JPS6169135U - - Google Patents
Info
- Publication number
- JPS6169135U JPS6169135U JP15372884U JP15372884U JPS6169135U JP S6169135 U JPS6169135 U JP S6169135U JP 15372884 U JP15372884 U JP 15372884U JP 15372884 U JP15372884 U JP 15372884U JP S6169135 U JPS6169135 U JP S6169135U
- Authority
- JP
- Japan
- Prior art keywords
- pressure sensor
- circuit board
- printed circuit
- semiconductor pressure
- absorbing means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図、
第３図及び第４図は各々他の実施例の斜視図、第
５図は従来例の断面図、第６図は横軸を受圧力と
し、縦軸を検出圧力としたものにおいて実際値の
ものと従来例のものとを比較した図表であり、１
は半導体圧力センサー、２はプリント基板、３は
変形吸収手段である。
Fig. 1 is a perspective view of an embodiment of the present invention; Fig. 2;
3 and 4 are perspective views of other embodiments, FIG. 5 is a sectional view of the conventional example, and FIG. 6 shows actual values, with the horizontal axis representing the received pressure and the vertical axis representing the detected pressure. This is a diagram comparing the conventional example and the conventional example.
2 is a semiconductor pressure sensor, 2 is a printed circuit board, and 3 is a deformation absorbing means.
Claims (1)
ント基板の変形を吸収する変形吸収手段を介して
取付けて成る半導体圧力センサーの取付け構造。 (2) 変形吸収手段がプリント基板に形成した切
欠である実用新案登録請求の範囲第１項記載の半
導体圧力センサーの取付け構造。 (3) 半導体圧力センサーを小形プリント基台に
取付け、この小形プリント基台をプリント基板に
電気的に接続して取付ける取付線を変形吸収手段
としてある実用新案登録請求の範囲第１項記載の
半導体圧力センサーの取付け構造。[Claims for Utility Model Registration] (1) A mounting structure for a semiconductor pressure sensor, in which the semiconductor pressure sensor is mounted on a printed circuit board via a deformation absorbing means that absorbs deformation of the printed circuit board. (2) The mounting structure for a semiconductor pressure sensor according to claim 1, wherein the deformation absorbing means is a notch formed in a printed circuit board. (3) The semiconductor according to claim 1 of the utility model registration claim, in which the semiconductor pressure sensor is mounted on a small printed base, and the mounting wire for electrically connecting the small printed base to a printed circuit board is used as a deformation absorbing means. Mounting structure of pressure sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15372884U JPS6169135U (en) | 1984-10-12 | 1984-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15372884U JPS6169135U (en) | 1984-10-12 | 1984-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6169135U true JPS6169135U (en) | 1986-05-12 |
Family
ID=30711741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15372884U Pending JPS6169135U (en) | 1984-10-12 | 1984-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6169135U (en) |
-
1984
- 1984-10-12 JP JP15372884U patent/JPS6169135U/ja active Pending
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