JPH01102840U - - Google Patents
Info
- Publication number
- JPH01102840U JPH01102840U JP20055787U JP20055787U JPH01102840U JP H01102840 U JPH01102840 U JP H01102840U JP 20055787 U JP20055787 U JP 20055787U JP 20055787 U JP20055787 U JP 20055787U JP H01102840 U JPH01102840 U JP H01102840U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- molded body
- sensitive element
- metal molded
- temperature sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Description
第1図aは本考案の一実施例を示す表面温セン
サの正面図、第1図bは同表面温センサの金属成
形体の平面図および正面図、第1図cは同表面温
センサの金属成形体の感熱素子を固定した部品の
正面図、第1図dは同表面温センサの感熱素子ユ
ニツトの正面図および側面断面図、第2図は従来
の表面温センサの正面図である。
1……感熱素子、2A,2B……素子リード線
、3……金属成形体、3a……切欠き部、4……
固定剤、5……耐熱性成形体、5a……切欠き溝
、6……固定剤、7……感熱素子ユニツト、8…
…樹脂ケース、8a……凹部、12……保護テー
プ。
Figure 1a is a front view of a surface temperature sensor showing an embodiment of the present invention, Figure 1b is a plan view and front view of a metal molded body of the surface temperature sensor, and Figure 1c is a front view of the surface temperature sensor. FIG. 1d is a front view and side sectional view of a heat-sensitive element unit of the same surface temperature sensor, and FIG. 2 is a front view of a conventional surface temperature sensor. DESCRIPTION OF SYMBOLS 1...Heat-sensitive element, 2A, 2B...Element lead wire, 3...Metal molded body, 3a...Notch, 4...
Fixing agent, 5... Heat-resistant molded body, 5a... Notch groove, 6... Fixing agent, 7... Heat-sensitive element unit, 8...
...resin case, 8a...recess, 12...protective tape.
Claims (1)
し、保護テープを上記感熱素子ユニツトと上記樹
脂ケースとにわたつて捲回して上記感熱素子ユニ
ツトを固定した表面温センサであつて、上記感熱
素子ユニツトを、熱伝導性の良好な金属成形体と
、この金属成形体の切欠き部にはめ込まれ、その
基板面と上記金属成形体の上面とが同一面になる
ように固定された感熱素子と、その上面に形成さ
れた切欠き溝にこれらの感熱素子および金属成形
体が収納され、その上面と上記金属成形体の上面
とが同一面になるように固定された、弾力性を持
つ耐熱性成形体とで構成した表面温センサ。 A surface temperature sensor in which a heat-sensitive element unit is housed in a recess of a resin case, and a protective tape is wound around the heat-sensitive element unit and the resin case to fix the heat-sensitive element unit. , a metal molded body with good thermal conductivity, a heat-sensitive element fitted into a notch of the metal molded body and fixed so that the substrate surface and the top surface of the metal molded body are flush with each other; A heat-resistant molded body having elasticity, in which the heat-sensitive element and the metal molded body are housed in a notch groove formed in the upper surface, and the upper surface of the heat-sensitive element and the metal molded body are fixed so that they are flush with the upper surface of the metal molded body. A surface temperature sensor consisting of
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20055787U JPH01102840U (en) | 1987-12-28 | 1987-12-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20055787U JPH01102840U (en) | 1987-12-28 | 1987-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01102840U true JPH01102840U (en) | 1989-07-11 |
Family
ID=31490959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20055787U Pending JPH01102840U (en) | 1987-12-28 | 1987-12-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01102840U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021009066A (en) * | 2019-07-01 | 2021-01-28 | 株式会社八洲測器 | Wafer type temperature sensor |
-
1987
- 1987-12-28 JP JP20055787U patent/JPH01102840U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021009066A (en) * | 2019-07-01 | 2021-01-28 | 株式会社八洲測器 | Wafer type temperature sensor |
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