JPH0215764U - - Google Patents
Info
- Publication number
- JPH0215764U JPH0215764U JP9374788U JP9374788U JPH0215764U JP H0215764 U JPH0215764 U JP H0215764U JP 9374788 U JP9374788 U JP 9374788U JP 9374788 U JP9374788 U JP 9374788U JP H0215764 U JPH0215764 U JP H0215764U
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- electrode
- circuit board
- printed circuit
- lower electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 12
- 239000003989 dielectric material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図はこの考案によるコンデンサの一例を示
す断面図であり、第２図はこの考案によるコンデ
ンサの別の例を示す断面図であり、第３図は従来
のコンデンサの一例を示す断面図であり、第４図
ＡおよびＢは従来のコンデンサによる位置ずれを
示す平面図および断面図である。
１……コンデンサ、２……プリント基板、３…
…コンデンサ下部電極、４……誘電体、５……コ
ンデンサ上部電極、６……基材、７……位置ずれ
。
FIG. 1 is a sectional view showing an example of a capacitor according to this invention, FIG. 2 is a sectional view showing another example of a capacitor according to this invention, and FIG. 3 is a sectional view showing an example of a conventional capacitor. 4A and 4B are a plan view and a cross-sectional view showing positional deviation caused by a conventional capacitor. 1... Capacitor, 2... Printed circuit board, 3...
... Capacitor lower electrode, 4 ... Dielectric material, 5 ... Capacitor upper electrode, 6 ... Base material, 7 ... Position shift.
Claims (1)
て、 プリント基板面に形成されたコンデンサ下部電
極パターンと、該コンデンサ下部電極パターン面
に誘電体を介して積層されたコンデンサ上部電極
板とからなり、 下部電極または上部電極のいずれかを基準寸法
とし、他方の電極の平面形状が基準電極の平面形
状より一回り大きいことを特徴とするプリント基
板上に形成されたコンデンサ。[Claims for Utility Model Registration] A capacitor formed on a printed circuit board, including a capacitor lower electrode pattern formed on the printed circuit board surface and a capacitor upper layer laminated on the capacitor lower electrode pattern surface with a dielectric interposed therebetween. 1. A capacitor formed on a printed circuit board, comprising an electrode plate, wherein either the lower electrode or the upper electrode has a reference dimension, and the planar shape of the other electrode is one size larger than the planar shape of the reference electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9374788U JPH0215764U (en) | 1988-07-15 | 1988-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9374788U JPH0215764U (en) | 1988-07-15 | 1988-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215764U true JPH0215764U (en) | 1990-01-31 |
Family
ID=31318222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9374788U Pending JPH0215764U (en) | 1988-07-15 | 1988-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215764U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005116604A (en) * | 2003-10-03 | 2005-04-28 | Toppan Printing Co Ltd | Substrate with built-in electronic component, and method for manufacturing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5212764B2 (en) * | 1973-07-03 | 1977-04-09 | ||
| JPS58204516A (en) * | 1982-05-24 | 1983-11-29 | 株式会社日立製作所 | Thick film multilayer circuit board |
-
1988
- 1988-07-15 JP JP9374788U patent/JPH0215764U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5212764B2 (en) * | 1973-07-03 | 1977-04-09 | ||
| JPS58204516A (en) * | 1982-05-24 | 1983-11-29 | 株式会社日立製作所 | Thick film multilayer circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005116604A (en) * | 2003-10-03 | 2005-04-28 | Toppan Printing Co Ltd | Substrate with built-in electronic component, and method for manufacturing the same |