JPH02222192A - Wiring pattern for printed board - Google Patents

Abstract

PURPOSE:To check an electric conductive state between lands, and to decide where soldering is defective or nondefective by using the land divided into two or more as one land to one terminal of a component and constituting the wiring pattern of a printed board. CONSTITUTION:A land 1 is divided into two as split lands 1a and 1b, and normal soldering to the land 1 of the terminal 2 of an electronic component is made sure by an electric conductive state between the lands 1a and 1b. Consequently, when the terminal 2 is soldered only to one land 1a due to the displacement of the electronic component, the lands 1a and 1b are not conducted, and defective soldering is decided. Accordingly, defective or nondefective soldering can be decided by checking the electric conductive state between the lands.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wiring path pattern for a printed circuit board for surface mounting.

[Prior art]

Conventionally, in order to mount surface mount components on a printed circuit board, a component mounting land pattern (hereinafter referred to as a land) is used as shown in Figure 5, and creamy solder is applied and heated on this land. The terminal 11 of the component 10 and the land 12 are soldered by the method, but if the component shifts or lifts, especially if the shift or lift is only partial, these defects are treated as soldering defects. It was often undetectable. Those cases are shown in Figure 6 (a
) and Fig. 6(b). First, Fig. 6(
A) shows a state in which the terminal a1 and the land b1 are in contact with each other due to misalignment of the electronic components, and the soldering between the two is insufficient.
Since it is located between the lands b1, even if it is determined to be a good product in the inspection process, there is a risk that a contact failure will occur in a later process or during use of the finished product. FIG. 6(b) shows a state in which the terminal a2 of the electronic component is floating on the land b2, and in this case also, as shown in FIG.
This has the same problem as a).

[Problem that the invention seeks to solve]

As described above, the present invention allows parts to be reliably detected as solder defects even if they are partially displaced or lifted.

[Means for solving problems]

In the present invention, the above-mentioned problem is solved by configuring the wiring path pattern of the printed circuit board by forming a land that is electrically connected to one of the terminals of the component and divided into at least two parts. It is something to do.

[Effect]

In the present invention, the quality of the soldering between the terminal and the land is determined by checking the state of electrical continuity between the divided lands.

〔Example〕

FIG. 1 shows an embodiment of the present invention, in which a land 1 is divided into two parts, a divided land 1a and a divided land 1b, and as shown in the figure, the terminal 2 of an electronic component can be connected to the land 1 normally to avoid soldering injuries. What is done is divided land 1a and divided land 1b.
This is confirmed by the presence of electrical continuity between the two. Figure 2 (a), Figure 2 (b), Figure 3 (a),
FIG. 3(b) is a supplementary explanation of the embodiment of the present invention. First, FIGS. 2(a) and 2(b) show that the terminal 2 of the electronic component is shifted to one side due to misalignment of the electronic component. division land 1
Only the symbol "a" indicates a state in which the solder is damaged, and in this case, it is determined that the soldering is defective based on the fact that there is no electrical continuity between the divided lands 1a and 1b during the inspection. In addition, FIGS. 3(a) and 3(b) show a state in which the terminal 2 of the electronic component is soldered (-1) only to one divided land 1a due to the floating of the electronic component,
This shows a state in which the terminal a2 is floating on the divided land b21, and in this case as well, a defective determination is made in the same way as in the case of a soldering defect due to misalignment. FIG. 4 shows another embodiment of the present invention, and the land 3 is divided into four parts: a divided land 3a, a divided land 3b, a divided land 3c, and a divided land 3d.As shown in the figure, the terminal 4 of the electronic component is connected to the land. 3 and whether soldering (=I) has been performed normally is confirmed by checking whether or not there is electrical continuity between all the divided lands 3a to 3a. Therefore, according to this embodiment, the first The soldering is more severe than the embodiment described above, and it is possible to judge whether the condition is good or bad.

〔Effect of the invention〕

As described above, according to the present invention, the runt portions of the wiring path pattern of a printed circuit board are formed into two or more parts that are insulated from each other, and the electrical continuity between the divided lands is checked. Since the soldering condition between the runts is judged to be good or bad, incomplete soldering caused by misalignment or lifting of components can be reliably detected as defective soldering.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2(a)
,' Fig. 2(b), Fig. 3(a), and Fig. 3(b) are supplementary explanations of the embodiments of the present invention, and Fig. 2(a) is a plan view, and Fig. 2(a) is a plan view. 3(b) is a side sectional view, FIG. 3(a) is a plan view, FIG. 3(b) is a side sectional view, FIG. 4 is a perspective view showing another embodiment of the present invention, and FIG. 6 is a perspective view showing a conventional example, and FIGS. 6(a) and 6(b) are sectional views for explaining the conventional example.

Claims (1)

[Claims] (1) A wiring route pattern of a printed circuit board comprising land portions that are mutually insulated and divided into two or more parts.