JPH07176857A - Electrode connecting structure of printed wiring board - Google Patents

Abstract

PURPOSE:To easily and accurately confirm the propriety of the connecting state between independent electrodes and wiring without making any visual inspection by forming electrically inspectable electrodes to wires which are formed by extending the wires to be electrically connected to the independent electrodes from the electrodes. CONSTITUTION:The electrodes 2 of a first printed wiring board 1 are soldered 7 to the electrodes 4 of a second printed wiring board 3 and the dummy electrodes 2d of the board 1 are soldered 7 to the electrodes 4a and 4b of the board 3. Then resistance values are measured by respectively pressing the probes 10 of an ohmmeter 9 against electrodes 6a and 6b for inspection which are electrically connected to wires extended from the electrodes 4a and 4b and are extended to the second printed wiring board 3 through the through hole 8 of the board 3. Therefore, the propriety of the connecting states of the connecting sections can be confirmed without performing any visual inspection, because it can be judged that the solder-connecting states between dummy electrodes 2d on the first board 1 and the electrodes 4a and 4b on the second board 3 are normal when the measured resistance values are normal.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an electrode connecting portion of a printed wiring board, and more particularly, to a structure of a printed wiring board and another printed wiring board, or a structure of an electrode connecting portion of a printed wiring board and an electronic component. In particular, the connection portion of the connection electrode of the first printed wiring board and the connection electrode of the electronic component, and the connection portion of the connection electrode of the first printed wiring board and the connection electrode of the second printed wiring board The present invention relates to a structure of an electrode connecting portion of a printed wiring board, which enables easy and accurate confirmation of the quality of a connection state without visually inspecting.

[0002]

2. Description of the Related Art Heretofore, there has been a connector plate device reported in, for example, Japanese Patent Laid-Open No. 56-56687, in which a part of a terminal portion on the printed circuit board side which is not first soldered is used. By configuring so that the flexible boards are overlapped and crimped so that the solder is exposed, it is possible to visually check whether solder has flowed out to part of the surface of the terminal part, and to easily check whether soldering is good or bad. It has the advantage that it can be determined.

Further, in the method of soldering a component reported in, for example, Japanese Patent Laid-Open No. 3-35590, an adjusted amount of solder is deposited on the corresponding pad area of the second component, and each hole corresponds. The first component is brought into contact with the solder on the second component so that it is positioned in the pad area, and is configured to melt the solder and heat it so that the fillet spreading through the metallization holes can be observed. This has the advantage that it can be easily inspected and repaired.

Further, for example, in the soldering terminal reported in Japanese Patent Laid-Open No. 4-32166, the width or area of one soldering terminal is made narrower than the width or area of the other soldering terminal. The advantage is that the soldering work can be facilitated and the working time can be shortened. By the way, conventionally, when connecting a printed wiring board and another electronic component or printed wiring boards to each other, wiring 102 and wiring 102 are formed on the first printed wiring board 101 as shown in FIGS. A group of connection electrodes 103 to be connected is formed, solder 104 is applied onto the connection electrodes 103, and leads 106 formed on the electronic component 105 on the connection electrodes 103 coated with the solder 104, or a second printed wiring. The first printed wiring board 101 and the electronic component 105, or the first printed wiring board 101, so that the connection electrodes 108 formed on the board 107 come.
And the second printed wiring board 107 are overlapped, and the connection electrode 103 of the first printed wiring board 101 and the lead 106 of the electronic component 105, or the connection electrode 10 of the first printed wiring board 101.
3 and the connection electrode 108 of the second printed wiring board 107 by soldering 1
Connect by attaching 04. At this time, the first printed wiring board 1
The connection electrode 103 of 01 is one per connection point, and the leads 106 of the other electronic components 105 and the connection electrode 108 of the second printed wiring board 107 are also one per connection point. .

Here, the connection electrode 10 of the first printed wiring board
3 and the lead 106 of the electronic component 105 are connected by soldering 104, the connecting process and the connecting portion structure will be described with reference to FIG. Generally, as shown in FIG. 7, when soldering the first printed wiring board 101 and the electronic component 105 to the solder 104, the connection electrode 10 formed on the first printed wiring board 101 is connected.
3 is pre-printed with the solder paste 104, and the solder 10
4 is printed in advance on the connection electrode 103 and the electronic component 105
The leads 106 formed in the above are overlapped, and the solder 104 is melted by heating to connect the connection electrodes 103 of the first printed wiring board 101 and the leads 106 of the electronic component 105. In such a case, the inspection of whether or not the connection with the solder 104 is surely made is conventionally performed by the first printed wiring board 101.
The quality of the connection state of the connection portion between the connection electrode 103 and the lead 106 of the electronic component 105 is visually determined.

[0006]

As described above, according to the conventional method of inspecting the connection portion, it is determined whether the connection state of the connection electrode 103 of the first printed wiring board 101 and the connection portion of the lead 106 of the electronic component 105 is good or bad. Although it is visually inspected and inspected, in recent years, the connection part has become smaller as the connection part has become finer and higher in density, and as the connection part becomes smaller, As shown in 8, a few leads 1
Since it becomes difficult to visually confirm the floating of 06, there is a problem that it becomes difficult to determine whether or not the soldering connection is surely made.

Next, referring to FIG. 9, the connection process and connection structure when the connection electrode 103 of the first printed wiring board 101 and the connection electrode 108 of the second printed wiring board 107 are connected by soldering 104 will be described. explain. As shown in FIG. 9, both the first and second printed wiring boards 101 and 107 have the connection electrodes 103 and 108 formed on the base material, and the connection electrodes 103 of the first printed wiring board 101 are spared. After the solder 104 is formed, the surfaces of the second printed wiring board 107 on which the connection electrodes 108 are formed are opposed to each other, and the solder 104 is melted by stacking them on top of each other.
The connection electrode 103 of the first printed wiring board 101 and the connection electrode 108 of the second printed wiring board 107 are connected. Also in such a case, the inspection as to whether or not the connection with the solder 104 is surely made is performed in the same manner as described above for the first printed wiring board 1
A method is conceivable in which the quality of the connection state between the connection electrode 103 of No. 01 and the connection portion of the connection electrode 108 of the second printed wiring board 107 is visually determined. However, in this conventional method for inspecting a connection portion, if the connection group electrode 108 is lifted as shown in FIG. 10, the first printed wiring board 1
01 and the second printed wiring board 107 have base materials,
There is a problem that the soldering state of the connection portion cannot be visually confirmed, and the quality of the connection state of the connection portion cannot be determined.

Further, in the conventional soldering apparatus, normally, the conditions such as heating temperature and heating time are set in advance without adjusting the conditions during soldering. When the connection electrode 108 of the second printed wiring board 107 or the lead 106 of the electronic component 105 changes in characteristics, insufficient heating or excessive heating occurs, resulting in unconnected or first
In some cases, the printed wiring board 101 may be burned out, and in such a case, the above-mentioned problems occur remarkably. Similar problems occur in connection methods other than the above, for example, connection using an anisotropic conductive film.

Therefore, according to the present invention, the connection portion of the connection electrode of the first printed wiring board and the connection electrode of the electronic component, and the connection of the connection electrode of the first printed wiring board and the connection electrode of the second printed wiring board. It is an object of the present invention to provide an electrode connecting portion structure of a printed wiring board, which enables easy and accurate confirmation of the quality of the connection state of a portion without visual inspection.

[0010]

The invention according to claim 1 is
In an electrode connecting portion structure of a printed wiring board for electrically connecting a printed wiring board and another printed wiring board, or a printed wiring board and another electronic component, at least a pair of two adjacent electrodes are dummy on one printed wiring board. Electrically connected to the printed wiring board or electronic component facing the printed wiring board electrically connected by the dummy wiring with the two electrodes electrically connected to the two electrodes electrically connected by the dummy wiring. Forming independent electrodes that are electrically connected to each other, forming wirings that are electrically connected to the independent electrodes by extending the independent electrodes, and electrically inspecting the wirings formed by extending the independent electrodes. It is characterized in that a wiring exposed portion or an electrode is formed.

[0011]

According to the first aspect of the present invention, at least one pair of adjacent two electrodes are electrically connected to one printed wiring board by connecting them by dummy wirings, and the two electrodes are electrically connected by the dummy wirings. An independent electrode electrically connected to each of the two electrodes electrically connected by the dummy wiring is formed on a printed wiring board or an electronic component facing the printed wiring board, and wiring electrically connected to the independent electrode. Are extended from the independent electrodes, and wiring exposed portions or electrodes that can be electrically inspected are formed on the wirings extended from the independent electrodes. For this reason, the quality of the connection state between the two electrodes electrically connected in a dummy arrangement and the independent electrode facing the two electrodes depends on the wiring exposed portion of each wiring extended from the independent electrode or this wiring. Utilizing between the electrodes connected to each other, electrical characteristics,
For example, by applying a resistance meter probe between exposed wiring parts or between electrodes, it is possible to determine and confirm whether or not the measured resistance value is within the allowable range. Even if the structure of the connecting portion is difficult to perform visual inspection, it is possible to easily confirm the quality of the connection state of the connecting portion.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a state in which a dummy wiring is formed between two adjacent electrodes on both ends of a first printed wiring board according to an embodiment of the present invention. As shown in FIG. 1, a group of connection electrodes 2 is formed on a first printed wiring board 1 and adjacent two electrodes 2a and 2b on both ends of the first printed wiring board 1 are connected to a dummy wiring 2c.
And connect them electrically to connect the two electrodes 2a and 2b
A large-sized dummy electrode 2d for connection confirmation, which is composed of a dummy wiring 2c for electrically connecting the electrodes 2a and 2b, is formed.

Next, FIG. 2 shows a second embodiment of the present invention.
FIG. 3 is a perspective view showing a state in which wiring is extended to two independent electrodes on both ends of the printed wiring board to form an inspection electrode. As shown in FIG. 2, the electrodes 2a and 2b are dummy wirings 2c.
Second printed circuit board 1 electrically connected to the second printed circuit board 1 facing the first printed wiring board 1
Forming a group of connection electrodes 4 on the printed wiring board 3 and forming two independent electrodes 4a and 4b at positions facing the dummy electrodes 2d at both ends of the first printed wiring board 1 Wirings 5 electrically connected to the wirings 4a and 4b are formed by being extended, and inspection electrodes 6 that can be electrically inspected are formed and electrically connected to the wirings 5, respectively.

Next, FIG. 3 shows the case where the electrodes 4, 4a, 4b of the second printed wiring board 3 are soldered 7 to the connection electrodes 2 and the dummy electrodes 2d of the first printed wiring board 1 shown in FIG. It is sectional drawing which shows a structure. As shown in FIG. 3, the electrodes 2 of the first printed wiring board 1 and the electrodes 4 of the second printed wiring board 3, and the dummy electrodes 2d of the first printed wiring board 1 and the electrodes of the second printed wiring board 3 are shown. Solder 7 is applied to 4a and 4b. And the electrode 4
The inspection electrodes 6 are formed on the second printed wiring board 3 through the through holes 8 of the second printed wiring board 3 while being electrically connected to the wirings 5 extended from a and 4b.
The probe 10 of the resistance meter 9 is applied to a and 6b to measure the resistance value. As a result, if the measured resistance value is normal, the connection state between the dummy electrode 2d of the first printed wiring board 1 and the electrodes 4a and 4b of the second printed wiring board 3 with solder 7 is normal. It is determined that there is a first printed wiring board 1
And the electrodes 2a and the electrodes 4 on both ends of the second printed wiring board 3.
It is determined that a and the connection state between the electrode 2b and the electrode 4b are normal. Then, by using this inspection result as a sampling inspection result, it may be determined that the connection state between the electrodes 2 and 4 at the central portions of the first printed wiring board 1 and the second printed wiring board 3 is also good. From this, by using the connection part structure of the present embodiment, it is possible to confirm the quality of the connection state of the connection part without relying on visual confirmation / inspection.

In the above embodiment, the connecting portion structure of the present invention is adopted at both ends of the first printed wiring board 1 and the second printed wiring board 3, but other portions, for example, the first printed wiring board 1 are used. Even if the connecting portion structure of the present invention is adopted in the central portions of the printed wiring board 1 and the second printed wiring board 3, similar effects can be obtained. However, in general, the breakage of the connecting portion often occurs from both ends of the first printed wiring board 1 and the second printed wiring board 3, so that the first printed wiring board 1 and It is desirable to employ the structure of the present invention at both ends of the second printed wiring board 3. Further, in the above-described embodiment, the wiring 5 extended from the connection electrodes 4a and 4b of the second printed wiring board 3 is connected to the inspection electrode 6, but the probe 10 is applied to the connection electrode of the through hole or other component. The inspection may be carried out in this case, and in this case, it is not necessary to provide the special inspection electrode 6.

In the above embodiment, the case where the electrodes 2a and 2b of the first printed wiring board 1 are electrically connected by connecting the dummy wirings 2c has been described, but the present invention is not limited to this. Instead, for example, as shown in FIG.
The dummy wirings 2c may be formed not only between the two electrodes 2b but also from the two electrodes 2a, 2b so as to be electrically connected to each other. In this case, the same effect as that of the above embodiment can be obtained. .

By the way, when the above method is adopted, the connected dummy electrodes 2d cannot be used as the electrodes for the signal lines, and therefore, when there is a possibility that the area of the electrode group to be connected is increased, the above-mentioned method is used. In the configuration of the connection electrode portion of the embodiment, after the connection and inspection are completed, the dummy wiring 2c connecting the two electrodes 2a and 2b of the dummy electrode 2d of the first printed wiring board 1 is disconnected. According to this method, the divided electrodes 2a and 2b can be used as normal signal line electrodes, respectively, so that the same effect as that of the above embodiment can be obtained without increasing the area of the electrode portion. .

In the above embodiment, the case where the electrode connecting portion for electrically connecting the first printed wiring board 1 and the second printed wiring board 3 is formed has been described, but the present invention is not limited to this. However, the present invention can be applied to a case where an electrode connecting portion for electrically connecting a printed wiring board and another electronic component is configured, and in this case, the same effect as that of the above embodiment can be obtained.

[0019]

According to the present invention, the connection portion of the connection electrode of the first printed wiring board and the connection electrode of the electronic component, and the connection electrode of the first printed wiring board and the connection electrode of the second printed wiring board. There is an effect that it is possible to easily and accurately confirm the quality of the connection state of the connection portion without visual inspection.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state in which a dummy wiring is formed between two adjacent electrodes on both ends of a first printed wiring board according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a state in which a wiring is extended to two adjacent electrodes on both ends of a second printed wiring board according to an embodiment of the present invention to form an inspection electrode.

FIG. 3 is a cross-sectional view showing an electrode connecting portion structure of a printed wiring board according to an embodiment of the present invention.

FIG. 4 is a perspective view showing a state in which two independent electrodes on both ends of the first printed wiring board applicable to the present invention are extended to positions apart from the two electrodes to form dummy wirings for electrical connection.

FIG. 5 is a perspective view showing a structure of a connecting portion between a conventional first printed wiring board and another electronic component.

FIG. 6 is a cross-sectional view showing a structure of a connecting portion between a conventional first printed wiring board and a second printed wiring board.

FIG. 7 is a cross-sectional view showing a good connection state in a connection portion structure between a conventional first printed wiring board and another electronic component.

FIG. 8 is a diagram showing a lead floating state in a conventional connection structure between a first printed wiring board and another electronic component.

FIG. 9 is a cross-sectional view showing a favorable connection state in a conventional connection structure of a first printed wiring board and a second printed wiring board.

FIG. 10 is a diagram showing a lead floating state in a conventional connection structure of a first printed wiring board and a second printed wiring board.

[Explanation of symbols]

 1 First Printed Wiring Board 2, 2a, 2b, 4, 4a, 4b Electrode 2c Dummy Wiring 2d Dummy Electrode 3 Second Printed Wiring Board 5 Wiring 6, 6a, 6b Inspection Electrode 7 Solder 8 Through Hole 9 Resistance Meter 10 probes

Claims (1)

[Claims] 1. In an electrode connecting portion structure of a printed wiring board for electrically connecting a printed wiring board and another printed wiring board or a printed wiring board and another electronic component, at least one pair of adjacent printed wiring boards are adjacent to each other. Electrically connecting the two electrodes with a dummy wiring, and electrically connecting the two electrodes with a dummy wiring to a printed wiring board or an electronic component facing the printed wiring board electrically connected with the dummy wiring. Independent electrodes electrically connected to the two electrodes are formed respectively, and wirings electrically connected to the independent electrodes are respectively extended from the independent electrodes,
An electrode connecting portion structure of a printed wiring board, characterized in that a wiring exposed portion or an electrode that can be electrically inspected is formed on the wiring formed by extending from each of the independent electrodes.