JPH02260684A - Printed wiring board - Google Patents

Abstract

PURPOSE:To detect unprocessed parts and processing deviation occurred in an auxiliary cutting processing by a method wherein a conductive pattern, which includes a conductive wire section provided with a non-conductive section in it correspondent to a space between through-holes along a predetermined cut line and contact point sections located in and out of a wiring forming region, is provided. CONSTITUTION:A predetermined cut line 2 on which a cutting auxiliary processing is carried out is provided to one of the sides of a printed wiring board 1 demarcating the side of the wiring forming region of the printed wiring board 1 divided in an after process, and a conductive pattern 3 is provided onto the predetermined cut line 2. The conductive pattern 3 includes the following: a conductive wire section 4 provided with a non-conductive section 40 in it correspondent to a space between through-holes A; contact point sections 5 and 6 located in the wiring forming region at both the ends of the conductive section 4; and contact point sections 7 and 8 located out of the wiring forming region at the both ends of the conductive section 4. The width of the conductive section 4 is set equal to the tolerable deviation in width of a cutting auxiliary processing. By this setup, unprocessed parts and processing deviation occurred in an auxiliary cutting processing can be detected through the check of the electrical continuity of the contact point sections 5, 6, 7, and 8 after division.

Description

Detailed Description of the Invention [Industrial Application Field] The present invention relates to a printed wiring board that is capable of detecting machining omissions and machining deviations in a cutting auxiliary process consisting of through holes provided intermittently on a printed wiring board. It's about the board.

[Conventional technology]

Conventionally, there is a method in which multiple printed wiring boards are formed by dividing a single printed wiring board on which wiring patterns are formed for each of multiple wiring formation areas. There was an idea that the flint substrate could be divided from the removed portion by cutting it with a through hole.

[Problem to be solved by the invention]

In the production of printed wiring boards before division, the process up to the end of the above-mentioned removal process is carried out consistently and automatically, and printed wiring boards with multiple cuts per sheet are also manufactured. This is becoming more and more common.

However, inspection of the presence or absence of removed parts on manufactured printed wiring boards, that is, inspection of machining omissions, has traditionally relied on visual inspection by workers. In the case of products in which parts are cut, it is difficult to check each of the plurality of removed parts, and it may not be possible to reliably remove defective products.

In addition, since the cut position itself determines the quality of each printed wiring board after division, the printed wiring board (
It is necessary to inspect whether the cutting position (before division) is appropriate using a measuring tool such as a caliper, and there is a problem in that product inspection of this printed wiring board is extremely complicated.

Therefore, it has been an issue to be able to reliably correct machining omissions and machining deviations in cutting auxiliary machining.

[Means to solve the problem]

The present invention has been made in consideration of the above-mentioned problems, and includes cutting auxiliary processing consisting of a plurality of through holes, such as a plurality of fixed pitches, which are intermittently provided along a planned cutting line that partitions the inside and outside of a wiring formation area. The printed wiring board is located on the planned cutting line, has a width dimension that corresponds to the allowable deviation width of the cutting auxiliary processing performed along the planned cutting line, and has a non-contact portion corresponding to the space between the through holes. A conductive wire portion having a conductive portion therein, a contact portion located within a wiring formation region of each end of the conductor portion, and a contact portion located outside the wiring formation region of each end of the conductor portion. The present invention provides a printed wiring board characterized by being provided with a pattern, and is provided with a cutting auxiliary process consisting of a plurality of through holes such as a plurality of fixed pitches intermittently provided along a planned cutting line surrounding a wiring forming area. The printed wiring board is located on the planned cutting line for each of the wiring forming regions, and is provided with a width dimension corresponding to an allowable deviation width of a cutting auxiliary process performed along the planned cutting line, and the through-hole separating a conductive wire portion having a non-conducting portion corresponding to a portion between the holes and a conductive wire portion along one side of the wiring formation region;
A conductive pattern having a contact portion located within the wiring formation region of each of the ends of the divided conductor portion, and a contact portion located outside the wiring formation region of each of the ends of the divided conductor portion. The object of the present invention is to provide a printed wiring board characterized by the above, and further to provide a printed wiring board in which conductive patterns are provided on both sides and the contact portions are connected by through holes on both sides, thereby solving the above problems.

[For production]

In the present invention, when a cutting auxiliary line formed by intermittently drilling through holes in the conductive wire portion of the conductive pattern is located (
In other words, the conduction state and disconnection state between the contact portions will change depending on whether the position of the cutting auxiliary line is appropriate (when the position of the cutting auxiliary line is appropriate) or when it has deviated beyond the limit.

(1) In the case of a structure in which the inside and outside of the wiring formation area are partitioned by a single straight conducting wire part, the following applies.

- When the cutting auxiliary line is properly formed, conduction occurs between the contact portions within the wiring formation region and between the contact portions outside the wiring formation region.

- If the cutting auxiliary line shifts inward or outward, the contact parts in the wiring formation area and the contact parts outside the wiring formation area will be disconnected (normal state: conduction).

If the self-cutting auxiliary line leaks, conduction occurs between the contact parts inside and outside the wiring formation area (normal state: disconnection).

(2) In the case where a plurality of wiring formation areas are provided adjacent to each other via conductive wire portions, the following applies.

- When the cutting auxiliary line is properly formed - In each wiring formation area, the contact parts in the wiring formation area are in a conductive state, and the contact parts in the wiring formation area and the wiring formation area adjacent to each other are in a conductive state. There will be a disconnection between the two contacts.

・If any of the cutting auxiliary lines shifts from the conductor part In the wiring formation area surrounded by the conductor part from which the cutting auxiliary line has shifted, if the said line deviates into the wiring formation area, the wiring There is a disconnection between the contact parts in the formation area (normal: conduction). Also, when the line is shifted outward and separated, the contact parts in the wiring formation area will be in a conductive state, but the contact parts inside the wiring formation area on the side where the line has shifted will be in a disconnection state ( Normal: Continuity).

In other words, a disconnection occurs between the contact portions in any of the wiring formation regions.

- If the cutting auxiliary line leaks, conduction occurs between the inner contact portions of adjacent wiring formation regions via the conductor portion where the cutting auxiliary line leaks (normal state: disconnection).

In this way, the continuity state and disconnection state between each contact point are identified according to the state of the cutting auxiliary line, and the detected continuity state and disconnection state between each contact point indicate the state of the cutting auxiliary line. .

〔Example〕

Next, the present invention will be explained in detail based on the embodiments shown in FIGS. 1 to 6.

1 in the figure is a printed wiring board, and in order to be able to divide a plurality of printed wiring boards in one direction from this printed wiring board 1, an auxiliary cutting process is performed by drilling through holes on both the front and back sides at predetermined locations. It is something that will be done. Printed wiring board 1
A planned cutting line 2 on which cutting auxiliary processing is applied is shown on one side of the
is set to partition the sides of the wiring forming area of the printed wiring board that will be divided in a later process, and this planned cutting line 2
A conductive pattern 3 is provided on top.

This conductive pattern 3 includes a conductive wire portion 4 that runs along the above-mentioned planned cutting line 2 and has a non-conductive portion 40 located corresponding to the area between the through holes (the length dimension of the through hole is larger than the width dimension of the conductive wire portion). ), and contact portions 5 and 6 provided in the wiring formation area with the planned cutting line 2 as a border at each end of the conductive wire portion 4.
and contact portions 7 and 8 provided outside the wiring formation area. The width of the conductive wire portion 4 is set to be the same as the allowable deviation width of the auxiliary cutting process (in this embodiment, the contact portion is a through hole).

The printed wiring board 1 having the conductive pattern 3 is subjected to cutting auxiliary processing (through-hole drilling).
The circuit pattern is checked using an inspection device (not shown) that detects terminals corresponding to the contact portions 5, 8, and 7.8 of the circuit pattern and conduction pattern 3 formed in the circuit pattern 3, and cutting auxiliary processing is performed using the conduction pattern. Inspections for machining omissions and machining deviations are performed at the same time.

In the inspection for machining omissions and machining deviations in the above-mentioned cutting auxiliary processing, as shown in FIG. A part of the conductive wire portion 4 remains on both sides of the cutting auxiliary line B, and the contact portions 5.6 and 7.8 in the wiring formation area separated by the cutting auxiliary line B and the contact portions 7 and 8 outside the wiring formation area are respectively There is electrical continuity between the contact portions 5 and 6 and the contact portion 7.8, which are opposed to each other with the cutting auxiliary line B in between, confirming that the auxiliary cutting process has been properly performed.

Further, as shown in Fig. 3, if a part of the cutting auxiliary line B deviates or slopes from the planned cutting line 2 and moves inward, it means that the conductive wire inside the wiring forming area has been cut. Therefore, a disconnection state between the contact portions 5 and 6 is detected, and it is determined that there is a machining deviation.

If it deviates outward, the contact portion 7.8 outside the wiring formation area becomes disconnected, and it is determined that it needs to be processed.

Furthermore, even if the through hole deviates in the direction of the conductive wire portion, conduction occurs between the contact portions inside and outside the wiring forming region, and this can be determined as a defect.

If a through hole is not drilled in any part of the conductive wire portion, conduction will occur between the contact portions 5 and 7 or between the contact portions 6 and 8 inside and outside the wiring formation area, and a short circuit will be detected and a machining omission will occur. It will be judged as.

FIG. 4 shows a printed wiring board 1 in which vertical and horizontal cutting lines 2 are set at a constant pitch and has a plurality of wiring formation areas. The conductive pattern 3 is arranged along the planned cutting line 2 to form a lattice shape, and the wiring formation regions are adjacent to each other via the conductive pattern 3.

In the printed wiring board 1 in which the conductor pattern 3 is arranged in a lattice shape, the contact portions outside the wiring formation region in one wiring formation region are configured as the contact portions in the adjacent wiring formation region.

Printed wiring board 1 having this grid-like conductive pattern 3
After the auxiliary cutting process is performed, the circuit pattern is checked using an inspection device that has terminals that correspond to all the contact points of the circuit pattern and conductive pattern 3 formed on the printed wiring board 1, and the auxiliary cutting process is performed using the conductive pattern. Inspections for machining omissions and machining deviations are performed at the same time.

In the inspection of machining omissions and machining deviations in the above-mentioned cutting auxiliary processing, as shown in FIG. I will explain based on the relationship with.

When the through holes are properly drilled and the cutting auxiliary line B consisting of the lined up through holes is in the proper position, the wiring between the contact parts and adjacent wirings in each wiring forming area partitioned by the cutting auxiliary line B is Conductivity and disconnection between the contact portions of the formation area become as expected.

Between the contact parts conducting: contact part 5atea contact part 5b, 8
Between b-junction points 5C+6c Disconnected contact sections: contact section 5a, 5b-intersection section 5a*5
If a relationship equal to or greater than c is detected between a plurality of wiring formation regions, it is determined that the auxiliary cutting process has been performed appropriately.

Further, as shown in FIG. 6, a part of the cutting auxiliary line B is deviated from or inclined from the planned cutting line 2, and the wiring forming area a
If it is located inward, the conductive wire portion inside the wiring formation area a is cut, so a disconnection state between the contact portions 5a and E3a is detected, and it is determined that processing is necessary. For example, if it deviates to the wiring forming area C side, a disconnection occurs between the contact portions 5c and 60 in the wiring forming area C, and it is determined that processing is required.

That is, if a disconnection is detected between contact portions in any wiring formation region, it is determined that processing is not necessary.

For example, if the cutting auxiliary line leaks between the wiring formation area a and the wiring formation area C, conduction occurs between the contact portions 5a and 5c, and this is detected and determined to be a processing defect.

That is, between the wiring formation areas al bl c, between the contact portions 5a+8a, between the contact portions 5b and 8b, and between the contact portions 5c and (3
It is possible to determine by detection whether there is conduction between C and whether there is a disconnection between contact portions 5a and 5b, and between contact portions 5a+5c. By performing this detection on the side of multiple wiring formation areas C, printing It is possible to judge whether the wiring board is good or bad.

Note that the contact portion does not have to be a simple planar conductive pattern, but may be formed of a through hole. When machining is performed on both sides, the contact portions on both sides or the portions connected thereto in terms of wiring may be connected by through holes so that the positions of the cutting auxiliary lines on both sides can be inspected at the same time.

〔Effect of the invention〕

As explained above, according to the present invention, a printed wiring board to which auxiliary cutting processing for division is performed has a plurality of through holes intermittently provided along a planned cutting line that partitions the inside and outside of a wiring forming area. A printed wiring board to which an auxiliary cutting process is applied, which is located on the planned cutting line and has a width dimension that is an allowable deviation width of the auxiliary cutting process performed along the planned cutting line, A conductor portion having a non-conducting portion therein corresponding to a portion between the through holes, a contact portion located within the wiring formation area of each end of the conductor portion, and a contact portion located outside the wiring formation region of each end of the conductor portion. A printed wiring board which is provided with a conductive pattern having a contact portion located at the wiring formation area, and which is subjected to cutting auxiliary processing consisting of a plurality of through holes provided intermittently along a planned cutting line surrounding a wiring forming area. For each of the wiring formation regions, a width dimension is provided that is located on the planned cutting line, has an allowable deviation width of the cutting auxiliary processing performed along the planned cutting line, and corresponds to the space between the through holes. A conductive wire portion having a non-conducting portion therein and a conductive wire portion along one side of the wiring formation region are separated, and a contact portion located within the wiring formation region of each end of the divided conductor portion is separated. Since the conductive pattern has a contact point located outside the wiring formation area of each end of the conductive wire, the conductive pattern can be used to check for machining deviations and omissions during cutting auxiliary processing at the same time as the circuit pattern. Moreover, it can be molded extremely accurately and does not increase the manufacturing cost of the A-lint wiring board in any way. In addition, since a cutting auxiliary line is provided for the conductive pattern, when inspecting the circuit pattern of the printed wiring board, the conductive state between the contacts of this conductive pattern can be checked at the same time.
Just by inspecting the disconnection state, you can check the machining deviation of cutting auxiliary machining,
Processing omissions can be reliably determined without human intervention. As mentioned above, since the conductive pattern can be formed extremely accurately, it has excellent practical effects, such as reducing the tolerance for deviation and making the shape of the printed wiring board uniform after dividing into 10 parts. It is something that plays.

[Brief explanation of drawings]

FIG. 1 shows an embodiment of a printed wiring board according to the present invention, and is an explanatory diagram showing a conduction pattern before auxiliary cutting processing;
FIG. 2 is an explanatory diagram showing a state in which the cutting auxiliary line is properly provided in one embodiment, FIG. 3 is an explanatory diagram showing a state in which the cutting auxiliary line is deviated in one embodiment, and FIG. 4 is an explanatory diagram showing a state in which the cutting auxiliary line is deviated in one embodiment. An explanatory diagram showing an example, FIG. 5 is an explanatory diagram showing a state in which a cutting auxiliary line is properly provided in another embodiment,
The figure is an explanatory diagram showing a state in which the cutting auxiliary line is shifted in another embodiment. Fig. 1 1...Printed wiring board 2...Planned cutting line 3...Continuity pattern 4...Conducting wire portion 40...Non-conducting Part 5.8.7.8...Contact part 5al E3a, 5bl 8b, 5CI 8C...-
...Contact part A...Through hole B...Cutting auxiliary line a+1)+C...Wiring formation area Fig. 2 Fig. 3

Claims (5)

[Claims] (1) A printed wiring board that is subjected to cutting auxiliary processing consisting of a plurality of through holes provided intermittently along a planned cutting line that partitions the inside and outside of a wiring formation area, the printed wiring board being located on the planned cutting line, a conductive wire portion that has a width dimension that corresponds to the allowable deviation width of the auxiliary cutting process performed along the planned cutting line, and has a non-conducting portion therein that corresponds to a portion between the through holes; and an end of the conductive wire portion. What is claimed is: 1. A printed wiring board comprising: a contact portion located within a wiring formation region of each of the conductive wire portions; and a contact portion located outside the wiring formation region of each end portion of the conductive wire portion. (2) The printed wiring board according to claim 1, wherein the conductive pattern is provided on both sides, and the contact portions are connected by through holes on both sides. (3) A printed wiring board that is subjected to a cutting auxiliary process consisting of a plurality of through holes provided intermittently along a planned cutting line surrounding a wiring formation area, wherein the cutting is performed for each wiring formation area. A conductive wire portion located on the planned cutting line, whose width dimension is the allowable deviation width of the cutting auxiliary processing performed along the planned cutting line, and which has a non-conducting portion therein corresponding to the portion between the through holes. and dividing the conductive wire portion along one side of the wiring formation region, a contact portion located within the wiring formation region of each of the divided ends of the conductor portion, and a contact portion located outside the wiring formation region of each of the divided ends of the conductor portion. A printed wiring board characterized by comprising a contact portion located at , and a conductive pattern having . (4) The wiring formation areas are adjacent to each other via the conductor part, and the contact part located outside the wiring formation area of each divided conductor part end is located inside the wiring formation area adjacent to the wiring formation area. 4. The printed wiring board according to claim 3, wherein the printed wiring board is a contact portion. (5) The printed wiring board according to claim 3 or 4, wherein the conductive pattern is provided on both sides, and the contact portions are connected by through holes on both sides.