JPS5239373A - Dam for prevention of flowing of solder material - Google Patents

Dam for prevention of flowing of solder material

Info

Publication number
JPS5239373A
JPS5239373A JP50114742A JP11474275A JPS5239373A JP S5239373 A JPS5239373 A JP S5239373A JP 50114742 A JP50114742 A JP 50114742A JP 11474275 A JP11474275 A JP 11474275A JP S5239373 A JPS5239373 A JP S5239373A
Authority
JP
Japan
Prior art keywords
dam
prevention
flowing
solder material
connecting terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50114742A
Other languages
Japanese (ja)
Inventor
Koichi Inoue
Tomiro Yasuda
Masao Funiyu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50114742A priority Critical patent/JPS5239373A/en
Publication of JPS5239373A publication Critical patent/JPS5239373A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/38—Effects and problems related to the device integration
    • H01L2924/384—Bump effects
    • H01L2924/3841—Solder bridging

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To make area of connecting terminal on the substrate constant by arranging dam as hollow disk.
COPYRIGHT: (C)1977,JPO&Japio
JP50114742A 1975-09-25 1975-09-25 Dam for prevention of flowing of solder material Pending JPS5239373A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50114742A JPS5239373A (en) 1975-09-25 1975-09-25 Dam for prevention of flowing of solder material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50114742A JPS5239373A (en) 1975-09-25 1975-09-25 Dam for prevention of flowing of solder material

Publications (1)

Publication Number Publication Date
JPS5239373A true JPS5239373A (en) 1977-03-26

Family

ID=14645507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50114742A Pending JPS5239373A (en) 1975-09-25 1975-09-25 Dam for prevention of flowing of solder material

Country Status (1)

Country Link
JP (1) JPS5239373A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011134818A (en) * 2009-12-24 2011-07-07 Shinko Electric Ind Co Ltd Semiconductor element built-in substrate
WO2014045491A1 (en) * 2012-09-21 2014-03-27 日本特殊陶業株式会社 Wiring board and method for manufacturing same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011134818A (en) * 2009-12-24 2011-07-07 Shinko Electric Ind Co Ltd Semiconductor element built-in substrate
WO2014045491A1 (en) * 2012-09-21 2014-03-27 日本特殊陶業株式会社 Wiring board and method for manufacturing same
JP2014063932A (en) * 2012-09-21 2014-04-10 Ngk Spark Plug Co Ltd Wiring board and manufacturing method of the same
US9516751B2 (en) 2012-09-21 2016-12-06 Ngk Spark Plug Co., Ltd. Wiring board and method for manufacturing same

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