JPH0242470U

JPH0242470U -

Info

Publication number: JPH0242470U
Application number: JP12077088U
Authority: JP
Priority date: 1988-09-15
Filing date: 1988-09-15
Publication date: 1990-03-23

Description

[Brief explanation of drawings]

第１図は、本考案の第１の実施例の部分平面図
、第２図は、本考案の第１の実施例の断面図、第
３図は、本考案の第１の実施例の略全体平面図、
第４図は、本考案の第２の実施例の平面図、第５
図は、本考案の第２の実施例の断面図、第６図は
、本考案の第３の実施例の平面図、第７図、第８
図、第９図は、従来例の平面図。１，２１，３１，４１……第１のプリント基板
、２，２２，３２，４２……第２のプリント基板
、３，２３，３３，４３……第１のプリント基板
の接続用銅箔露出部、３′，２３′，３３′……
第１のプリント基板の導電パターン、４，２４，
３４，４４，４４′，４４″……第２のプリント
基板の接続用銅箔露出部、４′，２４′３４′…
…第２のプリント基板の導電パターン、５，２５
，３５……第１のプリント基板のスルーホール、
６，２６，３６，３６′，４９……第２のプリン
ト基板のスルーホール、７，７′，２７，３７…
…第１のプリント基板のレジスト、８，８′，２
８，３８……第２のプリント基板のレジスト、９
，２９……半田、３９……円弧状切欠部、４５…
…第１のプリント基板の位置決め穴、４６……第
２のプリント基板の位置決め穴、４７……位置決
め用部品、４８……位置決め用突起、４９′，５
０……スルーホールの壁。 FIG. 1 is a partial plan view of the first embodiment of the present invention, FIG. 2 is a sectional view of the first embodiment of the present invention, and FIG. 3 is a schematic diagram of the first embodiment of the present invention. Overall floor plan,
FIG. 4 is a plan view of the second embodiment of the present invention;
The figures are a cross-sectional view of the second embodiment of the present invention, FIG. 6 is a plan view of the third embodiment of the present invention, and FIGS.
FIG. 9 is a plan view of a conventional example. 1, 21, 31, 41...first printed board, 2,22,32,42...second printed board, 3,23,33,43...exposed copper foil for connection of first printed board Part, 3', 23', 33'...
Conductive pattern on first printed circuit board, 4, 24,
34, 44, 44', 44''...exposed copper foil part for connection of second printed circuit board, 4', 24'34'...
...Conductive pattern on second printed circuit board, 5, 25
, 35...Through hole of the first printed circuit board,
6, 26, 36, 36', 49...Through holes of the second printed circuit board, 7, 7', 27, 37...
...Resist of the first printed circuit board, 8, 8', 2
8, 38...Resist of second printed circuit board, 9
, 29...Solder, 39...Circular notch, 45...
... Positioning hole of first printed circuit board, 46 ... Positioning hole of second printed circuit board, 47 ... Positioning component, 48 ... Positioning protrusion, 49', 5
0...Through-hole wall.

Claims

[Claims for Utility Model Registration] (1) In a device in which an exposed copper foil portion of a first printed circuit board and an exposed copper foil portion of a second printed circuit board are overlapped and connected, the first printed circuit board Through-hole processing was applied to the exposed area of the connecting copper foil of the second printed circuit board, or through-hole processing was applied to the end of the exposed area of the connecting copper foil of the second printed circuit board. A positioning structure for a printed circuit board, characterized in that an arc-shaped notch is provided, and the above-mentioned through holes are provided in a positional relationship such that when the centers of the notches are aligned at the time of connection, a proper connection position is obtained. (2) The center hole diameter of the through hole formed in the exposed connection copper foil part of the first printed circuit board is the same as the diameter of the through hole formed in the exposed connection copper foil part of the second printed circuit board or the end of the exposed connection copper foil part of the second printed circuit board. 2. The printed circuit board positioning structure according to claim 1, wherein the diameter of the hole is equal to or smaller than the center hole diameter of the hole.