JPS60181041U - Hybrid integrated circuit device - Google Patents

Hybrid integrated circuit device

Info

Publication number
JPS60181041U
JPS60181041U JP6849284U JP6849284U JPS60181041U JP S60181041 U JPS60181041 U JP S60181041U JP 6849284 U JP6849284 U JP 6849284U JP 6849284 U JP6849284 U JP 6849284U JP S60181041 U JPS60181041 U JP S60181041U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
board
mounted components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6849284U
Other languages
Japanese (ja)
Inventor
廣江 敏夫
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP6849284U priority Critical patent/JPS60181041U/en
Publication of JPS60181041U publication Critical patent/JPS60181041U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す構成図、第2図、第3
図は押えバネと枠との組合せ例を示す分解斜視図である
。 1・・・基板、2・・・搭載部品、3・・・枠、4・・
・押えバネ。
Fig. 1 is a configuration diagram showing an embodiment of the present invention, Fig. 2, Fig. 3
The figure is an exploded perspective view showing an example of a combination of a presser spring and a frame. 1... Board, 2... Mounted components, 3... Frame, 4...
- Presser spring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードレス基板に搭載部品の位置決め周枠を取付け、か
つ該粋に搭載部品を基板に押圧する押えバネを設けたこ
とを特徴とする混成集積回路装置。
A hybrid integrated circuit device, characterized in that a peripheral frame for positioning mounted components is attached to a leadless board, and a presser spring is provided for pressing the mounted components against the board.
JP6849284U 1984-05-10 1984-05-10 Hybrid integrated circuit device Pending JPS60181041U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6849284U JPS60181041U (en) 1984-05-10 1984-05-10 Hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6849284U JPS60181041U (en) 1984-05-10 1984-05-10 Hybrid integrated circuit device

Publications (1)

Publication Number Publication Date
JPS60181041U true JPS60181041U (en) 1985-12-02

Family

ID=30603291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6849284U Pending JPS60181041U (en) 1984-05-10 1984-05-10 Hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPS60181041U (en)

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