JPH0534126Y2 - - Google Patents

Description

[Detailed description of the invention] "Industrial application field" This invention is a chip component that has a reinforcing structure that can be easily punched into the required product shape by mounting chip components on a flexible circuit board with high efficiency. The present invention relates to a mounted flexible circuit board.

``Prior Art'' A flexible circuit board is manufactured by forming a desired circuit wiring pattern on a flexible thin insulating base material made of a suitable plastic film or the like using conductive foil such as copper foil, and forming the required circuit wiring pattern on the terminal portion. Alternatively, it is common to form a protective layer with an insulating coat, a coverlay film, etc. on the wiring pattern surface except for the connection portions to the outside. Such flexible circuit boards are useful for three-dimensionally processing electrical connections between devices or circuit devices, as well as for mounting circuit components on a part of such flexible circuit boards. In applications where the parts are mounted, an appropriate reinforcing member may be provided on the back surface of the component mounting section.

``Problems that the invention aims to solve'' However, some types of flexible circuit boards have a small shape and can be mounted with various chip components without the need for reinforcing materials. be. When mounting chip components on such a small flexible circuit board, it is extremely difficult to use fixing means or mechanical handling means to mount the chip components due to the flexibility of the circuit board. Therefore, there is a problem that automatic mounting of chip components cannot be easily handled.

``Means for Solving the Problems'' The present invention provides a flexible chip component mounting type having a reinforcing structure that allows chip components to be easily and reliably mounted on a small-sized flexible circuit board such as the one described above. To this end, the present invention provides a flexible circuit board on which a plurality of product compartments are formed for each mounting a required number of chip components, and this flexible circuit board An adhesive is provided on the back surface of the flexible circuit board except for the parts belonging to the respective product compartments, and a backing board is disposed on the entire back surface of the flexible circuit board via the adhesive.

According to a flexible circuit board having such a structure, chip components can be reliably mounted in each product section with high efficiency while being sufficiently supported by a backing board made of an inexpensive material such as cardboard. After the chip components are mounted, punching is performed along the shape of each product compartment, thereby automatically eliminating the backing board and creating a compact flexible circuit with chip components mounted. Substrate products can be obtained efficiently.

``Example'' Hereinafter, the present invention will be further explained with reference to the drawings. In FIG. A large number of small-sized product compartments 2 are provided. Although not shown, necessary circuit wiring patterns, connection terminals, etc. are appropriately formed in accordance with conventional methods in each of these product compartments 2 so that necessary chip parts 3 can be mounted thereon, and necessary circuit wiring patterns and connection terminals, etc. The surface of the circuit wiring pattern other than the necessary terminal portions is coated with an insulating coat or the like. Although the shape of each product section 2 is conceptually shown as being the same in the figure, these can be formed into any shape depending on the target product. The flexible circuit board 1 is equipped with a plurality of small-shaped product compartments 2 as described above, but as shown by diagonal lines in the figure, the back side of the other areas 4 that do not belong to each product compartment 2 are As shown in FIG. 2, an adhesive 5 is provided, and a backing board 6 is disposed on the entire back surface of the flexible circuit board 1 via the adhesive 5 to support the circuit board 1 as a whole. It is configured.

Due to the above arrangement of the adhesive 5, the back surface of each product section 2 and the backing board 6 are not bonded to each other.
It is sufficient for the backing board 6 to have sufficient mechanical strength when handling the flexible circuit board 1 and mounting the chip components 3 on each product section 2, and ultimately Since it is separated from the back surface of the compartment 2, it is preferable that an inexpensive material such as cardboard can be used, and that it can be easily punched out using a simple die such as a steel rule die.

According to the chip component mounted flexible circuit board as described above, a flexible circuit board 1 on which an arbitrary plurality of required small-shaped product compartments 2 are formed is manufactured in advance, and then adhesive is attached to the back surface of the board as shown in area 4. After applying the agent 5, the backing board 6 is arranged, or the backing board 6
An adhesive 5 coated with an adhesive 5 in a shape corresponding to the area 4 is placed on the back surface of the flexible circuit board 1. In this way, the backing board 6 is placed on the back side of the flexible circuit board 1.
In the case where chip parts 3 are provided in each product compartment 2, it is possible to mount the chip parts 3 in each product compartment 2 with high efficiency, for example, by means such as automatic mounting. By performing a punching process using a mold, it is possible to obtain a small-sized flexible circuit board product 7 on which the required chip components 3 are mounted, as shown in FIG.
Since the back surface of each product section 2 does not have the adhesive 5, the backing board 6 is automatically separated from the flexible circuit board product 7 as a punched piece 6A by this punching process. The area 4 where the adhesive 5 is provided is
Therefore, the method is not limited to the method of uniformly setting the outer circumferential portion as shown in FIG. It is also possible to set the

"Effects of the invention" The present invention has the above-mentioned configuration, so it is possible to reliably and efficiently mount chip components on small-sized flexible circuit board products, and it is also inexpensive as a backing board. Since there is no adhesive on the back of the product section, punching of the product can be easily done with a simple die such as a steel rule die without the risk of wrinkles or other damage. This is extremely advantageous in automating the process of manufacturing small-sized flexible circuit boards mounted with chip components.

[Brief explanation of the drawing]

FIG. 1 is a diagram illustrating an embodiment of the present invention in which a plurality of product compartments are provided on a flexible circuit board and an adhesive forming area for arranging a backing board, and FIG. 1 is a conceptual cross-sectional diagram of a flexible circuit board with chip components mounted using the method shown in FIG. 1, and FIG. FIG. 2 is an explanatory diagram showing a mode of obtaining a flexible circuit board product. 1...Flexible circuit board, 2...Product compartment, 3
...chip parts, 4...adhesive area, 5...adhesive, 6...backing board, 7...circuit board product.

Claims (1)

[Scope of utility model registration request] Each flexible circuit board has a plurality of small product compartments on which the required number of chip parts can be mounted, and the back side of the flexible circuit board except for the parts belonging to each of the product compartments is adhesive. 1. A flexible circuit board mounted with chip components, characterized in that a backing board is disposed on the entire back surface of the flexible circuit board via the adhesive.