JPS6413135U - - Google Patents
Info
- Publication number
- JPS6413135U JPS6413135U JP10867687U JP10867687U JPS6413135U JP S6413135 U JPS6413135 U JP S6413135U JP 10867687 U JP10867687 U JP 10867687U JP 10867687 U JP10867687 U JP 10867687U JP S6413135 U JPS6413135 U JP S6413135U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor device
- semiconductor element
- thin film
- metal thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の説明図で、ａは上面図、ｂは
金属薄膜部５の拡大図、ｃはｂのＡ−Ａ′線断面
図で実施例１の場合の図面、ｄはｃと同じくｂの
Ａ−Ａ′線断面図で実施例２の場合の図面である
。第２図は従来の半導体装置を表わし、ａは断面
図、ｂは側面図、ｃは上面図である。
１……半導体素子、２ａ，２ｂ……リードフレ
ーム、３……金属細線、４……樹脂、４ａ……樹
脂部に設けた凹部、５……金属薄膜、５ａ……金
属薄膜部に設けた凹部。
FIG. 1 is an explanatory view of the present invention, in which a is a top view, b is an enlarged view of the metal thin film portion 5, c is a cross-sectional view taken along line A-A' of b, and is a drawing in the case of Example 1, and d is c. It is a sectional view taken along the line A-A' of FIG. FIG. 2 shows a conventional semiconductor device, in which a is a cross-sectional view, b is a side view, and c is a top view. 1...Semiconductor element, 2a, 2b...Lead frame, 3...Metal thin wire, 4...Resin, 4a...Recess provided in resin part, 5...Metal thin film, 5a...Provided in metal thin film part recess.
Claims (1)
記半導体素子内の電極と前記リードフレームとを
金属細線により結線し、更に樹脂によりトランス
フアモールドして成る半導体装置において、モー
ルド表面に凹部を設け、更にその上に金属薄膜を
形成したことを特徴とする半導体装置。 In a semiconductor device in which a semiconductor element is mounted on a lead frame, electrodes in the semiconductor element and the lead frame are connected with thin metal wires, and transfer molded with resin, a recess is provided on the surface of the mold, and A semiconductor device characterized by having a metal thin film formed thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10867687U JPS6413135U (en) | 1987-07-14 | 1987-07-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10867687U JPS6413135U (en) | 1987-07-14 | 1987-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413135U true JPS6413135U (en) | 1989-01-24 |
Family
ID=31344235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10867687U Pending JPS6413135U (en) | 1987-07-14 | 1987-07-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413135U (en) |
-
1987
- 1987-07-14 JP JP10867687U patent/JPS6413135U/ja active Pending