JPH01133766U - - Google Patents
Info
- Publication number
- JPH01133766U JPH01133766U JP3066888U JP3066888U JPH01133766U JP H01133766 U JPH01133766 U JP H01133766U JP 3066888 U JP3066888 U JP 3066888U JP 3066888 U JP3066888 U JP 3066888U JP H01133766 U JPH01133766 U JP H01133766U
- Authority
- JP
- Japan
- Prior art keywords
- packaged
- resin part
- resin
- mounting
- embedded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図ａ，ｂは電子部品パツケージの一実施例
の正面図と側面図、第２図はその電子部品パツケ
ージの基板への取付け状態を示す正面図、第３図
ａ，ｂ，ｃは取付け部材の平面図、正面図、側面
図、第４図は被パツケージ部材の一実施例の斜視
図、第５図はその被パツケージ部材を取付け部材
に取付けた状態を示す正面図、第６図ａ，ｂは電
子部品パツケージの製造工程を示す横断面図と平
断面図、第７図は従来の電子部品パツケージの製
造工程を示す横断面図、第８図ａ，ｂは従来の電
子部品パツケージの正面図と側面図、第９図はそ
の電子部品パツケージの基板への取付け状態を示
す説明図である。
１……取付け部材、１ａ……取付面、２……被
パツケージ部材、３……樹脂部、４……型枠、１
０……埋設部、２３……端子。
Figures 1 a and b are front and side views of an embodiment of the electronic component package, Figure 2 is a front view showing how the electronic component package is attached to the board, and Figure 3 a, b, and c are the mounting 4 is a perspective view of an embodiment of the packaged member; FIG. 5 is a front view showing the packaged member attached to the mounting member; FIG. 6a , b are cross-sectional views and plan sectional views showing the manufacturing process of an electronic component package, FIG. 7 is a cross-sectional view showing the manufacturing process of a conventional electronic component package, and FIGS. 8 a and b are cross-sectional views of a conventional electronic component package. A front view, a side view, and FIG. 9 are explanatory diagrams showing how the electronic component package is attached to the board. DESCRIPTION OF SYMBOLS 1... Mounting member, 1a... Mounting surface, 2... Packaged member, 3... Resin part, 4... Formwork, 1
0... Buried part, 23... Terminal.
Claims (1)
てパツケージされた被パツケージ部材と、該被パ
ツケージ部材の端子の突出側に配設され、取付面
が樹脂部外面より外側に設けられた取付け部材と
、該取付け部材に設けられ、前記樹脂部内に埋設
固定された埋設部と、を備えた電子部品パツケー
ジ。 A packaged member that is packaged with resin with a terminal protruding outward from the resin part, and a mounting member that is disposed on the terminal protruding side of the packaged member and has a mounting surface outside the outer surface of the resin part. and an embedded part provided on the mounting member and embedded and fixed in the resin part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3066888U JPH01133766U (en) | 1988-03-08 | 1988-03-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3066888U JPH01133766U (en) | 1988-03-08 | 1988-03-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01133766U true JPH01133766U (en) | 1989-09-12 |
Family
ID=31255930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3066888U Pending JPH01133766U (en) | 1988-03-08 | 1988-03-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01133766U (en) |
-
1988
- 1988-03-08 JP JP3066888U patent/JPH01133766U/ja active Pending