JPH01133391A - Confirming method for v-cutting of printed substrate - Google Patents
Confirming method for v-cutting of printed substrateInfo
- Publication number
- JPH01133391A JPH01133391A JP29154287A JP29154287A JPH01133391A JP H01133391 A JPH01133391 A JP H01133391A JP 29154287 A JP29154287 A JP 29154287A JP 29154287 A JP29154287 A JP 29154287A JP H01133391 A JPH01133391 A JP H01133391A
- Authority
- JP
- Japan
- Prior art keywords
- cut
- pattern
- cutting
- bridging
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title description 12
- 238000001514 detection method Methods 0.000 claims description 18
- 238000006073 displacement reaction Methods 0.000 abstract 2
- 238000012790 confirmation Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、電子機器の組立に用いられるプリント基板の
Vカット加工の確認方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for confirming V-cut processing of a printed circuit board used in the assembly of electronic equipment.
[従来の技術]
各種電子機器の組立に用いられるプリント基板は、1枚
の基板上に複数の独立した回路パターンを形成し途中工
程においてVカット加工を施して回路パターンごとに複
数の基板に分割することが行われる。この場合Vカット
加工が施されているか否かの確認、又はVカット位置不
良の確認を目視又は導通チエツクによって検査すること
により確認する方法が行われる。[Prior Art] Printed circuit boards used for assembling various electronic devices are divided into multiple circuit boards by forming multiple independent circuit patterns on one board and performing V-cut processing in the middle of the process. What is done is done. In this case, a method is used to confirm whether the V-cut process has been performed or to confirm whether the V-cut position is defective by visually inspecting or conducting a continuity check.
従来のこのような導通チエツクによる確認方法は例えば
特開昭60−130884号公報、又は特開昭61−9
1992号公報に示されているように、分割すべき複数
の回路にまたがるように検出パターンを形成し、この検
出パターン上にVカット加工を施した後検出パターンの
両端の導通の有無を検査する方法が知られている。A conventional confirmation method using such a continuity check is disclosed in, for example, Japanese Patent Application Laid-Open No. 60-130884 or Japanese Patent Application Laid-Open No. 61-9.
As shown in the 1992 publication, a detection pattern is formed so as to span a plurality of circuits to be divided, and after V-cutting is performed on this detection pattern, the presence or absence of continuity at both ends of the detection pattern is inspected. method is known.
[発明が解決しようとする問題点]
ところで従来の確認方法ではVカット加工の有無は検査
できてもVカット加工溝のズレは検査できないという問
題がある。[Problems to be Solved by the Invention] However, in the conventional confirmation method, there is a problem in that although it is possible to check the presence or absence of V-cut processing, it is not possible to check the deviation of the V-cut processing groove.
本発明は以上のような問題に対処してなされたもので、
■カット加工の有無と共にVカット加工溝のズレを検査
できるプリント基板のVカット加工の確認方法を提供す
ることを目的とするものである。The present invention has been made in response to the above-mentioned problems.
(2) It is an object of the present invention to provide a method for checking the V-cut processing of a printed circuit board, which can inspect the presence or absence of the cut processing and the deviation of the V-cut processing groove.
[問題点を解決するための手段]
上記目的を達成するために本発明は、プリント基板のV
カット予定線上にまたがる複数の検出パターン及びこれ
ら複数の検出パターンを橋絡する橋絡パターンを形成し
、この橋絡パターン上でVカット加工を施すことを特徴
とするものである。[Means for solving the problems] In order to achieve the above object, the present invention provides
The present invention is characterized in that a plurality of detection patterns extending over the cut line and a bridging pattern bridging the plurality of detection patterns are formed, and a V-cut process is performed on the bridging pattern.
[作用]
複数の検出パターンを橋絡するように形成した橋絡パタ
ーン上にVカット加工を施す。■カット加工後複数の検
出パターン間の導通の有無を検査することにより、■カ
ット加工の有無及びVカット加工溝のズレを検査するこ
とができる。[Operation] V-cut processing is performed on a bridging pattern formed to bridge a plurality of detection patterns. (2) By inspecting the presence or absence of conduction between a plurality of detection patterns after cutting, it is possible to (2) inspect the presence or absence of cutting and the deviation of the V-cut groove.
[実施例]
以下図面を参照して本発明のプリント基板のVカット加
工の確認方法を実施例により説明する。[Example] The method for confirming V-cut processing of a printed circuit board according to the present invention will be described below with reference to the drawings.
まずプリント基板1を第1図のように用意し。First, prepare a printed circuit board 1 as shown in Figure 1.
■カット予定線2上にまたがる第1の検出パターン3、
第2の検出パターン4及びこれら第1及び第2の検出パ
ターン3,4をVカット予定線2上で橋絡する橋絡パタ
ーン5を形成する0次に第2図(a)のようにVカット
予定線2に沿う橋絡パターン5上でVカット加工を施す
。6は■カット加工溝を示し、第2図(b)はVカット
加工後のプリント基板1の断面図である。■A first detection pattern 3 that straddles the cut planned line 2;
A second detection pattern 4 and a bridging pattern 5 that bridges these first and second detection patterns 3 and 4 on the V cut planned line 2 are formed. V-cut processing is performed on the bridging pattern 5 along the cut planned line 2. Reference numeral 6 indicates a groove formed by cutting, and FIG. 2(b) is a cross-sectional view of the printed circuit board 1 after V-cutting.
橋絡パターン5の幅をW、■カット加工溝6の幅をり、
加工精度の公差をd(プリント基板では一般に±0.1
mm〜±0.2mm)としたとき、W=L十dに設定す
ることにより、第1の検出パターン3(両端子をA、B
とする)と第2の検出パターン4(両端子をC,Dとす
る)の導通の有無を下記のように検査することで、■カ
ット加工の有無及びVカット加工溝のズレを検査するこ
とができる。The width of the bridging pattern 5 is W, and the width of the cut groove 6 is
The tolerance of processing accuracy is d (generally ±0.1 for printed circuit boards)
mm to ±0.2 mm), by setting W = L + d, the first detection pattern 3 (both terminals A and B
) and the second detection pattern 4 (both terminals are C and D) are inspected as follows for the presence or absence of continuity. ■ Inspect the presence or absence of cutting and the misalignment of the V-cut groove. Can be done.
まず第3図のように橋絡パターン5の幅W内にVカット
加工溝6Lが形成された場合は、A−8間及びC−0間
が共に導通していないので、■カット加工が施されてい
ることが確認できる。またA−0間及びB−0間が共に
導通しているので、■カット加工溝のズレがないことが
確認できる。First, when the V-cut groove 6L is formed within the width W of the bridging pattern 5 as shown in Fig. 3, there is no conduction between A-8 and C-0, so the It can be confirmed that this is done. Also, since both A-0 and B-0 are electrically connected, it can be confirmed that there is no misalignment of the cut groove.
次に第4図のように橋絡パターン5の左(又は右)端か
ら一部がはみ出すようにVカット加工溝6が形成された
場合は、A−8間及びC−0間が共に導通していないの
でVカット加工が施されていることが確認できる。しか
しA−0間が導通していないがB−0間は導通している
のでVカット加工溝にズレがあることが確認されること
になる。Next, when the V-cut groove 6 is formed so that a portion protrudes from the left (or right) end of the bridging pattern 5 as shown in Fig. 4, both A-8 and C-0 are electrically conductive. Since it is not cut, it can be confirmed that V-cut processing has been applied. However, since there is no conduction between A and 0, but there is conduction between B and 0, it is confirmed that there is a deviation in the V-cut groove.
またA−8間、B−0間、C−0間及びA−0間が共に
導通しているときはVカット加工が施されていないこと
が確認されることになる。Further, when conduction occurs between A-8, B-0, C-0, and A-0, it is confirmed that V-cut processing is not performed.
第5図は本発明の第2の実施例を示すもので、第1及び
第2の検出パターン3,4間の橋絡パターン5の中間の
所定個所のみをW=L+dの値に設定した例を示すもの
である。この例によれば第1及び第2の検出パターン3
,4の面積を大きく設けることができるので、所定個所
以外のパターン切れ等の不良原因を解消できるという利
点が得られる。FIG. 5 shows a second embodiment of the present invention, in which only a predetermined portion in the middle of the bridging pattern 5 between the first and second detection patterns 3 and 4 is set to the value of W=L+d. This shows that. According to this example, the first and second detection patterns 3
, 4 can be provided with a large area, which has the advantage that causes of defects such as pattern breakage at other than predetermined locations can be eliminated.
第6図は本発明の第3の実施例を示すもので、プリント
基板1に隣接して捨て基板1a、lb。FIG. 6 shows a third embodiment of the present invention, in which sacrificial boards 1a and 1b are provided adjacent to the printed circuit board 1.
1cを形成した場合に例えば1aとlb間に本発明を適
用した例を示すものである0本例によれば基板の使用部
分のスペースが減ることなく確認することができるとい
う利点が得られる。This example shows an example in which the present invention is applied between, for example, 1a and lb when 1c is formed.This example has the advantage that confirmation can be made without reducing the space of the used portion of the board.
第7図は本発明の第4の実施例を示すもので、プリント
基板1のla、lbと対向する端面に捨て基板1d乃至
1hを形成した場合に本発明を適用した例を示すもので
ある。本例によればVカット加工溝のズレの一層精度の
よい確認を行うことができ、また寸法確認をプリント基
板の端面同志で行うため、測定位置のスパンが大きくな
り橋絡パターンの幅Wを若干広くしても、■カット加工
溝のズレが容易に検知できるので寸法的に余裕を持たせ
ることもできる。FIG. 7 shows a fourth embodiment of the present invention, and shows an example in which the present invention is applied when sacrificial boards 1d to 1h are formed on the end face of the printed circuit board 1 facing la and lb. . According to this example, it is possible to check the deviation of the V-cut groove with even higher accuracy, and since the dimensions are checked between the end faces of the printed circuit board, the span of the measurement position is increased, and the width W of the bridging pattern is Even if it is made a little wider, it is possible to provide some dimensional leeway because (1) the deviation of the cut groove can be easily detected.
第8図(a)、(b)は本発明の第5の実施例を示すも
ので、橋絡パターン5の幅Qを加工時の最小Vカット幅
に設定した例を示すものである。本例によれば特にVカ
ット加工溝6の深さが少ない場合は、基板分割時縁面を
破損させたり、装着のチップ部品にショックを与えてヒ
ビ割れを発生させるので、この不良を生じることなく、
加工時に橋絡パターンが分断される寸法として例えばプ
リント基板lの厚さが1.6閣で最小必要Vカット幅が
0.71W11であるとすると、前記Qを0.7am以
下に設定する。上記の分断を確認することでVカット幅
、深さの検出ができる。これはA−C間及びB−0間が
共に導通していないことで確認することができる。FIGS. 8(a) and 8(b) show a fifth embodiment of the present invention, in which the width Q of the bridging pattern 5 is set to the minimum V-cut width during processing. According to this example, especially when the depth of the V-cut groove 6 is small, the edge surface may be damaged when the board is divided, or the mounted chip components may be shocked and cracked, so this defect cannot occur. Without,
Assuming that the thickness of the printed circuit board 1 is 1.6 mm and the minimum required V-cut width is 0.71 W11 as the dimension at which the bridging pattern is divided during processing, the Q is set to 0.7 am or less. By checking the above division, the V-cut width and depth can be detected. This can be confirmed by the fact that neither A-C nor B-0 are electrically connected.
[発明の効果]
以上述べたように本発明によれば、■カット加工の有無
と共にVカット加工溝のズレを検査することができる。[Effects of the Invention] As described above, according to the present invention, it is possible to inspect (1) the presence or absence of cut processing and the deviation of the V-cut groove.
第1図、第2図(a)、第3図、第4図及び第2図(b
)は本発明のプリント基板のVカット加工の確認方法の
実施例を示す平面図及び断面図、第5図は本発明の第2
の実施例を示す平面図、第6図は本発明の第3の実施例
を示す斜視図、第7図は本発明の第4の実施例を示す斜
視図、第8図(a)及び(b)は本発明の第5の実施例
を示す平面図及び断面図モある。
1・・・プリント基板、
3・・・第1の検出パターン、
4・・・第2の検出パターン、
5・・・橋絡パターン、
6・・・Vカット加工溝。
特許出願人 アルプス電気株式会社第1■
慕2図第8図Figures 1, 2(a), 3, 4 and 2(b)
) are a plan view and a sectional view showing an embodiment of the method for confirming V-cut processing of a printed circuit board according to the present invention, and FIG.
FIG. 6 is a perspective view showing the third embodiment of the present invention, FIG. 7 is a perspective view showing the fourth embodiment of the present invention, and FIGS. 8(a) and ( b) is a plan view and a sectional view showing a fifth embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 3... First detection pattern, 4... Second detection pattern, 5... Bridging pattern, 6... V-cut processing groove. Patent applicant: Alps Electric Co., Ltd. No. 1■
Mu 2 Figure 8
Claims (1)
パターン及びこれら複数の検出パターンを橋絡する橋絡
パターンを形成し、この橋絡パターン上でVカット加工
を施すことを特徴とするプリント基板のVカット加工の
確認方法。A V of a printed circuit board characterized by forming a plurality of detection patterns extending over a V cut planned line of a printed circuit board and a bridging pattern bridging these plurality of detection patterns, and performing V cut processing on this bridging pattern. How to check the cutting process.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29154287A JPH01133391A (en) | 1987-11-18 | 1987-11-18 | Confirming method for v-cutting of printed substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29154287A JPH01133391A (en) | 1987-11-18 | 1987-11-18 | Confirming method for v-cutting of printed substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01133391A true JPH01133391A (en) | 1989-05-25 |
Family
ID=17770255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29154287A Pending JPH01133391A (en) | 1987-11-18 | 1987-11-18 | Confirming method for v-cutting of printed substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01133391A (en) |
-
1987
- 1987-11-18 JP JP29154287A patent/JPH01133391A/en active Pending
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