JPH0353862U - - Google Patents
Info
- Publication number
- JPH0353862U JPH0353862U JP11500189U JP11500189U JPH0353862U JP H0353862 U JPH0353862 U JP H0353862U JP 11500189 U JP11500189 U JP 11500189U JP 11500189 U JP11500189 U JP 11500189U JP H0353862 U JPH0353862 U JP H0353862U
- Authority
- JP
- Japan
- Prior art keywords
- detection part
- wiring board
- detection
- printed wiring
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第1図は本考案になるプリント配線板の要部を
示す平面図、第2及び第3図は検出孔のずれを説
明するための平面図、第4図は本考案になるプリ
ント配線板の他の実施例の要部を示す平面図、第
5図a,bは従来の加工孔のずれの検査方法を説
明するための平面図である。
10…パターンランド、11…加工孔、20,
30…検出用導体パターン、21,31…検出部
、22,23…端子部、24,25…検出孔。
Fig. 1 is a plan view showing the main parts of the printed wiring board according to the present invention, Figs. 2 and 3 are plan views for explaining the misalignment of the detection holes, and Fig. 4 is a plan view showing the main parts of the printed wiring board according to the present invention. FIGS. 5A and 5B are plan views showing essential parts of another embodiment, and are plan views for explaining a conventional method for inspecting the deviation of a machined hole. 10... Pattern land, 11... Machining hole, 20,
30... Detection conductor pattern, 21, 31... Detection section, 22, 23... Terminal section, 24, 25... Detection hole.
Claims (1)
を形成してなるプリント配線板において、前記配
線パターンと共に機械加工ずれの許容誤差相当の
幅を有する導体パターンからなる検出部と、この
検出部に接続された端子部とからなる検出用導体
パターンを備えてなることを特徴とするプリント
配線板。 In a printed wiring board comprising a wiring pattern made of a good electrical conductor formed on an insulating substrate, a detection part made of a conductor pattern having a width equivalent to a tolerance for machining deviation together with the wiring pattern, and a detection part connected to the detection part. 1. A printed wiring board comprising a detection conductor pattern consisting of a terminal portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989115001U JPH0623012Y2 (en) | 1989-09-29 | 1989-09-29 | Printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989115001U JPH0623012Y2 (en) | 1989-09-29 | 1989-09-29 | Printed wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0353862U true JPH0353862U (en) | 1991-05-24 |
JPH0623012Y2 JPH0623012Y2 (en) | 1994-06-15 |
Family
ID=31663347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989115001U Expired - Lifetime JPH0623012Y2 (en) | 1989-09-29 | 1989-09-29 | Printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0623012Y2 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54125468A (en) * | 1978-03-23 | 1979-09-28 | Luther & Maelzer Gmbh | Method of determining offset between conductive route and connection hole in conductive substrate and conductive substrate using same |
-
1989
- 1989-09-29 JP JP1989115001U patent/JPH0623012Y2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54125468A (en) * | 1978-03-23 | 1979-09-28 | Luther & Maelzer Gmbh | Method of determining offset between conductive route and connection hole in conductive substrate and conductive substrate using same |
Also Published As
Publication number | Publication date |
---|---|
JPH0623012Y2 (en) | 1994-06-15 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |