JPS53108381A - Manufacture for semiconductor device - Google Patents

Manufacture for semiconductor device

Info

Publication number
JPS53108381A
JPS53108381A JP2267977A JP2267977A JPS53108381A JP S53108381 A JPS53108381 A JP S53108381A JP 2267977 A JP2267977 A JP 2267977A JP 2267977 A JP2267977 A JP 2267977A JP S53108381 A JPS53108381 A JP S53108381A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
eaves
lowering
leaving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2267977A
Other languages
Japanese (ja)
Inventor
Hideo Sunami
Shinpei Iijima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2267977A priority Critical patent/JPS53108381A/en
Publication of JPS53108381A publication Critical patent/JPS53108381A/en
Pending legal-status Critical Current

Links

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  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To prevent the short circuit between electrodes and lowering in breakdown voltage, by leaving the insulated coating film to the eaves.
COPYRIGHT: (C)1978,JPO&Japio
JP2267977A 1977-03-04 1977-03-04 Manufacture for semiconductor device Pending JPS53108381A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2267977A JPS53108381A (en) 1977-03-04 1977-03-04 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2267977A JPS53108381A (en) 1977-03-04 1977-03-04 Manufacture for semiconductor device

Publications (1)

Publication Number Publication Date
JPS53108381A true JPS53108381A (en) 1978-09-21

Family

ID=12089538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2267977A Pending JPS53108381A (en) 1977-03-04 1977-03-04 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS53108381A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5300444A (en) * 1988-09-14 1994-04-05 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a semiconductor device having a stacked structure formed of polycrystalline silicon film and silicon oxide film

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4849382A (en) * 1971-10-22 1973-07-12
JPS49115681A (en) * 1973-03-07 1974-11-05
JPS5012978A (en) * 1973-05-23 1975-02-10

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4849382A (en) * 1971-10-22 1973-07-12
JPS49115681A (en) * 1973-03-07 1974-11-05
JPS5012978A (en) * 1973-05-23 1975-02-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5300444A (en) * 1988-09-14 1994-04-05 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a semiconductor device having a stacked structure formed of polycrystalline silicon film and silicon oxide film

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