JPS6324453Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention particularly relates to a device for measuring the characteristics of a mini-mold type semiconductor device that is small and lightweight.

As electronic components have become smaller and lighter in recent years, mini-mold type semiconductor devices such as transistors and IC devices are increasingly being adopted. This mini-mold type (small resin-sealed) semiconductor device is extremely small with an outer diameter of around 1 cm, and multiple thin leads are led out from the molded exterior resin material.
The leads of this mini-mold semiconductor device are Fe-Ni.
It is generally made of a ferromagnetic metal such as an alloy, and the shape of the leads is, for example, a flat type in which the tips of a plurality of leads 2 are aligned on the back surface of the exterior resin material 1, as shown in FIG. is common. Similar to chip parts such as capacitors, such a flat type mini-mold semiconductor device 3 is printed on a printed circuit board with the back side of the exterior resin material 1 temporarily attached to the printed circuit board with adhesive. Simple mounting is performed by soldering the tips of the leads 2 to the wired conductive lands all at once using a solder dipping method or the like.

By the way, characteristics of mini-mold semiconductor devices are measured after they are manufactured individually, but this measurement is difficult and has been a major hindrance in manufacturing. That is, conventionally, the characteristics of a mini-mold semiconductor device are measured as follows.

For example, the mini-mold semiconductor devices are fed one by one from a vibrating parts feeder to a chute, and the mini-mold semiconductor devices sliding down the chute are stopped at a characteristic measurement position and then positioned.
Characteristics are measured by pressing a measuring probe against multiple leads from the outside and applying voltage. This type of measurement method is effective for normal relatively large semiconductor devices, but mini-mold semiconductor devices have particularly thin leads, making it difficult to accurately contact the measuring probe with the leads, resulting in poor reliability. There was a problem that was missing.

Another measurement method is to position and place multiple mini-molded semiconductor devices on a printed circuit board specifically for inspection, and then fix each lead tip to a conductive land on the printed circuit board by soldering. There is a method of measuring characteristics by applying a measurement voltage to the leads. This method can measure the characteristics of many mini-mold semiconductor devices at once, but
The process of soldering the mini-mold semiconductor device onto the printed circuit board is complicated and difficult to work with, and the process of removing the mini-mold semiconductor device from the printed circuit board after measuring the characteristics is also difficult and leads often come loose during work. It may become deformed or damaged.

The present invention was devised in view of the above-mentioned problems, and is a characteristic measuring device that measures the characteristics of a plurality of semiconductor devices temporarily held on a test board by magnetic attraction. Provide the device with an effective measuring device.

This invention focuses on the fact that most of the leads of mini-mold semiconductor devices and substrates for semiconductor pellet mounting sealed with exterior resin material are made of ferromagnetic metals such as Fe-Ni alloy. A device that polymerizes a magnetic plate that magnetically attracts molded semiconductor devices to their magnetic leads and substrates, and temporarily holds multiple mini-molded semiconductor devices on a test board using this magnetic plate to measure characteristics. It is. The test board and magnetic plate are one piece.
Alternatively, the test board may be provided so as to be freely separable, and in particular test boards are prepared in various shapes depending on the shape of the mini-mold semiconductor device.

Hereinafter, the present invention will be sequentially explained with reference to each embodiment shown in the drawings.

An embodiment in which the present invention is applied to a characteristic measuring device for a flat type mini-mold semiconductor device 3 shown in FIG. 1 will be explained with reference to FIGS. 2 to 4.
5 is a magnetic plate made of permanent magnets superimposed on the back surface of the test board 4. The test board 4 is made of an insulating material, and a plurality of recesses 6 into which a plurality of semiconductor devices 1 are inserted and positioned are formed in a predetermined arrangement on its surface. Further, a plurality of measurement terminals 7 are fixedly arranged on the bottom surface of each of the recesses 6, with which the tips of the leads 2 of the semiconductor device 3 fitted and positioned in the recesses 6 come into contact. It is electrically connected to a plurality of input/output terminals 8 formed by printed wiring or the like on the socket portion 4' which protrudes from the socket. The magnet plate 5 is a flat rubber magnet or the like, and is either fixed to the back surface of the test board 4 or detachably attached thereto.

One semiconductor device 3 is supplied to each of the recesses 6 of the test board 4 on which the magnet plate 5 is mounted.
This feeding is performed by means of simultaneously feeding a plurality of pieces using an alignment jig, or by means of sequentially feeding pieces one by one using a vacuum suction pen or tweezers. The semiconductor device 3 supplied to the recess 6 is positioned within the recess 6 at the time of supply, and is magnetically attracted to the bottom side of the recess 6 by the magnet plate 5, so that the lead 2 always comes into contact with the corresponding measurement terminal 7. The attraction force of the semiconductor device 3 by the magnet plate 5 is applied to the lead 2 as shown in FIG.
This acts on the substrate 10 which is inside the exterior resin material 1 and has the semiconductor pellet 9 mounted thereon. Further, the attraction force of the magnet plate 5 may be such that the semiconductor device 3 is lightly temporarily held in the recess 6. When the setting of the semiconductor devices 3 on the test board 4 is completed, the characteristics of the plurality of semiconductor devices 3 on the test board 4 are measured by, for example, inserting the socket portion 4' into the plug of an external characteristic measuring device, and it is determined whether the semiconductor devices 3 are good or not. Determine defective products.

When the characteristic measurements are completed, the semiconductor devices 3 are separated into good and defective products and taken out from the test board 4. This extraction work may be done one by one using tweezers or the like, but for example, if the magnet plate 5 is made detachable from the test board 4, then when the semiconductor device 3 is extracted, the magnet plate 5 is removed from the test board 4. Alternatively, by tilting the test board 4 or inverting its top and bottom, a plurality of test boards may be taken out at once by allowing them to fall naturally under their own weight.

Here, the recess 6 of this device is used not only for positioning the leads 2 and measurement terminals 7 of the semiconductor device 3, but also for positioning the semiconductor device 3 due to variations in magnetic distribution when the semiconductor device 3 is placed on the test board 4. Prevent it from shifting.

Next, various modifications of the present invention will be explained with reference to FIGS. 5 to 9.

FIG. 5 shows an embodiment in which a positioning protrusion 11 into which the exterior resin material 1 of the semiconductor device 3 is fitted is additionally formed on the bottom surface of the recess 6 of the test board 4. In this case, since the position of the exterior resin material 1 is positively regulated, the lead 2 can be kept in a relatively stable state, and high positioning accuracy can be obtained. In FIG. 6, only a protrusion 11' having the same purpose as the protrusion 11 is arranged on the magnet plate 5 of FIG. 5, and the semiconductor device 3 is positioned only by the protrusion 11'.

In addition to the above-mentioned embodiments, the present invention can be modified according to changes in the shape of the semiconductor device. For example, as shown in FIG. Characteristics can be easily measured by additionally forming a positioning recess 12 on the upper surface of the test board 4 into which the portion of the exterior resin material 1 lower than the lead 2' fits.

As explained above, according to the present invention, the characteristics of the semiconductor device are measured while the semiconductor device is magnetically attracted to the test board by the magnetic plate and temporarily held stably. There is no positional deviation, and there are no problems such as positional deviation during measurement, allowing stable measurement and improving reliability. In addition, it becomes easy to set the semiconductor device on the test board and to remove it after measurement, thereby greatly improving work efficiency, and this effect is particularly remarkable in measuring the characteristics of mini-molded semiconductor devices.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing an example of a semiconductor device (minimold type), Fig. 2 is a perspective view showing an embodiment of the present invention, and Figs. 3 and 4 are Fig. 2 operating states for measuring characteristics of the device. Partially enlarged plan view and X-X
5 to 7 are partial sectional views for explaining other embodiments of the present invention. 2, 2'... Lead, 3, 3'... Semiconductor device,
4, 4', 4'', 4...Test board, 5, 5'
... Magnet plate, 6, 12 ... Recess, 7 ... Measurement terminal.

Claims (1)

[Scope of utility model registration request] A test board has a recess for positioning a plurality of semiconductor devices, and has measurement terminals fixedly arranged on the mounting surface of each semiconductor device so that the leads of the semiconductor device come into contact with the semiconductor devices as appropriate. 1. An apparatus for measuring characteristics of a semiconductor device, comprising a magnet plate that magnetically attracts a semiconductor device.