JPH05283840A - Printed board and its inspection - Google Patents

Abstract

PURPOSE:To conduct the test of circuit function simply and surely by separating copper patterns connected to circuit patterns from copper patterns connected to testing lands. CONSTITUTION:The part except the circuit component packaging part of a circuit pattern 4 formed on a main printed board region and joints 9 of copper patterns 6, 7 are coated with solder resist, and cream solder is supplied to the circuit component packaging part of the circuit pattern 4 and the joints 9 so that copper patterns 6 connected to the circuit pattern 4 may make a continuity with copper patterns 7 connected to testing lands 5 by solder 8. After the circuitry is packaged, probing terminals of a prober are brought into contact with testing lands 5 formed on extra-circuit board region 2, thereby testing the state of circuit function to check the state of circuit function. Thereafter, the extra-circuit board region 2 is cut off to constitute the main printed board region 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board for circuit construction incorporated in various electronic devices.
The present invention relates to a printed circuit board provided with a test land on a so-called discarded board and an inspection method thereof.

[0002]

2. Description of the Related Art Conventionally, for example, a television receiver,
In various electronic devices such as radio receivers, printed circuit boards on which a predetermined circuit pattern is formed are often used to mount circuit components.

In recent years, the performance and miniaturization of various electronic devices have advanced, and it is necessary to compactly accommodate many circuits inside the electronic devices. In the above-mentioned printed circuit board, circuits are formed on both sides of the base material. By forming a pattern, the density of the circuit is increased and the printed circuit board is downsized.

On the other hand, in general, when a circuit component is mounted on a printed circuit board, it is necessary to test the input / output and the like using various measuring instruments in order to confirm the operating state of the circuit.

Therefore, conventionally, a printed circuit board provided with a test land in a circuit pattern for connecting circuit components arranged on the printed circuit board is used, and the measuring terminal of the measuring instrument is brought into contact with the test land. I was doing a test. However, the test land is an unnecessary member when the printed circuit board is completed, and forming the test land in the circuit pattern hinders downsizing of the printed circuit board. Furthermore, in order to achieve miniaturization as described above, when a test is performed using a printed circuit board in which a small area of test land is provided on a printed circuit board on which the components are densely arranged, However, the reliability of the measuring terminal when contacting the measuring terminal is not sufficient, and the tip of the measuring terminal may damage the components adjacent to the test land.

Therefore, a print in which the above-described test land is formed in a waste board area formed around the main printed board area as a supporting member of the main printed board area in which a circuit pattern for connecting circuit components is formed. Using the board, contact the measuring terminal of the measuring device with the test land,
Inspection methods for testing are proposed.

The above-mentioned discarded board region is formed as a supporting member in the peripheral portion of the main printed circuit board region for the convenience of the process of solder dipping in the main printed circuit board region where the circuit pattern is formed. The main printed circuit board region can be efficiently processed by holding the discarded printed circuit board region, and is cut and discarded when the main printed circuit board is completed.

That is, in the above inspection method, a test land for testing the operating state of the circuit formed in the main printed circuit board area is formed in the waste board area by a conductive metal, and the test land and the main printed circuit board area. The operating state of the circuit is tested by using a printed circuit board in which the circuit pattern formed in 1) is made conductive by a connection pattern. After testing the operating state of the circuit, the discarded substrate area is cut to obtain a printed circuit board. In this printed circuit board, it is not necessary to form the test lands in the circuit pattern formed in the main printed circuit board area, so that the printed circuit board can be downsized and the area of the test lands can be sufficiently secured. Therefore, the measurement terminals of the measuring device can easily come into contact with each other, and the test can be reliably performed.

[0009]

However, as described above, the test lands for testing the operating state of the circuit formed in the main printed circuit board area are formed of conductive metal in the discarded board area, and the test lands are The following inconvenience occurs in the printed circuit board obtained by conducting the circuit pattern formed in the main printed circuit board area by the connection pattern, testing the operating state of the circuit, and then cutting the discarded board area.

In the printed circuit board, as described above, after the operating state of the circuit formed in the main printed circuit board area is tested, the discarded board area is cut at the cut portion between the main printed circuit board area and the discarded board area. Cutting methods at this time include cutting with a router bit and cutting with shear. In the former, the state of the cut surface is relatively good, but the mass productivity is poor and the production cost is high. In the latter case, the cut surface is in a bad condition, and the cut connection pattern extends due to the ductility of copper and turns up or hangs down, making contact with the connection pattern formed on the other surface, and When mounting, short circuit will occur between circuits on both sides.

In order to prevent such a short circuit, it is conceivable to shift the formation positions of the circuit patterns formed on the front surface and the back surface of the base material. However, as long as the circuit patterns are formed on both surfaces, the short circuit is completely eliminated. It is impossible to prevent, and the area required for circuit pattern formation becomes large,
This hinders the miniaturization of the printed circuit board.

Further, since copper is exposed at the cut portion, corrosion is likely to occur from this portion, shortening the product life of the printed circuit board.

Therefore, the present invention has been proposed in view of the above circumstances, and it is possible to easily and surely perform the test of the operating state of the circuit formed in the main printed circuit board area, and to carry out the test. It is an object of the present invention to provide a printed circuit board and a method for inspecting the printed circuit board, which can easily cut the discarded substrate region after that and does not cause a short circuit between the circuits formed on both surfaces of the printed circuit board after cutting.

[0014]

In order to achieve the above-mentioned object, a printed circuit board according to the present invention has a main printed circuit board area in which a circuit pattern is formed and a waste board area used as a supporting portion of the main printed circuit board area. And a copper pattern connected to a circuit pattern formed in the main printed circuit board area, in a printed circuit board having a test land for testing the operating state of a circuit formed in the main printed circuit board area in the discarded board area. It is characterized in that the copper pattern connected to the test land formed in the abandoned substrate region is divided at the cut portion of the main printed circuit board region and the abandoned substrate region.

Further, in the above-mentioned printed circuit board, the main printed circuit board area in which the circuit pattern is formed and the cut portion of the discarded board area used as a support portion of the main printed circuit board area are formed by V-shaped grooves. It is a feature.

Further, in the inspection method of the present invention, a copper pattern connected to a circuit pattern formed in the main printed circuit board region of the printed circuit board and the main printed circuit board region which is divided at the cut portion of the waste printed circuit board region. The copper patterns connected to the test lands formed in the abandoned board area are connected by solder to test the operating state of the circuit formed in the main printed board area.

[0017]

In the printed circuit board of the present invention, the printed circuit board has a main printed circuit board area on which a circuit pattern is formed and a discarded board area used as a supporting portion of the main printed circuit board area.
In a printed circuit board having a test land for testing the operating state of a circuit formed in the main printed circuit board area in the discarded board area, a copper pattern connected to a circuit pattern formed in the main printed circuit board area and the discarded board area Since the copper pattern connected to the test land formed in is separated at the cutting part of the main printed circuit board area and the discarded board area, after testing the operating state of the circuit formed in the main printed circuit board area, No stress is applied to the circuit when the waste board region is cut, and a short circuit does not occur between the circuits formed on both surfaces of the printed board when the circuit board is mounted on various electronic devices after cutting.

Further, since the main printed circuit board region in which the circuit pattern is formed and the cut portion of the discarded printed circuit board region used as a support portion of the main printed circuit board region are formed by the V-shaped groove, the discarded printed circuit board region is cut. Is simple and the position accuracy of the cutting position is high.

Furthermore, in the inspection method of the present invention,
A copper pattern connected to a circuit pattern formed in the main printed circuit board area and a copper pattern connected to a test land formed in the waste printed circuit board area, which is divided at a cut portion between the main printed circuit board area and the discarded board area. To test the operating state of the circuit formed in the main printed circuit board area by soldering, so that solder can be supplied between the copper patterns that are divided at the same time as the process of solder dipping into the circuit pattern to make the connection. The test can be easily performed, and the test land having a sufficient area can be formed in the discarded substrate region, so that the test can be surely performed. Also, after the test is performed, the waste board area is cut, and the solder in the cut part of the main printed board area is heated again, so that the solder retreats to the position where the copper pattern is cut off, so it is formed on both sides of the printed board. No short circuit will occur between the connected circuits. Furthermore, since the end of the copper pattern is covered with solder, corrosion is unlikely to occur.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments to which the present invention is applied will be described below with reference to the drawings.

Embodiment 1 As shown in FIG. 1, the printed board of this embodiment is divided into a main printed board area 1 and a waste board area 2 by a cutting portion 3, and the cutting portion 3 has a perforation hole 3a. Is formed, and the discarded substrate area 2 is foldable.

Circuit components (not shown) are formed in the main printed circuit board area 1 to connect the circuit components to each other. On the other hand, in the discarded board area 2, a test land 5 is formed. Are formed. A copper pattern 6 is connected at one end 6a to a portion of the circuit pattern 4 formed in the main printed circuit board area 1 where the operation state of the circuit needs to be tested, and the other end 6
b is broken at the cutting portion 3. A copper pattern 7 is connected to the test land 5 formed in the discarded substrate area 2 at one end 7a, and the other end 7b is disconnected at the cutting portion 3.

In order to test the operating state of the circuit formed in the main printed board area of the printed board thus formed, a test was conducted by the following inspection method. First, a portion other than the circuit component mounting portion of the circuit pattern formed in the main printed circuit board area and the connecting portions 9 of the copper patterns 6 and 7 as shown in FIG. Is supplied to the circuit component mounting portion of the circuit pattern 4 and the connecting portion 9, and the copper pattern 6 connected to the circuit pattern 4 and the copper pattern 7 connected to the test land 5 can be electrically conducted by the solder 8. I did it. And after mounting the circuit components,
The operating state of the circuit in the main printed circuit board area 1 was tested by abutting the measuring terminal of a measuring device (not shown) to the test land 5 formed in the discarded substrate area 2, and the operating state of the circuit was confirmed.

After confirming the operating state of the circuit formed in the main printed board area as described above, the discarded board area 2 is broken off as shown in FIG. Obtained. FIG. 4 shows a state of the solder 8a in the vicinity of the cut portion 3 of the main printed circuit board area 1 after the discarded board area 2 is broken. The solder 8a formed on one surface of the main printed circuit board area 1 drooped downward due to its ductility and was in contact with the solder 10 formed on the other surface.

Then, when the solder 8a, 10 is heated again, the solder 8a gathers in the peripheral portion of the copper pattern 6 due to the surface tension of the solder 8a, and the copper formed on the surface (not shown) of the solder 10 also. Gathered around the pattern. That is, as shown in FIG. 5, the solder 8a was formed from the end portion 6b of the copper pattern 6 to the cut portion 3 before heating, but after heating, as shown in FIG.
The solder 8a was accumulated around the end 6b of the copper pattern 6 due to surface tension.

Therefore, in the method for inspecting a printed circuit board according to the present embodiment, since the solder is supplied between the copper patterns and the copper patterns are connected at the same time as the cream solder is supplied to the circuit pattern, the test can be performed easily. It has been confirmed that the test can be performed reliably because the test lands having a sufficient area are formed in the discarded substrate region. Further, in the printed circuit board of this embodiment, when the operating state of the circuit formed in the main printed circuit board area is tested and then the discarded board area is cut, the copper pattern is divided, so that stress is applied to the circuit. In addition, by reheating the solder after cutting, the solder retreats to the position where the copper pattern is divided, so there is no short circuit between the circuits formed on both sides of the printed circuit board after cutting. It was confirmed.

Next, as a comparative example, as shown in FIG. 12, a main printed circuit board area 1 and a waste board area 2 are divided by a cutting section 3, and a perforation hole 3a is formed in the cutting section 3 to form a waste board. The area 2 is foldable, and circuit components are arranged in the main printed circuit board area 1 and a circuit pattern 4 (not shown) for conducting each circuit component is formed. A test land 5 is formed in the connection pattern 11, and a connection pattern 11 is connected at one end 11a to a portion of the circuit pattern 4 that needs to be tested for the operating state of the circuit.
The other end 11b was connected to the test land 5 so that the circuit pattern 4 and the test land 5 were electrically connected to each other.

Also for such a printed circuit board, after the circuit components are mounted, the operating state of the circuit is tested, the operating state of the circuit is confirmed, and then the discarded substrate area 2 is broken off as shown in FIG. A printed circuit board constituted by the main printed circuit board area 1 was obtained. FIG. 14 shows a state of the connection pattern 11 near the cut portion 3 of the main printed circuit board area 1 after the discarded board area 2 is broken. Main printed circuit board area 1
The connection pattern 11 formed on one surface of the copper pattern hangs downward due to its ductility, and the copper pattern 1 formed on the other surface
It was in contact with 2. There is no method of removing the connection pattern 11 as described above, and when it is mounted in various electronic devices in this state, a short circuit occurs between the circuits formed on both surfaces of the printed board.

Embodiment 2 In this embodiment, an example will be described in which the cut portions of the main printed board area and the discarded board area are formed by V-shaped grooves.

Also in the printed circuit board of this embodiment, as in the printed circuit board of the first embodiment, as shown in FIG. 7, the main printed circuit board area 1 in which the circuit pattern 4 is formed and the discard circuit in which the test lands 5 are formed are disposed. The area 2 is divided by the cut portion 13, and the portion of the circuit pattern 4 where the operating state of the circuit needs to be tested has the copper pattern 6
Are connected at one end portion 6a, the other end portion 6b is disconnected at the cutting portion 3, and a copper pattern 7 is provided at one end portion 7a on the test land 5 formed in the discarded substrate area 2.
And the other end portion 7b is disconnected at the cutting portion 3. At this time, in the printed circuit board of the present embodiment, as shown in FIG. 8, the cut portion 13 of the main printed circuit board area 1 and the discarded substrate area 2 is formed by the V-shaped groove 13a, and the cut of the discarded substrate area 2 is performed. Is made easy

Also in the printed circuit board of this embodiment, similar to the printed circuit board of the first embodiment, the copper patterns 6 and 7 are connected by cream solder to make them conductive, and after the circuit components are mounted, the operating state of the circuit is checked. After conducting the test and confirming the operation state of the circuit, as shown in FIG.
Then, a printed circuit board constituted by the main printed circuit board area 1 was obtained. The solder 8a in the vicinity of the cut portion 13 of the main printed circuit board area 1 after the discarding of the discarded board area 2 is
Due to its ductility, it drooped downward and adhered to the cut portion 13 formed by the V-shaped groove 13a, and the solder formed on the other surface also adhered to the V-shaped groove 13a, and both were in contact with each other.

Then, when the solder on both sides is heated again, as shown in FIG. 10, the solder 8a,
With the solder 10 formed on the other surface, the solder 10 receded due to its surface tension and was separated.

Therefore, it has been confirmed that the printed circuit board inspection method of this embodiment can also perform a simple and reliable test as in the first embodiment. Also, when cutting the discarded substrate area, stress is not applied to the circuit, and the solder is divided by reheating the solder after cutting, so that the circuit is formed between the circuits formed on both sides of the printed circuit board after cutting. It was also confirmed that no short circuit occurred.

Embodiment 3 In this embodiment, solder is used to connect a copper pattern connected to a circuit pattern formed in the main printed circuit board area and a copper pattern connected to a test land formed in the discarded board area. An example of the shape of the connecting portion will be described.

As described in the first embodiment, the shape of the connection portion made of solder for connecting the copper pattern connected to the circuit pattern and the copper pattern connected to the test land is coated after the circuit pattern or the like is formed. Determined by solder resist. The solder resist is an insulating film that covers unnecessary portions of soldering, and after forming a circuit pattern or the like, for example, after applying an ink-like photo-curable solder resist, through a mask corresponding to a predetermined pattern. ,
It is formed by exposing, curing, and developing. Therefore, the shape of the connection portion made of solder can be freely determined.

Therefore, as shown in FIG. 11, the shape of the connecting portion 9 made of solder is such that the copper patterns 6, 7 having a square shape, a circular shape, a triangular shape or the like are easily connected by soldering, and the adjacent copper patterns are electrically connected. Any shape is acceptable as long as it is difficult to do. In particular, when the copper patterns are adjacent to each other, it is necessary to increase the interval between the copper patterns to prevent conduction between the adjacent copper patterns.

[0037]

As is apparent from the above description, the printed circuit board of the present invention has the main printed circuit board area in which the circuit pattern is formed and the discarded board area used as a supporting portion of the main printed circuit board area. Then, in a printed circuit board having a test land for testing the operating state of the circuit formed in the main printed circuit board area in the discarded board area, the copper pattern connected to the circuit pattern formed in the main printed circuit board area and the discarded Since the copper pattern connected to the test land formed in the board area is divided at the cut portion between the main printed board area and the discarded board area, the operating state of the circuit formed in the main printed board area was tested. After that, when cutting the discarded substrate area, stress is not applied to the circuit, and the circuit formed on both sides of the substrate after cutting. Since it is no occurring short circuit between, it is possible to obtain a good print board quality.

Further, since the main printed circuit board region where the circuit pattern is formed and the cut portion of the discarded printed circuit board region used as a support portion of the main printed circuit board region are formed by the V-shaped groove, the discarded printed circuit board region is cut. Since it is simple and the positional accuracy of the cutting position is high, it is possible to obtain a printed circuit board with good dimensional accuracy.

Furthermore, in the inspection method of the present invention,
A copper pattern connected to a circuit pattern formed in the main printed circuit board area and a copper pattern connected to a test land formed in the waste printed circuit board area, which is divided at a cut portion between the main printed circuit board area and the discarded board area. Is connected by solder, and in order to test the operating state of the circuit formed in the main printed circuit board area, solder can be supplied between the copper patterns that are divided at the same time as the step of performing a solder dip on the circuit pattern, and connection can be made. The productivity is high because the test can be done easily and the process does not increase. Also,
Since the test lands having a sufficient area are formed in the discarded substrate area, the test can be surely performed.

Further, after the test is conducted, the waste substrate area is cut and heated again, so that the solder retreats to the position where the copper pattern is divided, so that a short circuit occurs between the circuits formed on both sides of the base material. Since it does not occur and the end of the copper pattern is covered with solder, corrosion does not easily occur, it is possible to extend the product life of the printed circuit board and obtain a good quality printed circuit board. You can Further, since the solder after cutting the discarded substrate region is processed by heating, no special processing device is required and the productivity is high.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of a printed circuit board to which the present invention is applied.

FIG. 2 is a plan view showing a state in which a copper pattern connected to a circuit pattern of a printed circuit board to which the present invention is applied and a copper pattern connected to a test land are connected by solder.

FIG. 3 is a plan view showing a state in which a main printed circuit board region and a discarded substrate region of a printed circuit board to which the present invention is applied are cut.

FIG. 4 is a side view showing a state of solder on a cut surface of a main printed circuit board area after cutting a discarded board area of a printed circuit board to which the present invention is applied.

FIG. 5 is a plan view showing a state of solder on the cut surface of the main printed circuit board area after cutting the waste board area of the printed circuit board to which the invention is applied.

FIG. 6 is a plan view showing a state after heating the solder on the cut surface of the main printed circuit board area after cutting the discarded board area of the printed circuit board to which the invention is applied.

FIG. 7 is a plan view showing another example of a printed circuit board to which the present invention is applied.

FIG. 8 is a side view showing another example of the printed circuit board to which the present invention is applied.

FIG. 9 is a plan view showing a state in which a main printed circuit board region and a discarded substrate region are cut in another example of the printed circuit board to which the invention is applied.

FIG. 10 is an enlarged perspective view of an essential part showing a state of solder on a cut surface of the main printed circuit board area after cutting the waste board area in another example of the printed circuit board to which the invention is applied.

FIG. 11 is a plan view showing a shape of a connecting portion that connects a copper pattern connected to a circuit pattern of a printed circuit board to which the present invention is applied and a copper pattern connected to a test land.

FIG. 12 is a plan view showing a conventional printed circuit board having test lands in a discarded substrate area.

FIG. 13 is a plan view showing a state in which a main printed circuit board region and a discarded circuit board region of a conventional printed circuit board having a test land in the discarded circuit board region are cut.

FIG. 14 is a side view showing a state of solder on the cut surface of the main printed circuit board area after cutting the discarded board area of the printed board having the test lands in the conventional discarded board area.

[Explanation of symbols]

 1 ... Main printed circuit board area 2 ... Discarded board area 3 ... Cut section 3a ... Perforation hole 4 ... Circuit pattern 5 ... Test land 6 ...・ Copper pattern 7 ・ ・ ・ ・ Copper pattern 8 ・ ・ ・ ・ ・ ・ Solder 9 ・ ・ ・ ・ Connecting part 13 ・ ・ ・ Cutting part 13a ・ ・ V-shaped groove

Claims (3)

[Claims] 1. A main printed circuit board area on which a circuit pattern is formed, and a discarded board area used as a supporting portion of the main printed circuit board area, and the operating state of a circuit formed in the main printed circuit board area is tested. In a printed circuit board having a test land in the waste board area, a copper pattern connected to a circuit pattern formed in the main printed board area and a copper pattern connected to the test land formed in the waste board area are provided. A printed circuit board, wherein the printed circuit board is divided at a cutting portion between the main printed circuit board area and the discarded board area. 2. The main printed circuit board region in which a circuit pattern is formed and the cut part of the discarded substrate region used as a support part of the main printed circuit board region are formed by V-shaped grooves. The printed circuit board according to 1. 3. A copper pattern connected to a circuit pattern formed in the main printed circuit board region divided at a cutting portion between the main printed circuit board region and the discarded substrate region, and a test land formed in the waste substrate region. 2. The method for inspecting a printed circuit board according to claim 1, wherein the copper patterns to be connected are connected by solder, and the operating state of the circuit formed in the main printed circuit board area is tested.