JPH0444177U - - Google Patents
Info
- Publication number
- JPH0444177U JPH0444177U JP8620990U JP8620990U JPH0444177U JP H0444177 U JPH0444177 U JP H0444177U JP 8620990 U JP8620990 U JP 8620990U JP 8620990 U JP8620990 U JP 8620990U JP H0444177 U JPH0444177 U JP H0444177U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- printed board
- multilayer printed
- terminal
- row
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は一実施例の多層プリント板のスルーホ
ール部の断面図。第２図は一実施例の多層プリン
ト板の斜視図、第３図は一実施例の多層プリント
板にＩＣを取り付ける状態を示す図である。
１……多層プリント板、２……パターン配線、
２ａ〜２ｐ……パツド、４……給電パターン、５
……接地パターン、６……ＩＣ、６ａ〜６ｐ……
端子、８，９……スルーホール、１０……メツキ
層、Ａ，Ｂ……パツド列、Ａ′，Ｂ′……矢印の
方向。
FIG. 1 is a sectional view of a through-hole portion of a multilayer printed board according to an embodiment. FIG. 2 is a perspective view of a multilayer printed board according to one embodiment, and FIG. 3 is a diagram showing a state in which an IC is attached to the multilayer printed board according to one embodiment. 1...Multilayer printed board, 2...Pattern wiring,
2a to 2p... Padded, 4... Power supply pattern, 5
...Grounding pattern, 6...IC, 6a-6p...
Terminal, 8, 9... Through hole, 10... Plating layer, A, B... Pad row, A', B'... Direction of arrow.
Claims (1)
子が所定ピツチで列状に配設された集積回路素子
を実装する多層プリント板において、 前記集積回路素子の端子位置に対応する位置に
形成されたパツド列と、該パツド列のなかで前記
電源供給端子が接続されたパツドは前記パツド列
の延長方向に所定幅延長されたパツドパターンを
有し、該パツドパターンにはスルーホールが形成
され、前記多層プリント板内又は地面に形成され
た電源層パターンと電気的に接続されていること
を特徴とする多層プリント板。 (2) 前記パツドパターンは不用半田除去用パツ
ドであることを特徴とする請求項１記載の多層プ
リント板。[Claims for Utility Model Registration] (1) In a multilayer printed board on which an integrated circuit element is mounted, the terminal terminal is a power supply terminal and a large number of terminals are arranged in a row at a predetermined pitch, A pad row formed at a position corresponding to a terminal position, and a pad to which the power supply terminal is connected in the pad row have a pad pattern extended by a predetermined width in the extending direction of the pad row, A multilayer printed board, characterized in that a through hole is formed and electrically connected to a power layer pattern formed within the multilayer printed board or on the ground. (2) The multilayer printed board according to claim 1, wherein the pad pattern is a pad for removing unnecessary solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990086209U JPH08779Y2 (en) | 1990-08-16 | 1990-08-16 | Multilayer printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990086209U JPH08779Y2 (en) | 1990-08-16 | 1990-08-16 | Multilayer printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0444177U true JPH0444177U (en) | 1992-04-15 |
| JPH08779Y2 JPH08779Y2 (en) | 1996-01-10 |
Family
ID=31817758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990086209U Expired - Fee Related JPH08779Y2 (en) | 1990-08-16 | 1990-08-16 | Multilayer printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08779Y2 (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5429055A (en) * | 1977-08-09 | 1979-03-03 | Shindo Denshi Kougiyou Kk | Method of making print wiring substrate |
| JPS56148840A (en) * | 1980-04-22 | 1981-11-18 | Citizen Watch Co Ltd | Mounting structure for ic |
| JPS61182096U (en) * | 1985-05-07 | 1986-11-13 | ||
| JPS62184774U (en) * | 1986-05-15 | 1987-11-24 | ||
| JPS6379064U (en) * | 1986-11-11 | 1988-05-25 | ||
| JPS6437079U (en) * | 1987-08-31 | 1989-03-06 | ||
| JPH0216035A (en) * | 1988-07-05 | 1990-01-19 | Kubota Ltd | Manufacture of frp molding with nonuniform diameter hole |
-
1990
- 1990-08-16 JP JP1990086209U patent/JPH08779Y2/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5429055A (en) * | 1977-08-09 | 1979-03-03 | Shindo Denshi Kougiyou Kk | Method of making print wiring substrate |
| JPS56148840A (en) * | 1980-04-22 | 1981-11-18 | Citizen Watch Co Ltd | Mounting structure for ic |
| JPS61182096U (en) * | 1985-05-07 | 1986-11-13 | ||
| JPS62184774U (en) * | 1986-05-15 | 1987-11-24 | ||
| JPS6379064U (en) * | 1986-11-11 | 1988-05-25 | ||
| JPS6437079U (en) * | 1987-08-31 | 1989-03-06 | ||
| JPH0216035A (en) * | 1988-07-05 | 1990-01-19 | Kubota Ltd | Manufacture of frp molding with nonuniform diameter hole |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08779Y2 (en) | 1996-01-10 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |