回路導体
、１２ａ……ランド、１３……絶縁基板、１４…
…スルーホール。
Figure 1 is a perspective view showing the main parts of a composite circuit board according to an embodiment of the present invention, Figure 2 is a cross-sectional view of the through-hole portion of the same board, and Figure 3 is an explanatory diagram showing the manufacturing method of the same board. , Figure 4 is a perspective view showing the main parts of a conventional composite circuit board, Figure 5 is an explanatory diagram showing the manufacturing method of the same board, and Figure 6 is an example of a circuit pattern obtained by punching a thick circuit conductor. FIG. 11... Thick circuit conductor, 12... Thin circuit conductor, 12a... Land, 13... Insulating substrate, 14...
...Through hole.
Claims (1)
と、所要の回路パターンに形成された薄肉回路導
体と、これらの回路導体間を絶縁する絶縁基板と
からなる複合回路基板において、薄肉回路導体を
絶縁基板の表面に配置し、厚肉回路導体を絶縁基
板の内部に埋め込み、厚肉回路導体の部品実装部
にはその表面部分に薄肉回路導体よりなるランド
を設けると共にそのランドと厚肉回路導体とを導
通させるスルーホールを形成したことを特徴とす
る複合回路基板。 In a composite circuit board consisting of a thick circuit conductor formed in a desired circuit pattern, a thin circuit conductor formed in a desired circuit pattern, and an insulating substrate that insulates between these circuit conductors, the thin circuit conductor is insulated. A thick circuit conductor is placed on the surface of the board, and a thick circuit conductor is embedded inside the insulating board, and a land made of a thin circuit conductor is provided on the surface part of the component mounting part of the thick circuit conductor, and the land and the thick circuit conductor are connected to each other. A composite circuit board characterized in that a through hole is formed to conduct electricity.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9813290U JPH0399469U (en) | 1989-11-27 | 1990-09-20 | |
| US07/615,337 US5223676A (en) | 1989-11-27 | 1990-11-19 | Composite circuit board having means to suppress heat diffusion and manufacturing method of the same |
| CA002030826A CA2030826C (en) | 1989-11-27 | 1990-11-26 | Composite circuit board with thick embedded conductor and method of manufacturing the same |
| EP90122636A EP0430157B1 (en) | 1989-11-27 | 1990-11-27 | Composite circuit board and manufacturing method of the same |
| DE69032919T DE69032919T2 (en) | 1989-11-27 | 1990-11-27 | Compiled circuit board and manufacturing process therefor |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13611089 | 1989-11-27 | ||
| JP9813290U JPH0399469U (en) | 1989-11-27 | 1990-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0399469U true JPH0399469U (en) | 1991-10-17 |
Family
ID=31890283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9813290U Pending JPH0399469U (en) | 1989-11-27 | 1990-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0399469U (en) |
-
1990
- 1990-09-20 JP JP9813290U patent/JPH0399469U/ja active Pending