JPH01162280U - - Google Patents
Info
- Publication number
- JPH01162280U JPH01162280U JP5569988U JP5569988U JPH01162280U JP H01162280 U JPH01162280 U JP H01162280U JP 5569988 U JP5569988 U JP 5569988U JP 5569988 U JP5569988 U JP 5569988U JP H01162280 U JPH01162280 U JP H01162280U
- Authority
- JP
- Japan
- Prior art keywords
- insulating material
- copper foil
- adhesive layer
- material board
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000006096 absorbing agent Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
第１図Ａ及び第１図Ｂは本考案の一実施例を示
す図であつて、第１図Ａはその平面図、第１図Ｂ
は第１図に示すＦＰＣの正面図、第２図Ａ及び第
２図Ｂは従来のＦＰＣをそれぞれ示す平面図と正
面図である。
５……絶縁素材板、６……銅箔、７……接着剤
層。
1A and 1B are diagrams showing one embodiment of the present invention, in which FIG. 1A is a plan view thereof, and FIG. 1B is a diagram showing an embodiment of the present invention.
is a front view of the FPC shown in FIG. 1, and FIGS. 2A and 2B are a plan view and a front view, respectively, of a conventional FPC. 5... Insulating material board, 6... Copper foil, 7... Adhesive layer.
Claims (1)
箔と、該銅箔を絶縁素材板上に接着する接着剤層
とから構成されてなり、 前記接着剤層は、前記絶縁素材板上に一面に設
けられたものであり、かつ、その成分中には、前
記銅箔部分と比較して多く光を吸収する光吸収剤
が含有されていることを特徴とする銅張り積層板
。[Claims for Utility Model Registration] Consisting of an insulating material board as a base, a copper foil forming a circuit, and an adhesive layer for bonding the copper foil onto the insulating material board, the adhesive layer being , which is provided on one surface of the insulating material plate, and is characterized in that its components include a light absorbing agent that absorbs more light than the copper foil portion. Copper-clad laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5569988U JPH01162280U (en) | 1988-04-25 | 1988-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5569988U JPH01162280U (en) | 1988-04-25 | 1988-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01162280U true JPH01162280U (en) | 1989-11-10 |
Family
ID=31281603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5569988U Pending JPH01162280U (en) | 1988-04-25 | 1988-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01162280U (en) |
-
1988
- 1988-04-25 JP JP5569988U patent/JPH01162280U/ja active Pending