JPS5921334U - Copper-like downpipe - Google Patents

Copper-like downpipe

Info

Publication number
JPS5921334U
JPS5921334U JP11652482U JP11652482U JPS5921334U JP S5921334 U JPS5921334 U JP S5921334U JP 11652482 U JP11652482 U JP 11652482U JP 11652482 U JP11652482 U JP 11652482U JP S5921334 U JPS5921334 U JP S5921334U
Authority
JP
Japan
Prior art keywords
downpipe
copper
copper foil
abstract
synthetic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11652482U
Other languages
Japanese (ja)
Inventor
長瀬 晋
Original Assignee
松下電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電工株式会社 filed Critical 松下電工株式会社
Priority to JP11652482U priority Critical patent/JPS5921334U/en
Publication of JPS5921334U publication Critical patent/JPS5921334U/en
Pending legal-status Critical Current

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Landscapes

  • Laminated Bodies (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す竪樋成形前の複合材の
断面図、第2図は本考案の一実施例を示す部分断面図で
ある。 1は鉄板、2は合成樹脂、3は基材、4は銅箔、5は接
着剤、6は複合材、Aは銅調竪樋である。
FIG. 1 is a cross-sectional view of a composite material before forming a downpipe, showing one embodiment of the present invention, and FIG. 2 is a partial cross-sectional view showing one embodiment of the present invention. 1 is an iron plate, 2 is a synthetic resin, 3 is a base material, 4 is a copper foil, 5 is an adhesive, 6 is a composite material, and A is a copper-like downpipe.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 鉄板の表裏両面及び端面の全面が50〜200ミクロン
の肉厚の合成樹脂で覆われた基板の片面に、35〜15
0ミクロンの肉厚の銅箔が接着されてなる複合板をハゼ
折り加工して、銅箔が表面に露出するようにしで形成さ
れた銅調竪樋。
On one side of the substrate, both the front and back sides and the entire end surface of the iron plate are covered with synthetic resin with a thickness of 50 to 200 microns.
A copper-like downpipe is made by folding a composite board with 0 micron thick copper foil glued to it so that the copper foil is exposed on the surface.
JP11652482U 1982-07-30 1982-07-30 Copper-like downpipe Pending JPS5921334U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11652482U JPS5921334U (en) 1982-07-30 1982-07-30 Copper-like downpipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11652482U JPS5921334U (en) 1982-07-30 1982-07-30 Copper-like downpipe

Publications (1)

Publication Number Publication Date
JPS5921334U true JPS5921334U (en) 1984-02-09

Family

ID=30268577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11652482U Pending JPS5921334U (en) 1982-07-30 1982-07-30 Copper-like downpipe

Country Status (1)

Country Link
JP (1) JPS5921334U (en)

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