JPS5933270U - Substrate for flexible wiring board - Google Patents

Substrate for flexible wiring board

Info

Publication number
JPS5933270U
JPS5933270U JP12772782U JP12772782U JPS5933270U JP S5933270 U JPS5933270 U JP S5933270U JP 12772782 U JP12772782 U JP 12772782U JP 12772782 U JP12772782 U JP 12772782U JP S5933270 U JPS5933270 U JP S5933270U
Authority
JP
Japan
Prior art keywords
substrate
wiring board
flexible wiring
flexible
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12772782U
Other languages
Japanese (ja)
Inventor
横田　光雄
中村　「あ」宏
Original Assignee
日立化成工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成工業株式会社 filed Critical 日立化成工業株式会社
Priority to JP12772782U priority Critical patent/JPS5933270U/en
Publication of JPS5933270U publication Critical patent/JPS5933270U/en
Pending legal-status Critical Current

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Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

・　　　図面は、本考案の一実施例を示す断面図である
。 ：　　　符号の説明、１・・・銅はく、２・・・接着剤
、３・・・フレキシブルポリイミドシート、４・・・接
着剤、５・・・常温打抜紙フェノール積層板。- The drawing is a sectional view showing one embodiment of the present invention. : Explanation of symbols, 1... Copper foil, 2... Adhesive, 3... Flexible polyimide sheet, 4... Adhesive, 5... Room temperature punched paper phenolic laminate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フＬ−キシプル絶縁フィルムの一面に銅箔が貼合され、
他の面に接着剤層を介して剥離可能に補強材が貼合され
たフレキシブル配線板用基板。Copper foil is pasted on one side of the flexible L-xypul insulation film,
A substrate for a flexible wiring board, which has a reinforcing material removably bonded to the other surface via an adhesive layer.
JP12772782U 1982-08-24 1982-08-24 Substrate for flexible wiring board Pending JPS5933270U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12772782U JPS5933270U (en) 1982-08-24 1982-08-24 Substrate for flexible wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12772782U JPS5933270U (en) 1982-08-24 1982-08-24 Substrate for flexible wiring board

Publications (1)

Publication Number Publication Date
JPS5933270U true JPS5933270U (en) 1984-03-01

Family

ID=30289995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12772782U Pending JPS5933270U (en) 1982-08-24 1982-08-24 Substrate for flexible wiring board

Country Status (1)

Country Link
JP (1) JPS5933270U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63119263U (en) * 1987-01-28 1988-08-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63119263U (en) * 1987-01-28 1988-08-02

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