JPH05110220A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH05110220A JPH05110220A JP3297980A JP29798091A JPH05110220A JP H05110220 A JPH05110220 A JP H05110220A JP 3297980 A JP3297980 A JP 3297980A JP 29798091 A JP29798091 A JP 29798091A JP H05110220 A JPH05110220 A JP H05110220A
- Authority
- JP
- Japan
- Prior art keywords
- socket
- printed circuit
- circuit board
- holes
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Connecting Device With Holders (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、移動や運搬に供される
ことの多い装置に用いると好適なＩＣ用のプリント基板
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board for an IC, which is suitable for use in an apparatus which is often used for moving or carrying.
【０００２】[0002]
【従来の技術】従来、ＩＣのプリント基板への接続は、
プリント基板にスルーホールを設け、このスルーホール
にＩＣピンを直接はんだ付けしてＩＣを接続する方法、
もしくはプリント基板にソケットを実装し、このソケッ
トにＩＣピンを差し込んでＩＣを接続する方法のいずれ
かによって行なっていた。2. Description of the Related Art Conventionally, connection of an IC to a printed circuit board has been
A method of connecting a IC by directly soldering an IC pin to this through hole by providing a through hole on the printed circuit board,
Alternatively, a method of mounting a socket on a printed circuit board and inserting an IC pin into this socket to connect an IC is performed.
【０００３】[0003]
【発明が解決しようとする課題】上述した従来のプリン
ト基板のうち、ＩＣを直接はんだ付けしたものにあって
は、ＩＣ内のソフトのデバックあるいは、試験などを行
なうに際し、ＩＣを交換するたびに、はんだを溶かして
ＩＣを取り外さなければならなかった。このため、ＩＣ
の取り外しに手間がかかるばかりか、取り外し作業のミ
スによってプリント基板を損傷させてしまうこともあっ
た。また、テストの完了したＩＣをプリント基板のソケ
ットに差し込んで接続するものにあっては、このプリン
ト基板を実装した装置の移動，運搬などのときに受ける
震動によって、ＩＣピンとソケットのピン受け端子部が
接触不良を起こすことがあった。さらに、ＩＣピンとピ
ン受け端子部の接点が、時間の経過によって腐食し、電
気特性が劣化するなどの問題点があった。Among the conventional printed circuit boards described above, the one to which the IC is directly soldered has a problem that every time the IC is replaced when debugging or testing the software in the IC. I had to melt the solder and remove the IC. Therefore, IC
Not only is it time-consuming to remove, but sometimes the printed circuit board is damaged due to a mistake in the removal work. Also, in the case of connecting an IC for which a test has been completed by inserting it into a socket of a printed circuit board, the IC pin and the pin receiving terminal portion of the socket are subject to vibrations when the device mounted with this printed circuit board is moved or transported. Sometimes caused poor contact. Further, there is a problem that the contact point between the IC pin and the pin receiving terminal portion is corroded with the passage of time, and the electrical characteristics are deteriorated.
【０００４】本発明は、上述した問題点にかんがみてな
されたものであり、ＩＣの使用目的に応じて適切な接続
を行なえるようにしたプリント基板の提供を目的とす
る。The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a printed circuit board that can be appropriately connected depending on the purpose of use of the IC.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
本発明のプリント基板は、ＩＣを接続するソケットと、
このソケットの各端子に、電気的に一対一で接続したス
ルーホールとを設けた構成とする。In order to achieve the above object, the printed circuit board of the present invention comprises a socket for connecting an IC,
Each socket of this socket is provided with a through hole electrically connected in a one-to-one relationship.
【０００６】[0006]
【作用】上述した構成からなる本発明のプリント基板
は、ＩＣをスルーホールに直接はんだ付けして接続する
ことも、ソケットに差し込んで接続することもできる。The printed circuit board of the present invention having the above-described structure can be connected by directly soldering the IC to the through hole or by inserting the IC into a socket for connection.
【０００７】[0007]
【実施例】以下、本発明の一実施例について図面を参照
して説明する。図１は、本発明の実施例にかかるプリン
ト基板を示す斜視図である。同図において、１はプリン
ト基板で、スルーホール２が穿設してあり、またソケッ
ト３が実装してある。スルーホール２とソケット３の各
端子は、それぞれパターン４によって一対一で電気的に
接続されている。このような構成からなる本発明のプリ
ント基板によれば、ＩＣのテストを行なうときには、ソ
ケットにＩＣを差し込むことによって行なう。これによ
り、ＩＣは、何度でも簡単に取り付けたり、取り外した
りすることができる。また、ＩＣのテストが終了したと
きには、スルーホールにＩＣを直接はんだ付けする。こ
れによって、このプリント基板を実装した装置の移動，
運搬時に生じる震動によって、ＩＣが接触不良を起こす
ことはない。さらに、ＩＣとソケットの接点が腐食して
電気特性が劣化することもない。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a printed circuit board according to an embodiment of the present invention. In the figure, reference numeral 1 is a printed circuit board, a through hole 2 is formed therein, and a socket 3 is mounted. The terminals of the through holes 2 and the sockets 3 are electrically connected one-to-one by the patterns 4. According to the printed circuit board of the present invention having such a configuration, the IC is tested by inserting the IC into the socket. As a result, the IC can be easily attached and detached many times. When the IC test is completed, the IC is directly soldered to the through hole. By this, the movement of the device mounted with this printed circuit board,
There is no contact failure in the IC due to the vibration generated during transportation. Further, the electrical characteristics do not deteriorate due to corrosion of the contacts between the IC and the socket.
【０００８】[0008]
【発明の効果】以上説明したように、本発明のプリント
基板によれば、ＩＣのプリント基板への接続を、ＩＣの
使用目的に応じた好適な方法によってＩＣを行なうこと
ができる。As described above, according to the printed circuit board of the present invention, the IC can be connected to the printed circuit board by a suitable method according to the purpose of use of the IC.
【図１】本発明の実施例にかかるプリント基板を示す斜
視図である。FIG. 1 is a perspective view showing a printed circuit board according to an embodiment of the present invention.
１…プリント基板 ２…スルーホール ３…ソケット ４…パターン 1 ... Printed circuit board 2 ... Through hole 3 ... Socket 4 ... Pattern
Claims (1)
トの各端子に、電気的に一対一で接続したスルーホール
を、設けたことを特徴とするプリント基板。1. A printed circuit board comprising a socket for connecting an IC and a through hole electrically connected to each terminal of the socket in a one-to-one correspondence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3297980A JPH05110220A (en) | 1991-10-18 | 1991-10-18 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3297980A JPH05110220A (en) | 1991-10-18 | 1991-10-18 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05110220A true JPH05110220A (en) | 1993-04-30 |
Family
ID=17853585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3297980A Pending JPH05110220A (en) | 1991-10-18 | 1991-10-18 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05110220A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009033481A (en) * | 2007-07-27 | 2009-02-12 | Sony Corp | Camera module |
-
1991
- 1991-10-18 JP JP3297980A patent/JPH05110220A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009033481A (en) * | 2007-07-27 | 2009-02-12 | Sony Corp | Camera module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH05110220A (en) | Printed board | |
| KR19980071445A (en) | Collective substrate and manufacturing method of electronic device using the aggregate substrate | |
| US5795164A (en) | Assembled printed circuit board | |
| JPH0658987A (en) | Burn-in board | |
| JP2606147Y2 (en) | Terminals and IC sockets for printed circuit boards | |
| JP2503907B2 (en) | Chip component mounting structure and chip component mounting method | |
| JPH05283840A (en) | Printed board and its inspection | |
| JPH088000A (en) | Connector | |
| JP3224952B2 (en) | Circuit board connector mounting structure | |
| JPH04221884A (en) | Printed board | |
| JPH04137376A (en) | Ic socket | |
| KR100421662B1 (en) | Structure of terminal for circuit testing of printed circuit board | |
| JP2601680Y2 (en) | Contact board for auto handler with ground board | |
| JP2001124832A (en) | Crimping device of connecting jig for testing printed wiring board | |
| KR20010026381A (en) | Ceramic board | |
| JPS6340391A (en) | Surface mount printed circuit board | |
| JP2528910Y2 (en) | Contact probe support cover | |
| JPH04368144A (en) | Board extending jig for semiconductor probing equipment | |
| JPH04252974A (en) | Printed wiring board for burn in | |
| JPS58111764A (en) | Testing method of printed board | |
| JPH0933614A (en) | Connecting device | |
| JPH04121772U (en) | Printed board | |
| JPH0290694A (en) | Printed circuit board ic holder | |
| JPH1064637A (en) | Surface mount connector | |
| JPS58139492A (en) | Polar chip type electronic part printed circuit board |