JPH0476045U - - Google Patents

Info

Publication number
JPH0476045U
JPH0476045U JP1990119705U JP11970590U JPH0476045U JP H0476045 U JPH0476045 U JP H0476045U JP 1990119705 U JP1990119705 U JP 1990119705U JP 11970590 U JP11970590 U JP 11970590U JP H0476045 U JPH0476045 U JP H0476045U
Authority
JP
Japan
Prior art keywords
active metal
ceramic plate
copper
bonded
box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990119705U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990119705U priority Critical patent/JPH0476045U/ja
Publication of JPH0476045U publication Critical patent/JPH0476045U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図はこの高考案一実施例を示す図
、第３図、第４図は従来の高熱伝導性気密パツケ
ージの例を示す図である。１はコバールフレーム
、２はコバールリード、３は貫通孔、４はハーメ
チツクガラス、５はベース、６はろう材、７はネ
ジ止め穴、８は高熱伝導性セラミツク基板、９は
半導体チツプ、１０は銅パターン、１１は銅板、
１２は活性金属層、１３，１４は半田、１５はボ
ンデイングワイヤ、２０は箱型銅ケース、２１は
シールリング、２２はセラミツク板である。なお
、図中同一符号は同一または相当部分を示す。 FIGS. 1 and 2 are views showing an embodiment of this advanced design, and FIGS. 3 and 4 are views showing an example of a conventional airtight package with high thermal conductivity. 1 is a Kovar frame, 2 is a Kovar lead, 3 is a through hole, 4 is a hermetic glass, 5 is a base, 6 is a brazing material, 7 is a screw hole, 8 is a highly thermally conductive ceramic substrate, 9 is a semiconductor chip, 10 is a copper pattern, 11 is a copper plate,
12 is an active metal layer, 13 and 14 are solders, 15 is a bonding wire, 20 is a box-shaped copper case, 21 is a seal ring, and 22 is a ceramic plate. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 貫通気密端子を有する箱型の銅ケースと、この
銅ケースの内側底面に一方の面が活性金属接合さ
れているセラミツク板と、このセラミツク板の他
方の面に活性金属接合されている銅パターンとで
構成されていることを特徴とする高熱伝導性気密
パツケージ。 A box-shaped copper case with a through airtight terminal, a ceramic plate with one side bonded to an active metal on the inner bottom surface of the copper case, and a copper pattern bonded with an active metal to the other side of the ceramic plate. A highly thermally conductive airtight package characterized by comprising:
JP1990119705U 1990-11-15 1990-11-15 Pending JPH0476045U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990119705U JPH0476045U (en) 1990-11-15 1990-11-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990119705U JPH0476045U (en) 1990-11-15 1990-11-15

Publications (1)

Publication Number Publication Date
JPH0476045U true JPH0476045U (en) 1992-07-02

Family

ID=31867647

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990119705U Pending JPH0476045U (en) 1990-11-15 1990-11-15

Country Status (1)

Country Link
JP (1) JPH0476045U (en)

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