JPH0461821U - - Google Patents
Info
- Publication number
- JPH0461821U JPH0461821U JP10467590U JP10467590U JPH0461821U JP H0461821 U JPH0461821 U JP H0461821U JP 10467590 U JP10467590 U JP 10467590U JP 10467590 U JP10467590 U JP 10467590U JP H0461821 U JPH0461821 U JP H0461821U
- Authority
- JP
- Japan
- Prior art keywords
- line connection
- switch contact
- conductive pattern
- insulating layer
- column
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Contacts (AREA)
Description
図面はいずれも本考案の実施例を説明するもの
で、第１図及び第３図は平面図、第２図及び第４
図はそれぞれ第１図及び第３図のＡ−Ａ部分の断
面図、第５図はマトリクスキースイツチ装置の一
般的構成を示す回路図である。
主な記号、１……基板、２１〜２６……導電パ
ターン、３……絶縁層、４１，４２……スイツチ
接点パターン。
The drawings are for explaining embodiments of the present invention, and FIGS. 1 and 3 are plan views, and FIGS. 2 and 4 are diagrams.
The figures are sectional views taken along line A--A in FIGS. 1 and 3, respectively, and FIG. 5 is a circuit diagram showing the general structure of the matrix key switch device. Main symbols: 1...Substrate, 21-26...Conductive pattern, 3...Insulating layer, 41, 42...Switch contact pattern.
Claims (1)
に絶縁層を形成し、該絶縁層の上にスイツチ接点
パターンを形成したスイツチ接点配置部分の導電
パターン構造。 ２ プリント基板上にスイツチ接点パターンがマ
トリクス状に配置され、それぞれのスイツチ接点
パターンがマトリクスのＸ列線接続接点部とＹ列
線接続接点部に分割されたパターンで構成されて
おり、一方の列線接続接点部相互を接続する導電
パターンを、他方の列線接続接点の下に絶縁層を
挟んで配置したスイツチ接点配置部分の導電パタ
ーン構造。[Claims for Utility Model Registration] 1. A conductive pattern structure for a switch contact arrangement portion, in which an insulating layer is formed on a conductive pattern formed on a printed circuit board, and a switch contact pattern is formed on the insulating layer. 2 Switch contact patterns are arranged in a matrix on the printed circuit board, and each switch contact pattern is divided into a line connection contact part for the X column and a line connection contact part for the Y column of the matrix. A conductive pattern structure of the switch contact arrangement part, in which a conductive pattern that connects the line connection contact parts is placed below the other column line connection contact with an insulating layer sandwiched between them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10467590U JPH0461821U (en) | 1990-10-04 | 1990-10-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10467590U JPH0461821U (en) | 1990-10-04 | 1990-10-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0461821U true JPH0461821U (en) | 1992-05-27 |
Family
ID=31850054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10467590U Pending JPH0461821U (en) | 1990-10-04 | 1990-10-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0461821U (en) |
-
1990
- 1990-10-04 JP JP10467590U patent/JPH0461821U/ja active Pending