JPH022860U - - Google Patents
Info
- Publication number
- JPH022860U JPH022860U JP8029188U JP8029188U JPH022860U JP H022860 U JPH022860 U JP H022860U JP 8029188 U JP8029188 U JP 8029188U JP 8029188 U JP8029188 U JP 8029188U JP H022860 U JPH022860 U JP H022860U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- eliminates
- utility
- need
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示す概略斜視図、
第２図は第１図の実装状態でのＡ―Ａ′線断面図
、第３図は他の実施例の側面図、第４図は第３図
のＢ―Ｂ線縦断面図である。
１……半導体素子、２……半導体素子リード、
３……リード治具、５……プリント基板、６……
半導体素子リード、７……ストツパー、８……プ
リント基板ストツパー。
FIG. 1 is a schematic perspective view showing an embodiment of the present invention;
2 is a sectional view taken along line AA' in the mounted state of FIG. 1, FIG. 3 is a side view of another embodiment, and FIG. 4 is a longitudinal sectional view taken along line BB of FIG. 3. 1...Semiconductor element, 2...Semiconductor element lead,
3...Lead jig, 5...Printed circuit board, 6...
Semiconductor element lead, 7... stopper, 8... printed circuit board stopper.
Claims (1)
用することにより半田付を不要とする半導体素子
リード治具。 This invention is a semiconductor device lead jig that eliminates the need for soldering by using a leaf spring when mounting semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8029188U JPH022860U (en) | 1988-06-16 | 1988-06-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8029188U JPH022860U (en) | 1988-06-16 | 1988-06-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH022860U true JPH022860U (en) | 1990-01-10 |
Family
ID=31305122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8029188U Pending JPH022860U (en) | 1988-06-16 | 1988-06-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH022860U (en) |
-
1988
- 1988-06-16 JP JP8029188U patent/JPH022860U/ja active Pending
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