JPS61100147U - - Google Patents
Info
- Publication number
- JPS61100147U JPS61100147U JP18570884U JP18570884U JPS61100147U JP S61100147 U JPS61100147 U JP S61100147U JP 18570884 U JP18570884 U JP 18570884U JP 18570884 U JP18570884 U JP 18570884U JP S61100147 U JPS61100147 U JP S61100147U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead terminal
- semiconductor device
- heat sink
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Description
第１図、第２図は本考案の樹脂封止半導体装置
の一実施例を示す側面、平面透視図、第３図、第
４図はそれぞれ従来の絶縁型樹脂封止半導体装置
の一例を示す側面、平面透視図である。
１，１１……放熱板、２……リード端子、３…
…半導体チツプ、４……金属細線、５……封止樹
脂、６……注入口、７……切欠部。
1 and 2 are side and plan perspective views showing an embodiment of the resin-sealed semiconductor device of the present invention, and FIGS. 3 and 4 each show an example of a conventional insulated resin-sealed semiconductor device. FIG. 3 is a side and plan perspective view. 1, 11... Heat sink, 2... Lead terminal, 3...
...Semiconductor chip, 4...Thin metal wire, 5...Sealing resin, 6...Inlet, 7...Notch.
Claims (1)
一端部を導電接続し前記放熱板と半導体チツプと
リード端子の一端部とを共に樹脂で封止した樹脂
封止半導体装置において、成形樹脂の注入口を前
記リード端子とは反対側の樹脂側面に設け且つ前
記放熱板は前記リード端子の一端部近傍に形成さ
れた切欠部を有することを特徴とする樹脂封止半
導体装置。 In a resin-sealed semiconductor device in which one end of a lead terminal is conductively connected to a semiconductor chip fixed to a heat sink, and the heat sink, the semiconductor chip, and one end of the lead terminal are sealed together with resin, an injection port for molded resin is connected. A resin-sealed semiconductor device characterized in that the heat dissipation plate has a notch provided on a side surface of the resin opposite to the lead terminal and formed near one end of the lead terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18570884U JPS61100147U (en) | 1984-12-07 | 1984-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18570884U JPS61100147U (en) | 1984-12-07 | 1984-12-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61100147U true JPS61100147U (en) | 1986-06-26 |
Family
ID=30743174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18570884U Pending JPS61100147U (en) | 1984-12-07 | 1984-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61100147U (en) |
-
1984
- 1984-12-07 JP JP18570884U patent/JPS61100147U/ja active Pending
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