JPH06148237A - Contact pin for inspection of printed circuit board - Google Patents
Contact pin for inspection of printed circuit boardInfo
- Publication number
- JPH06148237A JPH06148237A JP32249492A JP32249492A JPH06148237A JP H06148237 A JPH06148237 A JP H06148237A JP 32249492 A JP32249492 A JP 32249492A JP 32249492 A JP32249492 A JP 32249492A JP H06148237 A JPH06148237 A JP H06148237A
- Authority
- JP
- Japan
- Prior art keywords
- inspection
- contact
- cylindrical housing
- contact pin
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Measuring Leads Or Probes (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明はプリント配線検査用コ
ンタクトピンに関し、さらに詳しくは、プリント基板へ
の電子部品の実装を量産する場合、電子部品を半田付け
した後に電子部品の実装ミスや半田によるショート、い
わゆる半田ブリッジ等を検査する際に、通常、検査が必
要な箇所に検査機器を含む閉回路を形成するよう複数接
触させて使用されるコンタクトピンに関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact pin for inspecting printed wiring, and more particularly, when mass-mounting electronic components on a printed circuit board, the electronic components may be soldered and then mounted by mistakes or soldering. The present invention relates to a contact pin which is used by making a plurality of contacts so as to form a closed circuit including an inspection device at a place requiring inspection when inspecting a short circuit, a so-called solder bridge or the like.
【０００２】[0002]
【従来の技術】一般にこの種コンタクトピンをプリント
配線の検査用として使用するにあたり、検査対象である
プリント基板は以下のようにして作成されている。ま
ず、両面に信号線であるパターンとこのパターンをこの
取り出し電極部（図示せず）のみを残して被覆するレジ
スト膜とを有するプリント配線板に電子部品を搭載した
後、このプリント配線板をフラックス槽に浸漬してパタ
ーン取り出し電極部を含むプリント配線板の両面にフラ
ックス膜を全面塗布する。これは、以後の工程でプリン
ト配線板に電子部品を半田付けする場合、半田の濡れ性
を良くしてその半田付け性を良好にするためである。続
いて、フラックス膜が塗布されたプリント配線板に余熱
処理を施し、その後、プリント配線板を半田槽に浸漬す
ることで半田付けを行ってプリント基板が作成されてい
る。2. Description of the Related Art Generally, when using a contact pin of this type for inspecting a printed wiring, a printed board to be inspected is prepared as follows. First, an electronic component is mounted on a printed wiring board having a pattern which is a signal line on both surfaces and a resist film which covers this pattern leaving only this extraction electrode portion (not shown), and then the printed wiring board is fluxed. By immersing in a bath, the flux film is applied over the entire surface of both sides of the printed wiring board including the pattern extraction electrode portion. This is to improve the wettability of the solder and the solderability when the electronic component is soldered to the printed wiring board in the subsequent steps. Subsequently, the printed wiring board coated with the flux film is subjected to residual heat treatment, and then the printed wiring board is dipped in a solder bath to be soldered to produce a printed circuit board.
【０００３】このように処理されたプリント基板Ｐで
は、図５に示すように、プリント配線板１に設けたスル
ーホール等の接続孔２に挿入された、例えば、ジャンパ
ー線３が、プリント基板Ｐの半田槽浸漬面１ｂを半田槽
に浸漬することで、接続孔２のの半田槽浸漬面側Ｂ並び
に半田槽非浸漬面側Ａにそれぞれ形成されているパター
ン取り出し電極部と半田５によって接続され、ジャンパ
ー線３とこれらパターンを導通する。In the printed circuit board P processed in this way, as shown in FIG. 5, for example, a jumper wire 3 inserted into a connection hole 2 such as a through hole provided in a printed circuit board 1 is printed circuit board P. By immersing the solder bath dipping surface 1b of No. 2 in the solder bath, the connection 5 is connected to the pattern take-out electrode portion formed on the solder bath dipping surface side B and the solder bath non-immersion surface side A by the solder 5. , The jumper wire 3 and these patterns are conducted.
【０００４】しかし、前述のように、半田付けを行う前
に、パターン取り出し電極部を含むプリント配線板の両
面にフラックス膜を全面塗布するから、半田付けを行っ
ても、図５、図６に示すように、半田５からフラックス
膜が浮く形で、検査箇所である半田５の表面やパターン
取り出し電極部の表面にフラックス膜６が絶縁膜として
存在することになる。そのため、コンタクトピン７のバ
ネ圧でこのフラックス膜６を突き破り、前記検査箇所を
露出させて検査を行っている。しかも、検査の際には、
図２に示すような検査装置に使われているコンタクトピ
ン支持装置Ｓを用いることによって、コンタクトピン７
の針山にプリント基板Ｐを載置して真空引きしたり、又
はコンタクトピン支持装置Ｓに対して上部よりプリント
基板Ｐを押圧することによりプリント基板Ｐをコンタク
トピン支持装置Ｓに押しつけている。However, as described above, since the flux films are entirely applied to both surfaces of the printed wiring board including the pattern extraction electrode portion before the soldering, even if the soldering is performed, the flux films are still shown in FIGS. As shown, the flux film 6 floats from the solder 5, and the flux film 6 exists as an insulating film on the surface of the solder 5 which is the inspection location and the surface of the pattern extraction electrode portion. Therefore, the flux film 6 is pierced by the spring pressure of the contact pin 7 to expose the inspection location for the inspection. Moreover, at the time of inspection,
By using the contact pin supporting device S used in the inspection device as shown in FIG.
The printed circuit board P is pressed against the contact pin support device S by placing the printed circuit board P on the needle ridges and evacuating it, or by pressing the printed circuit board P against the contact pin support device S from above.
【０００５】[0005]
【発明が解決しようとする課題】ところが、従来のコン
タクトピン７はその先端の接触部分の可動ピン７ａの形
状が円錐形状であり、これを頻繁に検査箇所に接触させ
るから、図５に示すように、プリント基板Ｐ側のフラッ
クス膜６からのフラックスが可動ピン７ａに付着し、こ
の付着したフラックス部分６ａが可動ピン７ａから離散
しないで、図６に示すように、可動ピン７ａを再度接触
させることにより、新たにフラックス部分６ｂが生じる
という付着動作が反復されることになる。その結果、可
動ピン７ａに付着したフラックス部分は絶縁膜として働
くから、可動ピン７ａと検査箇所との接触が不確実とな
ってコンタクトピン７が導通不良になり易くなり、検査
不良が発生するおそれがある。そのため、実際の量産体
制では、プリント基板Ｐを１０枚程度検査するたびに可
動ピン７ａを清掃する必要があり、生産性が低下する。However, in the conventional contact pin 7, the movable pin 7a at the contact portion at the tip of the contact pin 7 has a conical shape, which is frequently brought into contact with the inspection location. Therefore, as shown in FIG. Then, the flux from the flux film 6 on the printed board P side adheres to the movable pin 7a, and the adhered flux portion 6a does not separate from the movable pin 7a, but the movable pin 7a is brought into contact again as shown in FIG. As a result, the attaching operation of newly producing the flux portion 6b is repeated. As a result, since the flux portion adhered to the movable pin 7a acts as an insulating film, the contact between the movable pin 7a and the inspection location becomes uncertain, and the contact pin 7 is apt to become defective in conduction, which may cause defective inspection. There is. Therefore, in an actual mass production system, it is necessary to clean the movable pin 7a every time about 10 printed circuit boards P are inspected, which reduces productivity.
【０００６】この発明は、上記問題に鑑みてなしたもの
で、その目的は、簡単な構成で、可動ピンと検査箇所と
の接触を確実なものにできるとともに、生産性を向上で
きるプリント配線検査用コンタクトピンを提供すること
にある。The present invention has been made in view of the above problems, and an object thereof is to make a contact between a movable pin and an inspection point reliable with a simple structure and to improve productivity. Providing contact pins.
【０００７】[0007]
【課題を解決するための手段および作用】上記目的を達
成するために、この発明は、半田の表面やパターン取り
出し電極部の表面等の検査箇所にフラックス膜を絶縁膜
として有するプリント基板をバネ圧でもって前記フラッ
クス膜を突き破り、前記検査箇所を露出させて前記プリ
ント基板の検査を行うプリント配線検査用コンタクトピ
ンにおいて、このコンタクトピンが、円筒ハウジング
と、この円筒ハウジング内に設けられたバネと、前記円
筒ハウジング内に嵌合可能に設けられ前記バネ圧でもっ
て前記フラックス膜を突き破るための可動ピンからな
り、更に、前記可動ピンが、先端に検査箇所と接触する
接触片を有し、かつ、表面に溝を有する回転体からな
り、一方、前記円筒ハウジングが、前記接触片が前記検
査箇所に接触する時に、前記バネ圧でもって前記溝に沿
ってこの接触片を回転案内する突起を内壁に有するプリ
ント配線検査用コンタクトピンである。In order to achieve the above object, the present invention provides a printed circuit board having a flux film as an insulating film at a test location such as the surface of a solder or the surface of a pattern extraction electrode portion. Thus, in the contact pin for a printed wiring inspection that breaks through the flux film and exposes the inspection location to inspect the printed circuit board, the contact pin is a cylindrical housing, and a spring provided in the cylindrical housing, The movable pin is provided so as to be fittable in the cylindrical housing and pierces the flux film by the spring pressure, and further, the movable pin has a contact piece at a tip thereof which comes into contact with an inspection point, and The rotating body has a groove on the surface, while the cylindrical housing, when the contact piece contacts the inspection point, Serial is a printed circuit test contact pin having a projection for rotating guiding the contact piece with the inner wall along the groove with a spring pressure.
【０００８】また、この発明は、別の観点から、半田の
表面やパターン取り出し電極部の表面等の検査箇所にフ
ラックス膜を絶縁膜として有するプリント基板をバネ圧
でもって前記フラックス膜を突き破り、前記検査箇所を
露出させて前記プリント基板の検査を行うプリント配線
検査用コンタクトピンにおいて、このコンタクトピン
が、円筒ハウジングと、この円筒ハウジング内に設けら
れたバネと、前記円筒ハウジング内に嵌合可能に設けら
れ前記バネ圧でもって前記フラックス膜を突き破るため
の可動ピンからなり、更に、前記円筒ハウジングがその
内壁に溝を有し、一方、前記可動ピンが、先端に検査箇
所と接触する接触片を有し、かつ、前記接触片が前記検
査箇所に接触する時に、前記バネ圧でもって前記溝に沿
ってこの接触片を回転案内する突起を表面に有する回転
体からなるプリント配線検査用コンタクトピンを提供す
る。Further, according to another aspect of the present invention, a printed circuit board having a flux film as an insulating film at an inspection location such as a surface of a solder or a surface of a pattern extracting electrode portion is pierced through the flux film by spring pressure, In a printed wiring inspection contact pin for inspecting the printed circuit board by exposing an inspection location, the contact pin can be fitted into the cylindrical housing, a spring provided in the cylindrical housing, and the cylindrical housing. The movable housing is provided with a movable pin for breaking through the flux film by the spring pressure, and further, the cylindrical housing has a groove on its inner wall, while the movable pin has a contact piece at the tip which contacts an inspection point. And when the contact piece comes into contact with the inspection location, the contact piece is rotated along the groove by the spring pressure. Providing a printed wiring inspection contact pin comprising a rotating member having a guide protruding to the surface.
【０００９】この発明は、コンタクトピンの可動ピンあ
るいは円筒ハウジングに溝を設け、可動ピンが検査箇所
に接触する時に、可動ピンが押し下げられ、この可動ピ
ンが押し下げられる時に、可動ピンが溝に沿って回転
し、この回転力で接触片がプリント基板上のフラックス
膜を押し退けながら検査箇所に接触することから、従
来、フラックスが可動ピンに付着し、この付着したフラ
ックス部分が可動ピンから離散しないで、可動ピンを再
度接触させることにより、新たにフラックス部分が生じ
るという付着動作が反復されることになるのを回避で
き、その結果、可動ピンと検査箇所との接触が確実とな
ってコンタクトピンが導通不良になるのを防止でき、検
査不良の発生をなくすことができる。そのため、実際の
量産体制でも、プリント基板を１０枚程度検査するたび
に可動ピンを清掃するという必要性が皆無となり、生産
性を向上できる。According to the present invention, the movable pin of the contact pin or the cylindrical housing is provided with a groove, the movable pin is pushed down when the movable pin comes into contact with the inspection point, and the movable pin follows the groove when the movable pin is pushed down. Since the contact piece contacts the inspection location while pushing away the flux film on the printed circuit board by this rotating force, flux has conventionally adhered to the movable pin, and the adhered flux portion does not separate from the movable pin. By contacting the movable pin again, it is possible to avoid repeating the adhesion operation that a new flux portion is generated, and as a result, contact between the movable pin and the inspection point is ensured and the contact pin becomes conductive. It is possible to prevent the occurrence of defects and eliminate the occurrence of inspection defects. Therefore, even in the actual mass production system, there is no need to clean the movable pin every time about 10 printed circuit boards are inspected, and the productivity can be improved.
【００１０】[0010]
【実施例】以下、この発明の実施例を、図面に基づいて
説明する。なお、この発明はそれによって限定を受ける
ものではない。なお、図５、図６と同一符号は同一また
は同一相当物である。図１はこの発明の第１の実施例を
示す。図１、図２において、プリント配線検査用コンタ
クトピン１１は、半田５の表面やパターン取り出し電極
部の表面等の検査箇所にフラックス膜６を絶縁膜として
有するプリント基板Ｐをバネ圧でもってフラックス膜６
を突き破り、検査箇所を露出させてプリント基板Ｐの検
査を行うためのものであって、このコンタクトピン１１
が、円筒ハウジング（その材料は、例えば、Ｐｂであ
る）１２と、この円筒ハウジング内に設けられたバネ
（その材料は、例えば、ＳＷＰ：ピアノ線である）１３
と、円筒ハウジング１２内に嵌合可能に設けられバネ圧
でもってフラックス膜６を突き破るための可動ピン（そ
の材料は、例えば、ＳＫ材：炭素工具鋼鋼材、またはベ
リリューム鋼である）１４から主としてなる。Embodiments of the present invention will be described below with reference to the drawings. Note that the present invention is not limited thereby. The same reference numerals as those in FIGS. 5 and 6 are the same or the same. FIG. 1 shows a first embodiment of the present invention. In FIG. 1 and FIG. 2, the printed wiring inspection contact pin 11 includes a printed circuit board P having a flux film 6 as an insulating film at the inspection location such as the surface of the solder 5 or the surface of the pattern extraction electrode portion by a spring pressure. 6
The contact pin 11 is used for inspecting the printed circuit board P by piercing through
However, a cylindrical housing (the material is Pb, for example) 12 and a spring (the material is SWP: piano wire, for example) 13 provided in the cylindrical housing 13
And a movable pin (which is, for example, SK material: carbon tool steel steel material, or beryllium steel) 14 which is provided in the cylindrical housing 12 so as to be fittable and which breaks through the flux film 6 by spring pressure. Become.
【００１１】更に、可動ピン１４が、先端１４ａに検査
箇所と接触する接触片１５を有し、かつ、その表面に溝
１６を有する回転体１７からなり、一方、円筒ハウジン
グ１２が、接触片１５が検査箇所に接触する時に、バネ
圧でもって溝１６に沿ってこの接触片１５を回転案内す
る突起１８を内壁に有する。Further, the movable pin 14 has a contact piece 15 at the tip 14a which comes into contact with the inspection point, and a rotary body 17 having a groove 16 on its surface, while the cylindrical housing 12 has a contact piece 15 thereon. Has a protrusion 18 on its inner wall that guides the contact piece 15 to rotate along the groove 16 by the spring pressure when it contacts the inspection point.
【００１２】また、回転体１７の溝１６が、その長手方
向に沿って螺旋状に形成されており、接触片１５が円錐
状に形成されている。このため、可動ピン１４が押し下
げられる時に、可動ピン１４が溝１６に沿って一方向に
回転する。なお、回転体１７の溝１６をその長手方向に
沿ってジグザグ状に形成し、可動ピン１４を溝１６に沿
って往復移動回転させても良い。Further, the groove 16 of the rotating body 17 is formed in a spiral shape along its longitudinal direction, and the contact piece 15 is formed in a conical shape. Therefore, when the movable pin 14 is pushed down, the movable pin 14 rotates in one direction along the groove 16. The groove 16 of the rotating body 17 may be formed in a zigzag shape along the longitudinal direction, and the movable pin 14 may be reciprocally moved and rotated along the groove 16.
【００１３】この実施例のものは上記構成を有するか
ら、可動ピン１４が検査箇所に接触する時に、可動ピン
１４が押し下げられ、この可動ピン１４が押し下げられ
る時に、可動ピン１４が溝１６に沿って回転し、この回
転力で接触片１５がプリント基板Ｐ上のフラックス膜６
を押し退けながら検査箇所に接触する。Since this embodiment has the above-mentioned structure, the movable pin 14 is pushed down when the movable pin 14 comes into contact with the inspection point, and when the movable pin 14 is pushed down, the movable pin 14 follows the groove 16. The contact piece 15 is caused to rotate by the rotation of the flux film 6 on the printed circuit board P.
Touch the inspection point while pushing away.
【００１４】このように本実施例では、簡単な構成で、
可動ピンと検査箇所との接触を確実なものにでき、抵抗
値等のチェック誤差を減少できる。As described above, in this embodiment, with a simple structure,
The contact between the movable pin and the inspection point can be ensured, and the check error such as the resistance value can be reduced.
【００１５】図３は、接触片２５が、略円錐状で、その
円錐形部分の先端の平坦部分２６からその長手方向に向
かって更に円錐状の小突起２７が形成されているこの発
明の第２の実施例を示す。In FIG. 3, the contact piece 25 has a substantially conical shape, and a small projection 27 having a conical shape is further formed from the flat portion 26 at the tip of the conical portion toward the longitudinal direction thereof. 2 shows an example.
【００１６】また、図４は、接触片３５が、円錐状で、
その円錐形部分３６の先端が鋸歯形状の接触部分３７に
形成されてなるこの発明の第３の実施例を示す。Further, in FIG. 4, the contact piece 35 has a conical shape,
A third embodiment of the present invention is shown in which the tip of the conical portion 36 is formed in a sawtooth-shaped contact portion 37.
【００１７】これら第２、第３の各実施例では、接触片
２５，３５にそれぞれ可動ピン１４の回転力で接触片が
プリント基板上のフラックス膜を押し退け易くできると
いう工夫を凝らしているので、可動ピンと検査箇所との
接触を更に確実なものにできる利点を有する。In each of the second and third embodiments, the contact pieces 25 and 35 are devised so that the contact pieces can easily push away the flux film on the printed circuit board by the rotational force of the movable pin 14. There is an advantage that the contact between the movable pin and the inspection point can be made more reliable.
【００１８】更に、コンタクトピンが、円筒ハウジング
と、この円筒ハウジング内に設けられたバネと、前記円
筒ハウジング内に嵌合可能に設けられ前記バネ圧でもっ
て前記フラックス膜を突き破るための可動ピンからな
り、更に、前記円筒ハウジングがその内壁に溝を有し、
一方、前記可動ピンが、先端に検査箇所と接触する接触
片を有し、かつ、前記接触片が前記検査箇所に接触する
時に、前記バネ圧でもって前記溝に沿ってこの接触片を
回転案内する突起を表面に有する回転体からなるコンタ
クトピンを用いても、上記第１〜３の各実施例と同様の
作用効果を奏することは明らかである。この際、可動ピ
ンに回転力を付与するために、円筒ハウジングの溝が、
その長手方向に沿って螺旋状に形成されたり、ジグザグ
状に形成されているのが好ましい。また、接触片とし
て、第２、第３の各実施例のものを使用すれば、可動ピ
ンと検査箇所との接触を更に確実なものにできる利点を
有する。Further, the contact pin includes a cylindrical housing, a spring provided in the cylindrical housing, and a movable pin which is provided in the cylindrical housing so that the contact pin can be fitted with the movable pin to break through the flux film by the spring pressure. Furthermore, the cylindrical housing has a groove on its inner wall,
On the other hand, the movable pin has a contact piece at the tip that contacts the inspection point, and when the contact piece contacts the inspection point, the contact piece is rotated and guided along the groove by the spring pressure. It is clear that even if a contact pin made of a rotating body having a protrusion on its surface is used, the same effect as that of each of the first to third embodiments can be obtained. At this time, in order to apply a rotational force to the movable pin, the groove of the cylindrical housing is
It is preferably formed in a spiral shape or a zigzag shape along the longitudinal direction. Further, if the contact pieces of the second and third embodiments are used, there is an advantage that the contact between the movable pin and the inspection location can be made more reliable.
【００１９】[0019]
【発明の効果】以上説明したように、この発明では、コ
ンタクトピンの可動ピンあるいは円筒ハウジングに溝を
設け、可動ピンが検査箇所に接触する時に、可動ピンが
押し下げられ、この可動ピンが押し下げられる時に、可
動ピンが溝に沿って回転し、この回転力で接触片がプリ
ント基板上のフラックス膜を押し退けながら検査箇所に
接触することから、従来、フラックスが可動ピンに付着
し、この付着したフラックス部分が可動ピンから離散し
ないで、可動ピンを再度接触させることにより、新たに
フラックス部分が生じるという付着動作が反復されるこ
とになるのを回避でき、その結果、可動ピンと検査箇所
との接触が確実となってコンタクトピンが導通不良にな
るのを防止でき、検査不良の発生をなくすことができ
る。そのため、実際の量産体制でも、プリント基板を１
０枚程度検査するたびに可動ピンを清掃するという必要
性が皆無となり、生産性を向上できる。As described above, according to the present invention, the movable pin of the contact pin or the cylindrical housing is provided with the groove, and when the movable pin comes into contact with the inspection location, the movable pin is pushed down and the movable pin is pushed down. At this time, the movable pin rotates along the groove, and this rotating force causes the contact piece to come into contact with the inspection location while pushing away the flux film on the printed circuit board. By re-contacting the movable pin without separating the part from the movable pin, it is possible to avoid repeating the adhesion operation in which a new flux part is generated, and as a result, the contact between the movable pin and the inspection point is prevented. It is possible to prevent the contact pin from becoming defective in conduction and to prevent the occurrence of defective inspection. Therefore, even in the actual mass production system
There is no need to clean the movable pin every time 0 sheets are inspected, and productivity can be improved.
【図１】この発明の第１の実施例を示す構成説明図であ
る。FIG. 1 is a structural explanatory view showing a first embodiment of the present invention.
【図２】上記実施例における検査時を示す全体構成説明
図である。FIG. 2 is an explanatory diagram of the overall configuration showing a time of inspection in the above embodiment.
【図３】この発明の第２の実施例を示す要部構成説明図
である。FIG. 3 is an explanatory diagram of a main part configuration showing a second embodiment of the present invention.
【図４】この発明の第３の実施例を示す要部構成説明図
である。FIG. 4 is an explanatory diagram of a main part configuration showing a third embodiment of the present invention.
【図５】従来の検査状態の１つを示す要部構成説明図で
ある。FIG. 5 is an explanatory diagram of a main part configuration showing one of conventional inspection states.
【図６】従来の検査状態のもう１つを示す要部構成説明
図である。FIG. 6 is an explanatory diagram of a main part configuration showing another conventional inspection state.
５…半田、１１…コンタクトピン、１２…円筒ハウジン
グ、１３…バネ、１４…可動ピン、１５…接触片、１６
…溝、１７…回転体、１８…突起、Ｐ…プリント基板。5 ... Solder, 11 ... Contact pin, 12 ... Cylindrical housing, 13 ... Spring, 14 ... Movable pin, 15 ... Contact piece, 16
... Groove, 17 ... Rotating body, 18 ... Protrusion, P ... Printed circuit board.
Claims (9)
表面等の検査箇所にフラックス膜を絶縁膜として有する
プリント基板をバネ圧でもって前記フラックス膜を突き
破り、前記検査箇所を露出させて前記プリント基板の検
査を行うプリント配線検査用コンタクトピンにおいて、
このコンタクトピンが、円筒ハウジングと、この円筒ハ
ウジング内に設けられたバネと、前記円筒ハウジング内
に嵌合可能に設けられ前記バネ圧でもって前記フラック
ス膜を突き破るための可動ピンからなり、更に、前記可
動ピンが、先端に検査箇所と接触する接触片を有し、か
つ、表面に溝を有する回転体からなり、一方、前記円筒
ハウジングが、前記接触片が前記検査箇所に接触する時
に、前記バネ圧でもって前記溝に沿ってこの接触片を回
転案内する突起を内壁に有するプリント配線検査用コン
タクトピン。1. A printed circuit board having a flux film as an insulating film at a test location such as a surface of a solder or a surface of a pattern taking-out electrode portion is pierced through the flux film by spring pressure to expose the test location to expose the printed circuit board. In the contact pin for printed wiring inspection that performs the inspection of
The contact pin includes a cylindrical housing, a spring provided in the cylindrical housing, and a movable pin that is provided in the cylindrical housing so as to be capable of being fitted to break through the flux film by the spring pressure. The movable pin has a contact piece at the tip that comes into contact with the inspection point, and comprises a rotating body having a groove on the surface, while the cylindrical housing, when the contact piece comes into contact with the inspection point, A contact pin for inspecting a printed wiring, which has a protrusion on its inner wall for rotating and guiding the contact piece along the groove by spring pressure.
旋状に形成されている請求項１に記載のプリント配線検
査用コンタクトピン。2. The contact pin for printed wiring inspection according to claim 1, wherein the groove of the rotating body is formed in a spiral shape along the longitudinal direction thereof.
グザグ状に形成されている請求項１に記載のプリント配
線検査用コンタクトピン。3. The printed wiring inspection contact pin according to claim 1, wherein the groove of the rotating body is formed in a zigzag shape along the longitudinal direction thereof.
表面等の検査箇所にフラックス膜を絶縁膜として有する
プリント基板をバネ圧でもって前記フラックス膜を突き
破り、前記検査箇所を露出させて前記プリント基板の検
査を行うプリント配線検査用コンタクトピンにおいて、
このコンタクトピンが、円筒ハウジングと、この円筒ハ
ウジング内に設けられたバネと、前記円筒ハウジング内
に嵌合可能に設けられ前記バネ圧でもって前記フラック
ス膜を突き破るための可動ピンからなり、更に、前記円
筒ハウジングがその内壁に溝を有し、一方、前記可動ピ
ンが、先端に検査箇所と接触する接触片を有し、かつ、
前記接触片が前記検査箇所に接触する時に、前記バネ圧
でもって前記溝に沿ってこの接触片を回転案内する突起
を表面に有する回転体からなるプリント配線検査用コン
タクトピン。4. A printed circuit board having a flux film as an insulating film at an inspection location such as a surface of a solder or a surface of a pattern extraction electrode portion is pierced through the flux film by spring pressure to expose the inspection location to expose the printed circuit board. In the contact pin for printed wiring inspection that performs the inspection of
The contact pin includes a cylindrical housing, a spring provided in the cylindrical housing, and a movable pin that is provided in the cylindrical housing so as to be fittable therein and that pierces the flux film by the spring pressure. The cylindrical housing has a groove on its inner wall, while the movable pin has a contact piece at the tip that contacts an inspection point, and
A contact pin for printed wiring inspection, which comprises a rotating body having a protrusion on its surface for guiding the contact piece along the groove by the spring pressure when the contact piece contacts the inspection location.
沿って螺旋状に形成されている請求項４に記載のプリン
ト配線検査用コンタクトピン。5. The printed wiring inspection contact pin according to claim 4, wherein the groove of the cylindrical housing is formed in a spiral shape along the longitudinal direction thereof.
沿ってジグザグ状に形成されている請求項４に記載のプ
リント配線検査用コンタクトピン。6. The contact pin for printed wiring inspection according to claim 4, wherein the groove of the cylindrical housing is formed in a zigzag shape along the longitudinal direction thereof.
１または請求項４に記載のプリント配線検査用コンタク
トピン。7. The contact pin for printed wiring inspection according to claim 1, wherein the contact piece is formed in a conical shape.
の先端の平坦部分からその長手方向に向かって更に円錐
状の小突起を有する請求項１または請求項４に記載のプ
リント配線検査用コンタクトピン。8. The printed wiring according to claim 1, wherein the contact piece has a substantially conical shape, and further has a conical small projection from the flat portion at the tip of the conical portion toward the longitudinal direction thereof. Contact pin for inspection.
先端が鋸歯形状に形成されてなる請求項１または請求項
４に記載のプリント配線検査用コンタクトピン。9. The contact pin for printed wiring inspection according to claim 1, wherein the contact piece is conical, and the tip of the conical portion is formed in a sawtooth shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32249492A JPH06148237A (en) | 1992-11-07 | 1992-11-07 | Contact pin for inspection of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32249492A JPH06148237A (en) | 1992-11-07 | 1992-11-07 | Contact pin for inspection of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06148237A true JPH06148237A (en) | 1994-05-27 |
Family
ID=18144273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32249492A Pending JPH06148237A (en) | 1992-11-07 | 1992-11-07 | Contact pin for inspection of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06148237A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006139175A (en) * | 2004-11-15 | 2006-06-01 | Toppan Printing Co Ltd | Front surface plate inspecting probe contact mechanism in electrophoresis display |
| KR100647131B1 (en) * | 2005-07-12 | 2006-11-23 | 리노공업주식회사 | probe and manufacturing method thereof |
| JP2008039639A (en) * | 2006-08-08 | 2008-02-21 | Hioki Ee Corp | Measurement probe of contact type |
| JP2011027549A (en) * | 2009-07-24 | 2011-02-10 | Sumitomo Electric Ind Ltd | Contact probe and method for manufacturing the same |
| JP2016180746A (en) * | 2015-03-24 | 2016-10-13 | 三菱電機株式会社 | Coaxial probe |
-
1992
- 1992-11-07 JP JP32249492A patent/JPH06148237A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006139175A (en) * | 2004-11-15 | 2006-06-01 | Toppan Printing Co Ltd | Front surface plate inspecting probe contact mechanism in electrophoresis display |
| KR100647131B1 (en) * | 2005-07-12 | 2006-11-23 | 리노공업주식회사 | probe and manufacturing method thereof |
| JP2008039639A (en) * | 2006-08-08 | 2008-02-21 | Hioki Ee Corp | Measurement probe of contact type |
| JP2011027549A (en) * | 2009-07-24 | 2011-02-10 | Sumitomo Electric Ind Ltd | Contact probe and method for manufacturing the same |
| JP2016180746A (en) * | 2015-03-24 | 2016-10-13 | 三菱電機株式会社 | Coaxial probe |
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