JPS5998669U - double-sided printed wiring board - Google Patents
double-sided printed wiring boardInfo
- Publication number
- JPS5998669U JPS5998669U JP20107382U JP20107382U JPS5998669U JP S5998669 U JPS5998669 U JP S5998669U JP 20107382 U JP20107382 U JP 20107382U JP 20107382 U JP20107382 U JP 20107382U JP S5998669 U JPS5998669 U JP S5998669U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- double
- wiring board
- printed wiring
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図、第2図a1第3図a1第4図は従来の両面プリ
ント配線板の断面図、第2図す、13図すは従来のスル
ホールピン及びスルホールハトメの斜視図、第5図、第
6図、第7図は本考案の実施例を示す断面図である。
11.18・・・・・・絶縁基材、12.19・・・・
・・両面粘着デーゾ、13.13’、21,21’・・
・・・・銅箔回路、14.24・・・・・・貫通孔、1
5.22・・・・・・半田、16.23・・・・・・ハ
トメ。Figures 1 and 2 a1 Figure 3 a1 Figure 4 is a sectional view of a conventional double-sided printed wiring board, Figures 2 and 13 are perspective views of conventional through-hole pins and through-hole eyelets, and Figure 5. 6 and 7 are sectional views showing an embodiment of the present invention. 11.18... Insulating base material, 12.19...
・Double-sided adhesive dezo, 13.13', 21,21'...
......Copper foil circuit, 14.24...Through hole, 1
5.22... Solder, 16.23... Eyelet.
Claims (2)
を有し、少なくとも一方の銅箔回路と絶縁基板間に弾力
性を示す接着剤層を有しかつ前記両面の銅箔回路を貫通
する貫通孔に挿入されたハトメを介して両面の銅箔回路
を半田により固着して電気的に接続した両面プリント配
線板。(1) A paper base laminate serving as an insulating substrate has copper foil circuits on both sides, an adhesive layer exhibiting elasticity is provided between at least one of the copper foil circuits and the insulating substrate, and the copper foil circuits on both sides have copper foil circuits on both sides. A double-sided printed wiring board in which copper foil circuits on both sides are fixed and electrically connected by soldering through eyelets inserted into through-holes.
用い、この面に銅箔回路を有するフレキシブルフィルム
のフレキシブルフィルム面を貼布して片面に銅箔回路を
有する紙基材積層板とした実用新案登録請求の範囲第1
項記載の両面プリント配線板。(2) A paper base laminate with a copper foil circuit on one side is created by using a double-sided adhesive DESO as an adhesive layer that exhibits elasticity, and pasting the flexible film side of a flexible film with a copper foil circuit on this side. Scope of claim for utility model registration No. 1
Double-sided printed wiring board as described in section.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20107382U JPS5998669U (en) | 1982-12-22 | 1982-12-22 | double-sided printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20107382U JPS5998669U (en) | 1982-12-22 | 1982-12-22 | double-sided printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5998669U true JPS5998669U (en) | 1984-07-04 |
Family
ID=30426582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20107382U Pending JPS5998669U (en) | 1982-12-22 | 1982-12-22 | double-sided printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5998669U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0519926U (en) * | 1991-08-27 | 1993-03-12 | 松下電工株式会社 | Hot wire detector |
-
1982
- 1982-12-22 JP JP20107382U patent/JPS5998669U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0519926U (en) * | 1991-08-27 | 1993-03-12 | 松下電工株式会社 | Hot wire detector |
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