JPS51123065A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS51123065A
JPS51123065A JP50047436A JP4743675A JPS51123065A JP S51123065 A JPS51123065 A JP S51123065A JP 50047436 A JP50047436 A JP 50047436A JP 4743675 A JP4743675 A JP 4743675A JP S51123065 A JPS51123065 A JP S51123065A
Authority
JP
Japan
Prior art keywords
semiconductor device
attaching
mounting
base
breakdown voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50047436A
Other languages
Japanese (ja)
Inventor
Shuroku Sakurada
Hisashi Sakamoto
Koichi Moriyama
Minoru Toida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50047436A priority Critical patent/JPS51123065A/en
Publication of JPS51123065A publication Critical patent/JPS51123065A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201—Structure
    • H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent deterioration of the breakdown voltage after mounting the semiconductor pellet onto the base by means of attaching by soldering material.
COPYRIGHT: (C)1976,JPO&Japio
JP50047436A 1975-04-21 1975-04-21 Semiconductor device Pending JPS51123065A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50047436A JPS51123065A (en) 1975-04-21 1975-04-21 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50047436A JPS51123065A (en) 1975-04-21 1975-04-21 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS51123065A true JPS51123065A (en) 1976-10-27

Family

ID=12775094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50047436A Pending JPS51123065A (en) 1975-04-21 1975-04-21 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS51123065A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599152U (en) * 1978-12-28 1980-07-10
JPS6237928U (en) * 1985-08-26 1987-03-06

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599152U (en) * 1978-12-28 1980-07-10
JPS6011644Y2 (en) * 1978-12-28 1985-04-17 富士通株式会社 semiconductor equipment
JPS6237928U (en) * 1985-08-26 1987-03-06
JPH0519954Y2 (en) * 1985-08-26 1993-05-25

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