JPH0623012Y2 - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JPH0623012Y2
JPH0623012Y2 JP1989115001U JP11500189U JPH0623012Y2 JP H0623012 Y2 JPH0623012 Y2 JP H0623012Y2 JP 1989115001 U JP1989115001 U JP 1989115001U JP 11500189 U JP11500189 U JP 11500189U JP H0623012 Y2 JPH0623012 Y2 JP H0623012Y2
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
pattern
detection
deviation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989115001U
Other languages
Japanese (ja)
Other versions
JPH0353862U (en
Inventor
正訓 矢内
正 岡本
正則 菊池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Victor Company of Japan Ltd
Original Assignee
Victor Company of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Victor Company of Japan Ltd filed Critical Victor Company of Japan Ltd
Priority to JP1989115001U priority Critical patent/JPH0623012Y2/en
Publication of JPH0353862U publication Critical patent/JPH0353862U/ja
Application granted granted Critical
Publication of JPH0623012Y2 publication Critical patent/JPH0623012Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【考案の詳細な説明】 (産業上の利用分野) 本考案はプリント配線板に係り、特にプリント配線板の
機械加工ずれを目視によらず、電気的に検出可能なプリ
ント配線板の構造に関する。
DETAILED DESCRIPTION OF THE INVENTION (Industrial field of use) The present invention relates to a printed wiring board, and more particularly to a structure of a printed wiring board that can be electrically detected without visually observing a mechanical processing deviation of the printed wiring board.

(従来の技術) 従来、絶縁体からなるプリント基板上に形成された、例
えば銅箔などからなる配線パターンには、例えば、コン
デンサー、IC等の電気部品が接続されるが、これらの
電気部品を接続しハンダ付される場所をパターンランド
と称している。
(Prior Art) Conventionally, an electric component such as a capacitor or an IC is connected to a wiring pattern made of, for example, a copper foil formed on a printed circuit board made of an insulator. The place where it is connected and soldered is called a pattern land.

これらのパターンランドに電気部品を接続するには、ま
ず、パターンランドに、例えばプレス等により穴加工を
行い、この加工穴に電気部品の端子を挿入し、ハンダ付
を行っていた。これらの加工穴は一般的にプレスにより
一度に打抜くため、プリント板のセッティング位置がず
れると、全ての加工孔がずれてしまうものであった。
In order to connect electric parts to these pattern lands, first, holes are formed in the pattern lands by, for example, pressing, terminals of the electric parts are inserted into the holes, and soldering is performed. Since these processed holes are generally punched at once by a press, if the setting position of the printed board is displaced, all the processed holes are displaced.

従って、従来においては、検査用として代表の加工孔を
定め、その加工孔のずれを拡大鏡等を用いて目視により
測定し、プリント配線板の合格、不合格を決定してい
た。
Therefore, conventionally, a representative machined hole is defined for inspection, and the deviation of the machined hole is visually measured using a magnifying glass or the like to determine whether the printed wiring board passes or fails.

第4図(a),(b)は従来の加工孔のずれの検査方法を説明
するための平面図である。同図において10はパターン
ランド、11は加工孔である。
FIGS. 4 (a) and 4 (b) are plan views for explaining a conventional method for inspecting a deviation of a processed hole. In the figure, 10 is a pattern land, and 11 is a processed hole.

同図(a)は加工孔11が標準的な位置に設けられている
場合を示し、加工孔11端部とパターンランドの直線端
部10a間の間隔が、例えば0.3mmの場合である。
FIG. 3A shows a case where the machined hole 11 is provided at a standard position, and the interval between the machined hole 11 end and the linear end 10a of the pattern land is, for example, 0.3 mm.

同図(b)は加工孔11の合格の限界を示すものであり、
加工孔11の中心値のずれが、例えば、0.25mm未満の場
合、または加工孔11端部とパターンランドの直線端部
10a間の間隔が0.05mm以上は合格と定めてある。言い
かえるなら加工孔のずれの許容誤差は0.25mmとなってい
る。
The figure (b) shows the limit of acceptance of the processed hole 11,
For example, when the deviation of the center value of the processed hole 11 is less than 0.25 mm, or when the distance between the end of the processed hole 11 and the straight end 10a of the pattern land is 0.05 mm or more, it is defined as pass. In other words, the permissible error of machined hole deviation is 0.25 mm.

(考案が解決しようとする課題) 上述の様に、プリント配線板にプレス等で形成される孔
等の機械加工ずれの検査は検査員が、検査規格に基い
て、目視で行っていたが、一枚当りの検査にかかる工数
が大きく、また、長時間の検査作業が続くと目が疲れ、
検査精度が低下し信頼性が乏しい等の問題点があった。
また、自動化が出来ないため、工程上のネックとなって
いた。
(Problems to be solved by the invention) As described above, an inspector visually inspects a machining deviation such as a hole formed in a printed wiring board by a press, based on the inspection standard. The number of man-hours required for inspection per sheet is large, and eyes are tired if inspection work continues for a long time.
There was a problem that the inspection accuracy decreased and the reliability was poor.
Moreover, since it cannot be automated, it has been a bottleneck in the process.

(課題を解決するための手段) 本考案は上記課題を解決するためになされたものであ
り、絶縁基板に電気の良導体からなる配線パターンを形
成してなるプリント配線板において、所定の幅tと内径
dとを有する2つの半円パターン21a,21aと、こ
れら半円パターン21a,21aにそれぞれ接続された
前記と同様の幅tを有する直線パターン21b,21b
とから形成された略S字状の検出部21と、上記直線パ
ターン21b,21bの一端部にそれぞれ接続された端
子部22、23とより形成され、かつ、上記検出部21
に設けられた所定の幅tは、加工孔11のずれの許容誤
差と同じ大きさに設定してなる検出用導体パターン20
を、その余白部に備えてなるプリント配線板を提供しよ
うとするものである。
(Means for Solving the Problems) The present invention has been made to solve the above problems, and in a printed wiring board in which a wiring pattern made of a good electric conductor is formed on an insulating substrate, a predetermined width t Two semi-circular patterns 21a, 21a having an inner diameter d, and linear patterns 21b, 21b connected to the semi-circular patterns 21a, 21a and having the same width t as described above.
And a terminal portion 22, 23 connected to one end of each of the linear patterns 21b, 21b, respectively, and the detection portion 21.
The predetermined width t provided on the detection conductor pattern 20 is set to the same size as the tolerance of the deviation of the processed hole 11.
To provide a printed wiring board provided in the margin.

(実施例) 第1図は本考案になるプリント配線板の要部を示す平面
図である。同図において、20は導体膜からなる本考案
の検出用導体パターンであり、図示しない配線パターン
が形成されたプリント配線板の余白部に形成されたもの
である。検出用パターン20は、略S字状の検出部21
とその端部に形成した端子部22,23とからなる。検
出部21は幅tを有し、内径dからなる2つの半円パタ
ーン21aと、これら半円パターン21a,21bに接
続した幅tからなる直線パターン21bとからなり、直
線パターン21bの端部に円形状の端子部22,23が
形成されている。従って端子部22,23間は電気的に
導通状態となっている。
(Embodiment) FIG. 1 is a plan view showing an essential part of a printed wiring board according to the present invention. In the figure, reference numeral 20 denotes a detection conductor pattern of the present invention made of a conductor film, which is formed in a margin of a printed wiring board on which a wiring pattern (not shown) is formed. The detection pattern 20 has a substantially S-shaped detection portion 21.
And terminal portions 22 and 23 formed at the ends thereof. The detection unit 21 has a width t and is composed of two semicircular patterns 21a having an inner diameter d and a linear pattern 21b having a width t connected to the semicircular patterns 21a and 21b. Circular terminal portions 22 and 23 are formed. Therefore, the terminals 22 and 23 are electrically connected.

また、検出部21の各パターン21a,21bの幅tの
大きさは加工孔11のずれの許容誤差と同じ大きさを有
する様に設定されるものである。使用に際して、あらか
じめ打抜き用金型に、パターンランド用加工孔用ピンや
ダイスと共に、この半円パターン21aの内径dと同一
の直径を有する一対の検出孔用のピンとダイスを、プリ
ント配線板に形成された2つの半円状パターン21aの
内径dを正確に内抜く様に設けておく。
The size of the width t of each of the patterns 21a and 21b of the detection unit 21 is set to have the same size as the tolerance of the deviation of the processing hole 11. Before use, a pair of detection hole pins and dies having the same diameter as the inner diameter d of the semicircular pattern 21a are formed on a printed wiring board in advance in a die for punching, together with a pin and a die for processed hole for pattern land. The inner diameter d of the two formed semicircular patterns 21a is provided so as to be accurately pulled out.

従って、孔加工に際して、もしプリント配線板のセッテ
イングがずれた場合、形成されたパターンランド用加工
孔と共に検出孔24,25の形成位置も同様にずれるこ
とになる 第2図及び第3図は、検出孔24,25のずれを説明す
るための平面図である。第2図は検出孔24,25がA
方向に許容誤差範囲内でずれた場合を示し、一方の検出
孔24が半円パターン21aの一部にかかった状態で形
成されているが検出部21の各パターンの切断は無い。
従って端子部22,23間は電気的に導通状態にある。
このことは、検出孔のずれの値が検出パターン20の幅
t以内、すなわち許容誤差範囲内であれば、端子部2
2,23間の導通が常に得られることを意味している。
第3図は検出孔24,25がB方向に許容誤差範囲以上
にずれた場合であり、検出パターン20の一部が切断さ
れた状態を示している。この場合は、端子部22,23
間の電気的導通は得られない。
Therefore, when the setting of the printed wiring board is deviated during the hole processing, the formation positions of the detection holes 24 and 25 are also deviated together with the formed pattern land processing holes. It is a top view for explaining a gap of detection holes 24 and 25. In FIG. 2, the detection holes 24 and 25 are A.
A case where the detection holes 24 are formed in a state in which one detection hole 24 extends over a part of the semicircular pattern 21a is shown, but each pattern of the detection unit 21 is not cut.
Therefore, the terminals 22 and 23 are electrically connected.
This means that if the deviation value of the detection hole is within the width t of the detection pattern 20, that is, within the allowable error range, the terminal portion 2
This means that continuity between 2 and 23 is always obtained.
FIG. 3 shows a case where the detection holes 24 and 25 are displaced in the B direction by more than the allowable error range, and shows a state in which a part of the detection pattern 20 is cut. In this case, the terminal parts 22, 23
There is no electrical continuity between them.

上述の説明では、検出孔24,25のA,B方向のずれ
を例にとって説明したが、このずれの方向はこれらに限
られることはなく全方向(360゜)についても、前記同様
の結果が得られることは説明するまでもない。
In the above description, the deviation of the detection holes 24 and 25 in the A and B directions has been described as an example. However, the deviation directions are not limited to these, and the same results as above can be obtained in all directions (360 °). There is no need to explain what can be obtained.

従って、出荷時のパターンランド10の加工孔11のず
れの検査においては、端子部22,23間の導通の有無
をチエックするだけでずれの量が許容誤差範囲以内にあ
るかどうかが判定出来、精度、作業能率が大幅に改善さ
れるばかりでなく、自動化が可能となり、プリント配線
板工程全体の合理化に大きく役立つものである。
Therefore, in the inspection of the deviation of the processed hole 11 of the pattern land 10 at the time of shipment, it is possible to determine whether or not the deviation amount is within the allowable error range simply by checking the presence or absence of conduction between the terminal portions 22 and 23. Not only the accuracy and work efficiency are greatly improved, but also automation is possible, which greatly contributes to the rationalization of the entire printed wiring board process.

(考案の効果) 上述の様に、本考案によれば、絶縁基板に電気の良導体
からなる配線パターンを形成してなるプリント配線板に
おいて、所定の幅と内径とを有する2つの半円パターン
と、これら半円パターンにそれぞれ接続された前記と同
様の幅を有する直線パターンとから形成された略S字状
の検出部と、上記直線パターンの一端部にそれぞれ接続
された端子部とより形成され、かつ、上記検出部に設け
られた所定の幅は、加工孔のずれの許容誤差と同じ大き
さに設定してなる検出用導体パターンを、その余白部に
備えてなる構成としたためプリント配線板に形成された
複数の加工孔のずれが許容誤差範囲にあるか否かの判定
を端子部間の導通の有無として電気的にチェックするこ
とにより即座に行うことが出来、検査精度と作業能率を
大幅に改善することが出来ると共に、検査の自動化が可
能となり、工程の合理化に極めて有利なプリント配線板
の提供を可能とするものである。
(Effects of the Invention) As described above, according to the present invention, in a printed wiring board having a wiring pattern made of a good electric conductor formed on an insulating substrate, two semi-circular patterns having a predetermined width and inner diameter are provided. , A substantially S-shaped detecting portion formed of linear patterns having the same width as the above connected to each of the semicircular patterns, and a terminal portion connected to one end of the linear pattern. Moreover, the predetermined width provided in the detection section is set to the same size as the permissible error of the deviation of the processed hole, and the detection conductor pattern is provided in the margin portion of the printed wiring board. It is possible to immediately determine whether or not the deviation of the plurality of machined holes formed in the range is within the allowable error range by electrically checking the presence or absence of continuity between the terminal parts, and to improve the inspection accuracy and work efficiency. Big The width can be improved, and the inspection can be automated, which makes it possible to provide a printed wiring board that is extremely advantageous for streamlining the process.

また、上記の如くの検出用導体パターンは、プリント配
線板の余白部に設けられるものであるから、電気的なチ
ェックは、本来部品が取付けられるプリント配線板の該
当部分を使用する必要はなく、この導体パターンを使用
することで行うことができるので甚だ便利であり、しか
も、これはチェック後削り取ることが出来るので、プリ
ント配線板全体の活用度が拡がるという利点がある。
Further, since the detection conductor pattern as described above is provided in the blank portion of the printed wiring board, it is not necessary to use the corresponding portion of the printed wiring board to which the component is originally attached, for the electrical check. This is very convenient because it can be performed by using this conductor pattern, and it can be shaved off after checking, which has the advantage of expanding the utilization of the entire printed wiring board.

【図面の簡単な説明】[Brief description of drawings]

第1図は本考案になるプリント配線板の要部を示す平面
図、第2及び第3図は検出孔のずれを説明するための平
面図、第4図(a),(b)は従来の加工孔のずれの検査方法
を説明するための平面図である。 10…パターンランド、11…加工孔、 20…検出用導体パターン、 21,31…検出部、22,23…端子部 24,25…検出孔。
FIG. 1 is a plan view showing a main part of a printed wiring board according to the present invention, FIGS. 2 and 3 are plan views for explaining a deviation of a detection hole, and FIGS. 4 (a) and 4 (b) are conventional. FIG. 6 is a plan view for explaining the method for inspecting the deviation of the processed hole. 10 ... Pattern land, 11 ... Processed hole, 20 ... Detection conductor pattern, 21, 31 ... Detection part, 22, 23 ... Terminal part 24, 25 ... Detection hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】絶縁基板に電気の良導体からなる配線パタ
ーンを形成してなるプリント配線板において、 所定の幅と内径とを有する2つの半円パターンと、これ
ら半円パターンにそれぞれ接続された前記と同様の幅を
有する直線パターンとから形成された略S字状の検出部
と、 上記直線パターンの一端部にそれぞれ接続された端子部
とより形成され、 かつ、上記検出部に設けられた所定の幅は、加工孔のず
れの許容誤差と同じ大きさに設定してなる検出用導体パ
ターンを、 その余白部に備えてなることを特徴とするプリント配線
板。
1. A printed wiring board in which a wiring pattern made of a good electric conductor is formed on an insulating substrate, two semicircular patterns having a predetermined width and an inner diameter, and the semicircular patterns respectively connected to the semicircular patterns. A substantially S-shaped detecting portion formed of a linear pattern having a width similar to that of the above, and a terminal portion connected to one end of the linear pattern, and provided in the detecting portion. The printed wiring board is characterized in that the margin is provided with a detection conductor pattern having a width equal to the tolerance of the deviation of the processed hole.
JP1989115001U 1989-09-29 1989-09-29 Printed wiring board Expired - Lifetime JPH0623012Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989115001U JPH0623012Y2 (en) 1989-09-29 1989-09-29 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989115001U JPH0623012Y2 (en) 1989-09-29 1989-09-29 Printed wiring board

Publications (2)

Publication Number Publication Date
JPH0353862U JPH0353862U (en) 1991-05-24
JPH0623012Y2 true JPH0623012Y2 (en) 1994-06-15

Family

ID=31663347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989115001U Expired - Lifetime JPH0623012Y2 (en) 1989-09-29 1989-09-29 Printed wiring board

Country Status (1)

Country Link
JP (1) JPH0623012Y2 (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2812976C2 (en) * 1978-03-23 1980-03-06 Erich Ing.(Grad.) 3003 Ronnenberg Luther Method for determining the offset between conductor tracks and contact holes in a circuit board and a circuit board for use in this method

Also Published As

Publication number Publication date
JPH0353862U (en) 1991-05-24

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