JPS62152456U - - Google Patents
Info
- Publication number
- JPS62152456U JPS62152456U JP1986039079U JP3907986U JPS62152456U JP S62152456 U JPS62152456 U JP S62152456U JP 1986039079 U JP1986039079 U JP 1986039079U JP 3907986 U JP3907986 U JP 3907986U JP S62152456 U JPS62152456 U JP S62152456U
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- lead frame
- semiconductor device
- semiconductor element
- tab
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Description
第1図は本考案の半導体装置の一実施例の一部
を破砕して示す斜視図、第2図は第1図における
リードフレームを示す斜視図、第3図は従来の半
導体装置の一例の一部を破砕して示す斜視図であ
る。
1…半導体素子、2…タブ吊りリード、3…タ
ブ、4…リードフレーム、5…ワイヤ、6…パツ
ケージ、10…本発明によるリードフレーム、2
0…リードフレームの基板、21…絶縁層、22
…配線パターン。
FIG. 1 is a partially fragmented perspective view of an embodiment of the semiconductor device of the present invention, FIG. 2 is a perspective view of the lead frame in FIG. 1, and FIG. 3 is an example of a conventional semiconductor device. FIG. 2 is a partially fragmented perspective view. DESCRIPTION OF SYMBOLS 1...Semiconductor element, 2...Tab suspension lead, 3...Tab, 4...Lead frame, 5...Wire, 6...Package, 10...Lead frame according to the present invention, 2
0... Lead frame substrate, 21... Insulating layer, 22
...Wiring pattern.
Claims (1)
て半導体素子と接続されたリードフレームとを樹
脂でモールドする半導体装置において、42アロ
イなどの金属材料を基板とする前記リードフレー
ムの表面に絶縁層を設け、この絶縁層上に配線パ
ターンを形成したことを特徴とする半導体装置。 In a semiconductor device in which a semiconductor element fixed to a tab and a lead frame connected to the semiconductor element by wire are molded with resin, an insulating layer is provided on the surface of the lead frame whose substrate is a metal material such as 42 alloy. What is claimed is: 1. A semiconductor device comprising: an insulating layer, and a wiring pattern formed on the insulating layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986039079U JPS62152456U (en) | 1986-03-19 | 1986-03-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986039079U JPS62152456U (en) | 1986-03-19 | 1986-03-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62152456U true JPS62152456U (en) | 1987-09-28 |
Family
ID=30851920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986039079U Pending JPS62152456U (en) | 1986-03-19 | 1986-03-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62152456U (en) |
-
1986
- 1986-03-19 JP JP1986039079U patent/JPS62152456U/ja active Pending