JPH0353862U - - Google Patents

Info

Publication number
JPH0353862U
JPH0353862U JP11500189U JP11500189U JPH0353862U JP H0353862 U JPH0353862 U JP H0353862U JP 11500189 U JP11500189 U JP 11500189U JP 11500189 U JP11500189 U JP 11500189U JP H0353862 U JPH0353862 U JP H0353862U
Authority
JP
Japan
Prior art keywords
detection part
wiring board
detection
printed wiring
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11500189U
Other languages
Japanese (ja)
Other versions
JPH0623012Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989115001U priority Critical patent/JPH0623012Y2/en
Publication of JPH0353862U publication Critical patent/JPH0353862U/ja
Application granted granted Critical
Publication of JPH0623012Y2 publication Critical patent/JPH0623012Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案になるプリント配線板の要部を
示す平面図、第2及び第3図は検出孔のずれを説
明するための平面図、第4図は本考案になるプリ
ント配線板の他の実施例の要部を示す平面図、第
5図a,bは従来の加工孔のずれの検査方法を説
明するための平面図である。 10…パターンランド、11…加工孔、20,
30…検出用導体パターン、21,31…検出部
、22,23…端子部、24,25…検出孔。
Fig. 1 is a plan view showing the main parts of the printed wiring board according to the present invention, Figs. 2 and 3 are plan views for explaining the misalignment of the detection holes, and Fig. 4 is a plan view showing the main parts of the printed wiring board according to the present invention. FIGS. 5A and 5B are plan views showing essential parts of another embodiment, and are plan views for explaining a conventional method for inspecting the deviation of a machined hole. 10... Pattern land, 11... Machining hole, 20,
30... Detection conductor pattern, 21, 31... Detection section, 22, 23... Terminal section, 24, 25... Detection hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板に電気の良導体からなる配線パターン
を形成してなるプリント配線板において、前記配
線パターンと共に機械加工ずれの許容誤差相当の
幅を有する導体パターンからなる検出部と、この
検出部に接続された端子部とからなる検出用導体
パターンを備えてなることを特徴とするプリント
配線板。
In a printed wiring board comprising a wiring pattern made of a good electrical conductor formed on an insulating substrate, a detection part made of a conductor pattern having a width equivalent to a tolerance for machining deviation together with the wiring pattern, and a detection part connected to the detection part. 1. A printed wiring board comprising a detection conductor pattern consisting of a terminal portion.
JP1989115001U 1989-09-29 1989-09-29 Printed wiring board Expired - Lifetime JPH0623012Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989115001U JPH0623012Y2 (en) 1989-09-29 1989-09-29 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989115001U JPH0623012Y2 (en) 1989-09-29 1989-09-29 Printed wiring board

Publications (2)

Publication Number Publication Date
JPH0353862U true JPH0353862U (en) 1991-05-24
JPH0623012Y2 JPH0623012Y2 (en) 1994-06-15

Family

ID=31663347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989115001U Expired - Lifetime JPH0623012Y2 (en) 1989-09-29 1989-09-29 Printed wiring board

Country Status (1)

Country Link
JP (1) JPH0623012Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54125468A (en) * 1978-03-23 1979-09-28 Luther & Maelzer Gmbh Method of determining offset between conductive route and connection hole in conductive substrate and conductive substrate using same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54125468A (en) * 1978-03-23 1979-09-28 Luther & Maelzer Gmbh Method of determining offset between conductive route and connection hole in conductive substrate and conductive substrate using same

Also Published As

Publication number Publication date
JPH0623012Y2 (en) 1994-06-15

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term