JPS63157946U - - Google Patents
Info
- Publication number
- JPS63157946U JPS63157946U JP1987050216U JP5021687U JPS63157946U JP S63157946 U JPS63157946 U JP S63157946U JP 1987050216 U JP1987050216 U JP 1987050216U JP 5021687 U JP5021687 U JP 5021687U JP S63157946 U JPS63157946 U JP S63157946U
- Authority
- JP
- Japan
- Prior art keywords
- electric welding
- sealed
- utility
- electronic component
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Details Of Resistors (AREA)
- Wire Bonding (AREA)
Description
第１図ａは本考案の一実施例を示す平面図、同
図ｂは同じく断面図である。また第２図は上記実
施例の効果を示す断面図、第３図ａ，ｂは従来技
術を示す断面図である。
１……球面となつた凸部、２……平坦部、３…
…セラミツクケース、４……電気溶接部、５……
ボンデイングワイヤー、６……半導体チツプ、７
……外力の向き、８……外力７のキヤツプ面に沿
つた成分、９……外力７のキヤツプ面に沿つた成
分。
FIG. 1a is a plan view showing an embodiment of the present invention, and FIG. 1b is a sectional view of the same. Further, FIG. 2 is a sectional view showing the effect of the above embodiment, and FIGS. 3a and 3b are sectional views showing the prior art. 1... Convex portion with a spherical surface, 2... Flat portion, 3...
...Ceramic case, 4...Electric welding part, 5...
Bonding wire, 6... Semiconductor chip, 7
...Direction of external force, 8...Component of external force 7 along the cap surface, 9...Component of external force 7 along the cap surface.
Claims (1)
おいて、外側に凸となる形状としたことを特徴と
する電子部品ケース用金属キヤツプ。 A metal cap for an electronic component case, which is sealed by electric welding, and is characterized by having an outwardly convex shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987050216U JPS63157946U (en) | 1987-04-01 | 1987-04-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987050216U JPS63157946U (en) | 1987-04-01 | 1987-04-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157946U true JPS63157946U (en) | 1988-10-17 |
Family
ID=30873370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987050216U Pending JPS63157946U (en) | 1987-04-01 | 1987-04-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157946U (en) |
-
1987
- 1987-04-01 JP JP1987050216U patent/JPS63157946U/ja active Pending