JPS6237928U - - Google Patents

Info

Publication number
JPS6237928U
JPS6237928U JP1985128842U JP12884285U JPS6237928U JP S6237928 U JPS6237928 U JP S6237928U JP 1985128842 U JP1985128842 U JP 1985128842U JP 12884285 U JP12884285 U JP 12884285U JP S6237928 U JPS6237928 U JP S6237928U
Authority
JP
Japan
Prior art keywords
header
semiconductor chip
semiconductor device
spacing member
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985128842U
Other languages
Japanese (ja)
Other versions
JPH0519954Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985128842U priority Critical patent/JPH0519954Y2/ja
Publication of JPS6237928U publication Critical patent/JPS6237928U/ja
Application granted granted Critical
Publication of JPH0519954Y2 publication Critical patent/JPH0519954Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案による半導体装置の断面図；
第２図は、リード部材を半導体チツプ上に接着し
た場合の第１図の部分的平面図；第３図は、耐環
境性試験の結果を示すグラフ；第４図は、本考案
による半導体装置の変形例を示す断面図；第５図
は、第４図の部分的平面図で；第６図は従来の半
導体装置の断面図を示す。 １…ダイオード、２…椀状電極体、３，５…半
田、４…半導体チツプ、６…リード部材、７…ヘ
ツダー、８…リード部、１２…軟質樹脂、１３…
スペーサ、１４…空間、１５…凸部。 FIG. 1 is a sectional view of a semiconductor device according to the present invention;
FIG. 2 is a partial plan view of FIG. 1 when a lead member is bonded onto a semiconductor chip; FIG. 3 is a graph showing the results of an environmental resistance test; FIG. 4 is a semiconductor device according to the present invention. 5 is a partial plan view of FIG. 4; FIG. 6 is a sectional view of a conventional semiconductor device. DESCRIPTION OF SYMBOLS 1... Diode, 2... Bowl-shaped electrode body, 3, 5... Solder, 4... Semiconductor chip, 6... Lead member, 7... Header, 8... Lead portion, 12... Soft resin, 13...
Spacer, 14... Space, 15... Convex portion.

Claims (1)

【実用新案登録請求の範囲】 (1) 電極体と、ヘツダー及び該ヘツダーより小
さい横断面を有するリード部からなるリード部材
と、前記電極体及び前記ヘツダーとの間に固着さ
れた半導体チツプと、該半導体チツプ及び前記ヘ
ツダーを封止する軟質樹脂体とを有し、前記ヘツ
ダーと前記半導体チツプとの固着が半田によつて
行われている半導体装置において、 前記ヘツダーと前記半導体チツプとの間に離間
部材が設けられ、該離間部材の横断面は、半導体
チツプとの対向部分において半導体チツプの半田
による接着面より小さく、ヘツダーとの対向部分
においてヘツダーより小さく、かつ平面的に透視
したときヘツダーは半導体チツプの半田による接
着面を内包することを特徴とする半導体装置。 (2) 上記離間部材は、上記ヘツダーと上記半導
体装置との間に上記半田で固着されたスペーサで
ある実用新案登録請求の範囲第(1)項記載の半導
体装置。 (3) 上記離間部材は、上記ヘツダーと一体に形
成された凸部である実用新案登録請求の範囲第(1
)項記載の半導体装置。[Claims for Utility Model Registration] (1) A lead member consisting of an electrode body, a header, and a lead portion having a smaller cross section than the header, and a semiconductor chip fixed between the electrode body and the header; A semiconductor device comprising the semiconductor chip and a soft resin body for sealing the header, and in which the header and the semiconductor chip are fixed by solder, wherein there is a space between the header and the semiconductor chip. A spacing member is provided, and the cross section of the spacing member is smaller than the solder bonding surface of the semiconductor chip at the portion facing the semiconductor chip, smaller than the header at the portion facing the header, and when viewed through the header in a plan view. A semiconductor device characterized by including a soldered adhesive surface of a semiconductor chip. (2) The semiconductor device according to claim 1, wherein the spacing member is a spacer fixed with the solder between the header and the semiconductor device. (3) The above-mentioned spacing member is a convex portion formed integrally with the above-mentioned header.
) The semiconductor device described in item 2.
JP1985128842U 1985-08-26 1985-08-26 Expired - Lifetime JPH0519954Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985128842U JPH0519954Y2 (en) 1985-08-26 1985-08-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985128842U JPH0519954Y2 (en) 1985-08-26 1985-08-26

Publications (2)

Publication Number Publication Date
JPS6237928U true JPS6237928U (en) 1987-03-06
JPH0519954Y2 JPH0519954Y2 (en) 1993-05-25

Family

ID=31024873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985128842U Expired - Lifetime JPH0519954Y2 (en) 1985-08-26 1985-08-26

Country Status (1)

Country Link
JP (1) JPH0519954Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016105508A (en) * 2016-02-29 2016-06-09 株式会社三社電機製作所 Semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51123065A (en) * 1975-04-21 1976-10-27 Hitachi Ltd Semiconductor device
JPS5989427A (en) * 1982-11-15 1984-05-23 Sanken Electric Co Ltd Manufacture of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51123065A (en) * 1975-04-21 1976-10-27 Hitachi Ltd Semiconductor device
JPS5989427A (en) * 1982-11-15 1984-05-23 Sanken Electric Co Ltd Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016105508A (en) * 2016-02-29 2016-06-09 株式会社三社電機製作所 Semiconductor device

Also Published As

Publication number Publication date
JPH0519954Y2 (en) 1993-05-25

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