JPS63119263U - - Google Patents
Info
- Publication number
- JPS63119263U JPS63119263U JP1125787U JP1125787U JPS63119263U JP S63119263 U JPS63119263 U JP S63119263U JP 1125787 U JP1125787 U JP 1125787U JP 1125787 U JP1125787 U JP 1125787U JP S63119263 U JPS63119263 U JP S63119263U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- adhesive
- back surface
- product compartments
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例に従つて可撓性回路
基板に複数の製品区画部を設ける態様と裏打ボー
ドを配設する為の粘着剤形成領域を説明する図で
あり、第２図は第１図の手法により構成されるチ
ツプ部品実装型可撓性回路基板の概念的な断面構
成図、そして、第３図は打ち抜き処理により裏打
ボードを分離させてチツプ部品実装済みの小形状
可撓性回路基板製品を得る態様を示す説明図であ
る。
１：可撓性回路基板、２：製品区画部、３：チ
ツプ部品、４：粘着剤領域、５：粘着剤、６：裏
打ボード、７：回路基板製品。
FIG. 1 is a diagram illustrating an embodiment of the present invention in which a plurality of product compartments are provided on a flexible circuit board and an adhesive forming area for arranging a backing board, and FIG. 1 is a conceptual cross-sectional diagram of a flexible circuit board with chip components mounted using the method shown in FIG. 1, and FIG. FIG. 2 is an explanatory diagram showing a mode of obtaining a flexible circuit board product. 1: Flexible circuit board, 2: Product compartment, 3: Chip parts, 4: Adhesive area, 5: Adhesive, 6: Backing board, 7: Circuit board product.
Claims (1)
製品区画部を複数個形成した可撓性回路基板を備
え、この可撓性回路基板の上記各製品区画部に属
する部位を除く裏面に粘着剤を設け、該粘着剤を
介して上記可撓性回路基板の裏面全体に裏打ボー
ドを配設するように構成したことを特徴とするチ
ツプ部品実装型可撓性回路基板。 A flexible circuit board is provided with a plurality of product compartments each for mounting a required number of chip components, and an adhesive is provided on the back surface of the flexible circuit board except for the parts belonging to each of the product compartments. A chip component mounted flexible circuit board, characterized in that a backing board is disposed on the entire back surface of the flexible circuit board via the adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987011257U JPH0534126Y2 (en) | 1987-01-28 | 1987-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987011257U JPH0534126Y2 (en) | 1987-01-28 | 1987-01-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63119263U true JPS63119263U (en) | 1988-08-02 |
| JPH0534126Y2 JPH0534126Y2 (en) | 1993-08-30 |
Family
ID=30798305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987011257U Expired - Lifetime JPH0534126Y2 (en) | 1987-01-28 | 1987-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0534126Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5495872U (en) * | 1977-12-20 | 1979-07-06 | ||
| JPS5933270U (en) * | 1982-08-24 | 1984-03-01 | 日立化成工業株式会社 | Substrate for flexible wiring board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5933270B2 (en) * | 1977-07-08 | 1984-08-14 | 三菱電機株式会社 | Manufacturing method of semiconductor device |
-
1987
- 1987-01-28 JP JP1987011257U patent/JPH0534126Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5495872U (en) * | 1977-12-20 | 1979-07-06 | ||
| JPS5933270U (en) * | 1982-08-24 | 1984-03-01 | 日立化成工業株式会社 | Substrate for flexible wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0534126Y2 (en) | 1993-08-30 |
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