JPS6018572U - Chip parts mounting device - Google Patents
Chip parts mounting deviceInfo
- Publication number
- JPS6018572U JPS6018572U JP10948783U JP10948783U JPS6018572U JP S6018572 U JPS6018572 U JP S6018572U JP 10948783 U JP10948783 U JP 10948783U JP 10948783 U JP10948783 U JP 10948783U JP S6018572 U JPS6018572 U JP S6018572U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- mounting device
- circuit board
- printed circuit
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の取付装置を示す図、第２図乃至第４図は
本考案による取付装置の実施例を各工程ごとに示す図で
ある。
１・・・・・・チップ部品、１ａ、 １ｂ・・・・・
・電極、３・・・・・・プリント基板、３ａ、 ３ｂ
・・・・・・銅箔、４・・・・・・開孔、５，７・・・
・・・プレート、６・・・・・・接着テープ、８・・・
・・・抜き孔、９ａ、 ９ｂ・・・・・・半田。FIG. 1 is a diagram showing a conventional mounting device, and FIGS. 2 to 4 are diagrams showing each process of an embodiment of the mounting device according to the present invention. 1... Chip parts, 1a, 1b...
・Electrode, 3...Printed circuit board, 3a, 3b
...Copper foil, 4...Open hole, 5,7...
...Plate, 6...Adhesive tape, 8...
...Drilling holes, 9a, 9b...Solder.
Claims (1)
ターンが施されたプリント基板の開孔部に挿入して、前
記両電極と配線パターンとを半田付けするようにしたチ
ップ部品の取付装置であって、プリント基板の一面に略
開孔部と同じ形状の抜き孔をもつ第１のプレートと、両
面接着テープと、第２のプレートとを順次密着して積層
し、チップ部品をプリント基板の開孔部に挿入したとき
、チップ部品の一電極が第１のプレートの抜き孔を挿通
して、接着テープに当接し、チップ部品のプリント基板
への実装位置を規定するようにしたことを特徴とするチ
ップ部品の取付装置。A chip component mounting device in which a cylindrical chip component having electrodes at both ends is inserted into an opening in a printed circuit board having a wiring pattern on both sides, and both electrodes and the wiring pattern are soldered. A first plate having a hole of approximately the same shape as the opening on one side of the printed circuit board, a double-sided adhesive tape, and a second plate are successively laminated in close contact with each other, and the chip components are mounted on the printed circuit board. When the chip component is inserted into the opening of the first plate, one electrode of the chip component passes through the hole in the first plate and comes into contact with the adhesive tape, thereby defining the mounting position of the chip component on the printed circuit board. A featured chip component mounting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10948783U JPS6018572U (en) | 1983-07-14 | 1983-07-14 | Chip parts mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10948783U JPS6018572U (en) | 1983-07-14 | 1983-07-14 | Chip parts mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6018572U true JPS6018572U (en) | 1985-02-07 |
Family
ID=30255027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10948783U Pending JPS6018572U (en) | 1983-07-14 | 1983-07-14 | Chip parts mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6018572U (en) |
-
1983
- 1983-07-14 JP JP10948783U patent/JPS6018572U/en active Pending
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