JPS5837174U - Substrate for printed wiring board - Google Patents
Substrate for printed wiring boardInfo
- Publication number
- JPS5837174U JPS5837174U JP13127581U JP13127581U JPS5837174U JP S5837174 U JPS5837174 U JP S5837174U JP 13127581 U JP13127581 U JP 13127581U JP 13127581 U JP13127581 U JP 13127581U JP S5837174 U JPS5837174 U JP S5837174U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- substrate
- laminate
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は本考案による印刷配線板の一実施例を示す断面図
である。
１・・・銅箔、２・・・積層板、３・・・ドライフィル
ム、４・・・紫外線防止保護シート。The drawing is a sectional view showing an embodiment of a printed wiring board according to the present invention. 1...Copper foil, 2...Laminated board, 3...Dry film, 4...UV protection sheet.
Claims (3)
て紫外線防止保護シート層を設けたことを特徴とする印
刷配線板用基板。(1) A substrate for a printed wiring board, characterized in that a UV protection protective sheet layer is provided on the upper and lower surfaces of a copper-clad laminate via a dry film.
ることを特徴とする実用新案登録請求の範囲第１項記載
の印刷配線板用基板。(2) The printed wiring board substrate according to claim 1, wherein the copper clad laminate has a copper foil thickness of 0.5 to 5 microns.
ことを特徴とする実用新案登録請求の範囲第１項又は第
２項記戦の印刷配線板用基板。(3) A substrate for a printed wiring board according to claim 1 or 2 of the utility model registration claim, characterized in that the laminate is a glass cloth-based epoxy resin laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13127581U JPS5837174U (en) | 1981-09-02 | 1981-09-02 | Substrate for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13127581U JPS5837174U (en) | 1981-09-02 | 1981-09-02 | Substrate for printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5837174U true JPS5837174U (en) | 1983-03-10 |
Family
ID=29924866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13127581U Pending JPS5837174U (en) | 1981-09-02 | 1981-09-02 | Substrate for printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5837174U (en) |
-
1981
- 1981-09-02 JP JP13127581U patent/JPS5837174U/en active Pending
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