JPS61144653U - - Google Patents

Info

Publication number
JPS61144653U
JPS61144653U JP2783585U JP2783585U JPS61144653U JP S61144653 U JPS61144653 U JP S61144653U JP 2783585 U JP2783585 U JP 2783585U JP 2783585 U JP2783585 U JP 2783585U JP S61144653 U JPS61144653 U JP S61144653U
Authority
JP
Japan
Prior art keywords
spring material
electronic component
heat sink
receiving member
printed board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2783585U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2783585U priority Critical patent/JPS61144653U/ja
Publication of JPS61144653U publication Critical patent/JPS61144653U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す構成図、第2
図は第1図の装置の説明図、第3図は従来装置の
構成図である。 1……電子部品、2……ヒートシンク、3……
ばね材、6……ガイド、7……受け部材。
Fig. 1 is a configuration diagram showing one embodiment of the present invention;
The figure is an explanatory diagram of the device shown in FIG. 1, and FIG. 3 is a configuration diagram of the conventional device. 1...Electronic component, 2...Heat sink, 3...
Spring material, 6...guide, 7...receiving member.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント板にマウントされるヒートシンクと、
該ヒートシンクに電子部品を押圧固定するばね材
とを備えた電子部品の取付装置において、前記ヒ
ートシンクに前記ばね材の位置を定めるガイドと
、前記ばね材をプリント板と略平行に支持する受
け部材と、この受け部材に前記ばね材を固定する
固定手段とを設けたことを特徴とする電子部品の
取付位置。
A heat sink mounted on a printed board,
The electronic component mounting device includes a spring material that presses and fixes the electronic component to the heat sink, a guide that positions the spring material on the heat sink, and a receiving member that supports the spring material substantially parallel to a printed board. A mounting position for an electronic component, characterized in that a fixing means for fixing the spring material to the receiving member is provided.
JP2783585U 1985-02-27 1985-02-27 Pending JPS61144653U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2783585U JPS61144653U (en) 1985-02-27 1985-02-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2783585U JPS61144653U (en) 1985-02-27 1985-02-27

Publications (1)

Publication Number Publication Date
JPS61144653U true JPS61144653U (en) 1986-09-06

Family

ID=30525156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2783585U Pending JPS61144653U (en) 1985-02-27 1985-02-27

Country Status (1)

Country Link
JP (1) JPS61144653U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015216264A (en) * 2014-05-12 2015-12-03 富士電機株式会社 Fixing member of heating element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015216264A (en) * 2014-05-12 2015-12-03 富士電機株式会社 Fixing member of heating element

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