JPS5869980U - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPS5869980U JPS5869980U JP16575281U JP16575281U JPS5869980U JP S5869980 U JPS5869980 U JP S5869980U JP 16575281 U JP16575281 U JP 16575281U JP 16575281 U JP16575281 U JP 16575281U JP S5869980 U JPS5869980 U JP S5869980U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- substrate
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Tests Of Electronic Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は本考案混成集積回路装置の一実施例を示すもので
、第１図は電子部品を分離した状態の斜視図で、第２図
は電子部品の一部が未塔載な状態の側面図である。
１・・・・・・基板、２・・・・・・膜回路（導体部）
、２′・・・・・・膜回路（抵抗体部）、３・・・・・
・電子部品、４・・・・・・電子部品の塔載場所、５・
・・・・・孔。The drawings show an embodiment of the hybrid integrated circuit device of the present invention. Figure 1 is a perspective view with electronic components separated, and Figure 2 is a side view with some electronic components not mounted. It is. 1...Substrate, 2...Membrane circuit (conductor part)
, 2'...Membrane circuit (resistor part), 3...
・Electronic parts, 4...Location for electronic parts, 5.
...hole.
Claims (1)
続して構成される混成集積回路装置において、前記基板
上に形成された膜回路間の電子部品を塔載すべき場所の
一部に前記基板を貫通する孔を穿設したことを特徴とす
−る混成集積回路装置。In a hybrid integrated circuit device configured by mounting and connecting electronic components between membrane circuits formed on a substrate, one of the locations where electronic components are to be mounted between the membrane circuits formed on the substrate 1. A hybrid integrated circuit device, characterized in that a hole penetrating the substrate is formed in the portion thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16575281U JPS5869980U (en) | 1981-11-06 | 1981-11-06 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16575281U JPS5869980U (en) | 1981-11-06 | 1981-11-06 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5869980U true JPS5869980U (en) | 1983-05-12 |
Family
ID=29957939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16575281U Pending JPS5869980U (en) | 1981-11-06 | 1981-11-06 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5869980U (en) |
-
1981
- 1981-11-06 JP JP16575281U patent/JPS5869980U/en active Pending
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