JPS61129379U - - Google Patents
Info
- Publication number
- JPS61129379U JPS61129379U JP1289085U JP1289085U JPS61129379U JP S61129379 U JPS61129379 U JP S61129379U JP 1289085 U JP1289085 U JP 1289085U JP 1289085 U JP1289085 U JP 1289085U JP S61129379 U JPS61129379 U JP S61129379U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- copper
- thickness
- base plate
- clad laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000002655 kraft paper Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000000123 paper Substances 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
図はこの考案の一実施例を示した一部拡大断面
図である。
図中、１は下地板、２は接着剤層、３は銅箔で
ある。
The figure is a partially enlarged sectional view showing an embodiment of this invention. In the figure, 1 is a base plate, 2 is an adhesive layer, and 3 is a copper foil.
Claims (1)
基材をフエノール樹脂もしくはエポキシ樹脂等を
接着剤として積層してなる下地板の両面に接着剤
層を介して銅箔を張り合せた印刷回路用銅張積層
板において、 上記接着剤層の厚みを４０μｍ以上としたこと
を特徴とする印刷回路用銅張積層板。 (2) 実用新案登録請求の範囲(1)において、上記
接着剤層の厚みは、好ましくは４０〜５０μｍで
あることを特徴とする印刷回路用銅張積層板。[Scope of Claim for Utility Model Registration] (1) A base plate made of linter paper, kraft paper, etc. as a base material, and laminated with phenol resin, epoxy resin, etc. as an adhesive, with an adhesive layer on both sides of the base plate. A copper-clad laminate for a printed circuit, comprising a copper foil laminated with copper foil, characterized in that the adhesive layer has a thickness of 40 μm or more. (2) The copper-clad laminate for printed circuits according to claim (1), wherein the thickness of the adhesive layer is preferably 40 to 50 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1289085U JPS61129379U (en) | 1985-01-31 | 1985-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1289085U JPS61129379U (en) | 1985-01-31 | 1985-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61129379U true JPS61129379U (en) | 1986-08-13 |
Family
ID=30496383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1289085U Pending JPS61129379U (en) | 1985-01-31 | 1985-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61129379U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4829790A (en) * | 1971-08-21 | 1973-04-19 | ||
| JPS58194390A (en) * | 1974-07-01 | 1983-11-12 | デイナミ−ト・ノ−ベル・アクチエンゲゼルシヤフト | Laminated mold for producing printed circuit board |
| JPS6242788A (en) * | 1985-08-15 | 1987-02-24 | Tokico Ltd | Water producer for rescue |
-
1985
- 1985-01-31 JP JP1289085U patent/JPS61129379U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4829790A (en) * | 1971-08-21 | 1973-04-19 | ||
| JPS58194390A (en) * | 1974-07-01 | 1983-11-12 | デイナミ−ト・ノ−ベル・アクチエンゲゼルシヤフト | Laminated mold for producing printed circuit board |
| JPS6242788A (en) * | 1985-08-15 | 1987-02-24 | Tokico Ltd | Water producer for rescue |
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