JPH0173949U - - Google Patents
Info
- Publication number
- JPH0173949U JPH0173949U JP1987169211U JP16921187U JPH0173949U JP H0173949 U JPH0173949 U JP H0173949U JP 1987169211 U JP1987169211 U JP 1987169211U JP 16921187 U JP16921187 U JP 16921187U JP H0173949 U JPH0173949 U JP H0173949U
- Authority
- JP
- Japan
- Prior art keywords
- circuit package
- integrated circuit
- wiring board
- printed wiring
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図は本考案の実施例に係る集積回路パツケ
ージのリード線を示す斜視図、第2図は本考案の
実施例に係る集積回路パツケージのリード線を示
す要部拡大図、第3図は従来の集積回路パツケー
ジのリード線を示す第1図相当図、第4図は従来
の集積回路パツケージのリード線を示す第2図相
当図である。
図中、1はパツケージ、2はリード線、3,5
は係合部、4はプリント配線板、4aは取付け孔
である。尚、図中同一符号は同一または相当部分
を示す。
FIG. 1 is a perspective view showing lead wires of an integrated circuit package according to an embodiment of the present invention, FIG. 2 is an enlarged view of main parts showing lead wires of an integrated circuit package according to an embodiment of the present invention, and FIG. 1 is a view corresponding to FIG. 1 showing lead wires of a conventional integrated circuit package, and FIG. 4 is a view corresponding to FIG. 2 showing lead wires of a conventional integrated circuit package. In the figure, 1 is the package, 2 is the lead wire, 3, 5
4 is an engaging portion, 4 is a printed wiring board, and 4a is a mounting hole. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
れ、プリント配線板の取付け孔に挿着する集積回
路パツケージのリード線において、これらリード
線の少なくとも1のリード線の外周に、取付け孔
に係止し集積回路パツケージをプリント配線板よ
り上位に位置決め固定する先細り状のテーパ係止
部を膨出形成したことを特徴とする集積回路パツ
ケージのリード線。 A plurality of lead wires of the integrated circuit package are formed extending downward from the integrated circuit package and are inserted into the mounting holes of the printed wiring board. A lead wire for an integrated circuit package, characterized in that a tapered locking portion is formed in a bulging manner to position and fix the circuit package above a printed wiring board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987169211U JPH0173949U (en) | 1987-11-05 | 1987-11-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987169211U JPH0173949U (en) | 1987-11-05 | 1987-11-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0173949U true JPH0173949U (en) | 1989-05-18 |
Family
ID=31459064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987169211U Pending JPH0173949U (en) | 1987-11-05 | 1987-11-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0173949U (en) |
-
1987
- 1987-11-05 JP JP1987169211U patent/JPH0173949U/ja active Pending