JPS6166973U - - Google Patents

Info

Publication number
JPS6166973U
JPS6166973U JP15099884U JP15099884U JPS6166973U JP S6166973 U JPS6166973 U JP S6166973U JP 15099884 U JP15099884 U JP 15099884U JP 15099884 U JP15099884 U JP 15099884U JP S6166973 U JPS6166973 U JP S6166973U
Authority
JP
Japan
Prior art keywords
base material
pattern
circuit board
printed circuit
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15099884U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15099884U priority Critical patent/JPS6166973U/ja
Publication of JPS6166973U publication Critical patent/JPS6166973U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す斜視図、第2
図および第3図は従来のフレキシブルプリント基
板の説明図である。 図中、1はフレキシブルプリント基板、11は
ベース材、12は導電パターン、13はその熱圧
着部、14は貫通孔である。
Fig. 1 is a perspective view showing one embodiment of the present invention;
FIG. 3 and FIG. 3 are explanatory diagrams of a conventional flexible printed circuit board. In the figure, 1 is a flexible printed circuit board, 11 is a base material, 12 is a conductive pattern, 13 is a thermocompression bonded portion thereof, and 14 is a through hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 柔軟なフイルム状ベース材に導電パターンを接
着し、且つ該パターンの熱圧着部中央に該ベース
材をも貫通する貫通孔を形成してなることを特徴
とするフレキシブルプリント基板。
1. A flexible printed circuit board, characterized in that a conductive pattern is bonded to a flexible film-like base material, and a through hole that also penetrates the base material is formed in the center of the thermocompression bonded part of the pattern.
JP15099884U 1984-10-05 1984-10-05 Pending JPS6166973U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15099884U JPS6166973U (en) 1984-10-05 1984-10-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15099884U JPS6166973U (en) 1984-10-05 1984-10-05

Publications (1)

Publication Number Publication Date
JPS6166973U true JPS6166973U (en) 1986-05-08

Family

ID=30709130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15099884U Pending JPS6166973U (en) 1984-10-05 1984-10-05

Country Status (1)

Country Link
JP (1) JPS6166973U (en)

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