JPS61183541U - - Google Patents
Info
- Publication number
- JPS61183541U JPS61183541U JP6705385U JP6705385U JPS61183541U JP S61183541 U JPS61183541 U JP S61183541U JP 6705385 U JP6705385 U JP 6705385U JP 6705385 U JP6705385 U JP 6705385U JP S61183541 U JPS61183541 U JP S61183541U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- circuit board
- circuit pattern
- sealing structure
- seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 4
- 238000001721 transfer moulding Methods 0.000 claims 1
- 239000003566 sealing material Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、本考案のワイヤーボンデイングによ
る半導体素子の封止構造の断面図。第２図は、従
来例のワイヤーボンデイングによる半導体素子の
封止構造の断面図。第３図は、本考案のフエース
ダウンボンデイングによる半導体素子の封止構造
の断面図。第４図及び第５図は、本考案の回路基
板の貫通穴形状の実施例を示す平面図である。
１……半導体素子、２……配線ワイヤー、３…
…回路パターン、４……回路基板、５……封止材
、６……貫通穴、７……接続パツド。
FIG. 1 is a cross-sectional view of a semiconductor element sealing structure using wire bonding according to the present invention. FIG. 2 is a cross-sectional view of a conventional sealing structure for a semiconductor element using wire bonding. FIG. 3 is a cross-sectional view of a semiconductor element sealing structure using face-down bonding according to the present invention. 4 and 5 are plan views showing examples of the through-hole shapes of the circuit board of the present invention. 1...Semiconductor element, 2...Wiring wire, 3...
...Circuit pattern, 4...Circuit board, 5...Sealing material, 6...Through hole, 7...Connection pad.
Claims (1)
回路基板において、前記半導体素子の端子と回路
パターンとの電気的接続部の封止にトランスフア
成形を用い、且つ半導体素子周囲の前記回路基板
には貫通穴を設けることを特徴とする半導体素子
封止構造。 In a rigid circuit board having a semiconductor element and a circuit pattern, transfer molding is used to seal the electrical connection between the terminal of the semiconductor element and the circuit pattern, and through holes are formed in the circuit board around the semiconductor element. A semiconductor element sealing structure characterized by providing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6705385U JPS61183541U (en) | 1985-05-07 | 1985-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6705385U JPS61183541U (en) | 1985-05-07 | 1985-05-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61183541U true JPS61183541U (en) | 1986-11-15 |
Family
ID=30600515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6705385U Pending JPS61183541U (en) | 1985-05-07 | 1985-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61183541U (en) |
-
1985
- 1985-05-07 JP JP6705385U patent/JPS61183541U/ja active Pending