JPH0310540U - - Google Patents
Info
- Publication number
- JPH0310540U JPH0310540U JP7031489U JP7031489U JPH0310540U JP H0310540 U JPH0310540 U JP H0310540U JP 7031489 U JP7031489 U JP 7031489U JP 7031489 U JP7031489 U JP 7031489U JP H0310540 U JPH0310540 U JP H0310540U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- ceramic
- frame
- film circuit
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図〜第５図はこの考案の実施例を示す図、
第６図、第７図は従来の例のうちセラミツクパツ
ケージを示す図、第８図、第９図は従来の例のう
ちメタルパツケージを示す図であり、図において
、１，２０……セラミツク基板、２，２１……厚
膜回路パターン、３……半導体ベアチツプ、４…
…ボンデイングワイヤ、５，９……パツケージベ
ース、６，１０……パツケージフレーム、７，２
２……電極パターン、８……アウターリード、１
１……貫通端子、１２……ハーメチツクガラス、
２３……セラミツクフレーム、２４……厚膜絶縁
ガラス、２５……厚膜絶縁ガラスペースト、２６
……カバー、２７……半田付用パターン、２８…
…半田、２９……部品である。なお、図中同一符
号は同一または相当部分を示す。
Figures 1 to 5 are diagrams showing embodiments of this invention;
6 and 7 are diagrams showing ceramic packages among conventional examples, and FIGS. 8 and 9 are diagrams showing metal packages among conventional examples. , 2, 21... Thick film circuit pattern, 3... Semiconductor bare chip, 4...
...Bonding wire, 5,9...Package base, 6,10...Package frame, 7,2
2...Electrode pattern, 8...Outer lead, 1
1...Through terminal, 12...Hermetic glass,
23...Ceramic frame, 24...Thick film insulating glass, 25...Thick film insulating glass paste, 26
...Cover, 27...Soldering pattern, 28...
...Solder, 29...Parts. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
厚膜回路の一部を囲うようにしてこのセラミツク
基板に厚膜絶縁ガラスで接着された枠形状のセラ
ミツクフレームと、このセラミツクフレームの開
口部を塞ぐ金属またはセラミツクのカバーとで構
成され、前記のセラミツクフレームで囲われた部
分の厚膜回路が気密封止構造になつていることを
特徴とするハイブリツドＩＣの気密パツケージ。 A ceramic substrate on which a thick film circuit is formed, a frame-shaped ceramic frame that surrounds a part of the thick film circuit and is bonded to the ceramic substrate with thick film insulating glass, and an opening in the ceramic frame is closed. 1. An airtight package for a hybrid IC, comprising a metal or ceramic cover, and a thick film circuit in a portion surrounded by the ceramic frame having an airtight sealing structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7031489U JPH0310540U (en) | 1989-06-15 | 1989-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7031489U JPH0310540U (en) | 1989-06-15 | 1989-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0310540U true JPH0310540U (en) | 1991-01-31 |
Family
ID=31606369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7031489U Pending JPH0310540U (en) | 1989-06-15 | 1989-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310540U (en) |
-
1989
- 1989-06-15 JP JP7031489U patent/JPH0310540U/ja active Pending
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