JPH01321684A - Manufacture of circuit board - Google Patents
Manufacture of circuit boardInfo
- Publication number
- JPH01321684A JPH01321684A JP15611188A JP15611188A JPH01321684A JP H01321684 A JPH01321684 A JP H01321684A JP 15611188 A JP15611188 A JP 15611188A JP 15611188 A JP15611188 A JP 15611188A JP H01321684 A JPH01321684 A JP H01321684A
- Authority
- JP
- Japan
- Prior art keywords
- opening section
- electrodes
- soldering
- electric part
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000005476 soldering Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 4
- 238000007689 inspection Methods 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- 239000006071 cream Substances 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント板に電気部品を固定じな回路基板の製
造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a circuit board in which electrical components are fixed to a printed board.
従来のこの種の回路基板は、プリント板の接続用パッド
上に、抵抗やコンデンサ等の電気部品の電極を重ね合わ
せその間をはんだ付けして形成されており、この方法は
一般的には表面実装技術として確立されている。Conventionally, this type of circuit board is formed by stacking the electrodes of electrical components such as resistors and capacitors on connection pads of a printed board and soldering them between them.This method is generally used for surface mounting. It is an established technology.
上述した従来の回路基板の製造方法では、電気部品の電
極をプリント板のパッド上に精度良く位置合わせするこ
とが困難であり、実際には自動装着機を用いなけれはな
らないため設備に費用がかかる・という欠点がある。更
にはんだ付けに対する迅速な検査方法が確立されていな
いために、信頼性を向上させることができないという欠
点もある。In the conventional circuit board manufacturing method described above, it is difficult to accurately align the electrodes of electrical components onto the pads of the printed board, and in practice, an automatic mounting machine must be used, which increases equipment costs.・There is a drawback. Furthermore, since a rapid inspection method for soldering has not been established, there is also the drawback that reliability cannot be improved.
本発明の回路基板の製造方法は、テーパーを有する開口
部の周囲に円形状のパッドが形成されたプリント基板の
該開口部に、円錐台形のボディとその上面部及び下面部
に一対の電極が設けられた電気部品を挿入し、前記パッ
ドと電極とをはんだ付けするものである。In the method for manufacturing a circuit board of the present invention, a truncated conical body and a pair of electrodes are provided on the upper and lower surfaces of a tapered opening of a printed circuit board in which a circular pad is formed around the opening. The provided electrical components are inserted and the pads and electrodes are soldered.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図は本発明の一実施例を説明するための回路基板の
斜視図である。FIG. 1 is a perspective view of a circuit board for explaining one embodiment of the present invention.
第1図において、プリント板1には部品実装用の開口部
2をテーパー状に形成し、その周囲に円形状のパッド6
を設けである。実装用の電気部品3のボディーも円錐台
形とし、その上面部及び下面部に電極4を形成しておく
。ボディーの長さはプリント板1の板厚より少し大きく
しておき、実装後電極4がプリント板表面及び裏面より
わずかに突き出しな状態になるようにする。電気部品3
を開口部2に挿入後、裏表で2回デイツプはんだ付けす
るか、クリームはんだを使用してリフローはんだ付けを
行なって、はんだ5によりパッド6と電極4とを接続す
る。In FIG. 1, a printed board 1 has a tapered opening 2 for mounting components, and a circular pad 6 is formed around the opening 2.
This is provided. The body of the electrical component 3 for mounting is also shaped like a truncated cone, and electrodes 4 are formed on its upper and lower surfaces. The length of the body is made slightly larger than the thickness of the printed board 1 so that the electrodes 4 will not protrude slightly from the front and back surfaces of the printed board after mounting. Electrical parts 3
After inserting the pad into the opening 2, the pad 6 and the electrode 4 are connected with the solder 5 by dip soldering twice on the front and back sides, or by reflow soldering using cream solder.
このように本実施例によれば、開口部2がテーパー状に
形成されているため、円錐台形の電気部品3の極性は明
確となり、プリント板の開口部2への挿入は極めて容易
である。また、はんだ付は後の検査も自動検査装置の使
用が可能であるため容易である。As described above, according to this embodiment, since the opening 2 is formed in a tapered shape, the polarity of the truncated cone-shaped electrical component 3 is clear, and insertion of the printed board into the opening 2 is extremely easy. Furthermore, soldering is easy because an automatic inspection device can be used for subsequent inspection.
〔発明の効果〕
以上説明したように本発明によれば、プリント板に形成
されたテーパーを有する開口部に、円錐台形のボディと
その上下面部に電極を有する電気部品を挿入し、開口部
周囲の円形状のパッドと電極とをはんだ付けすることに
より、電気部品の位置合せが容易で、その搭載位置精度
の許容が大きい為、安価な装着機を用いることができ、
かつはんだ付けの検査が容易な回路基板を製造すること
ができる。[Effects of the Invention] As explained above, according to the present invention, an electric component having a truncated conical body and electrodes on the upper and lower surfaces thereof is inserted into a tapered opening formed in a printed board, and By soldering the circular pads and electrodes, it is easy to align the electrical components, and since the tolerance for mounting position accuracy is high, an inexpensive mounting machine can be used.
Moreover, a circuit board whose soldering is easily inspected can be manufactured.
第1図は本発明の一実施例を説明するための回路基板の
斜視図である。
1・・・プリント板、2・・・開口部、3・・・電気部
品、4・・・電極、5・・・はんだ、6・・・パッド。FIG. 1 is a perspective view of a circuit board for explaining one embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Printed board, 2... Opening, 3... Electrical component, 4... Electrode, 5... Solder, 6... Pad.
Claims (1)
されたプリント板の該開口部に、円錐台形のボディとそ
の上面部及び下面部に一対の電極が設けられた電気部品
を挿入し、前記パッドと電極とをはんだ付けすることを
特徴とする回路基板の製造方法。An electric component having a truncated conical body and a pair of electrodes provided on its upper and lower surfaces is inserted into the opening of a printed circuit board in which a circular pad is formed around the tapered opening, and A method for manufacturing a circuit board, characterized by soldering pads and electrodes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15611188A JPH01321684A (en) | 1988-06-23 | 1988-06-23 | Manufacture of circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15611188A JPH01321684A (en) | 1988-06-23 | 1988-06-23 | Manufacture of circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01321684A true JPH01321684A (en) | 1989-12-27 |
Family
ID=15620552
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15611188A Pending JPH01321684A (en) | 1988-06-23 | 1988-06-23 | Manufacture of circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01321684A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05218615A (en) * | 1992-02-03 | 1993-08-27 | Nec Corp | Printed-circuit board with built-in capacitor |
JP2005302854A (en) * | 2004-04-08 | 2005-10-27 | Fujikura Ltd | Double-sided board with built-in components, double-sided wiring board with built-in components, and its manufacturing method |
JP2006302851A (en) * | 2005-03-23 | 2006-11-02 | Kyocera Corp | Ceramic container, and battery using this, or electric double layer capacitor, and electric circuit board |
-
1988
- 1988-06-23 JP JP15611188A patent/JPH01321684A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05218615A (en) * | 1992-02-03 | 1993-08-27 | Nec Corp | Printed-circuit board with built-in capacitor |
JP2005302854A (en) * | 2004-04-08 | 2005-10-27 | Fujikura Ltd | Double-sided board with built-in components, double-sided wiring board with built-in components, and its manufacturing method |
JP2006302851A (en) * | 2005-03-23 | 2006-11-02 | Kyocera Corp | Ceramic container, and battery using this, or electric double layer capacitor, and electric circuit board |
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