JPH0536868U - Circuit board - Google Patents

Abstract

(57) [Abstract] [Purpose] Predetermined positions of the first circuit and the second circuit can be reliably electrically connected to each other without requiring accurate positioning, and the wiring density can be increased and the design can be changed. (EN) Provided is a circuit board which can be easily dealt with. [Structure] A first circuit 12 composed of an insulating coated metal thin wire 12a that is drawn around and fixed in a predetermined pattern on the surface of a substrate 11, and a predetermined pattern is similarly formed on the first circuit. And a second circuit 13 composed of an insulating coated metal thin wire 13a that is drawn around and fixed to the first circuit and the second circuit. Circuit board 1 so that the insulating coating of the thin metal wires can be removed so that they can be electrically connected to each other
Configure 0.

Description

[Detailed description of the device]

[0001]

[Industrial application]

 The present invention relates to a circuit board in which, for example, in a matrix circuit configuration, a predetermined circuit configuration is obtained by electrically connecting predetermined positions of circuit patterns formed on the upper and lower two layers on the substrate. .

[0002]

[Prior art]

 Conventionally, such a circuit board is configured as shown in FIG. 2, for example. In FIG. 2, the circuit board 1 has a first shape which is formed on the surface of the printed circuit board 2 and has a predetermined shape, that is, conductive patterns 3 a extending in parallel to each other in one direction (vertical direction in the case shown). The circuit 3, the insulating layer 4 formed on the first circuit 3 so as to cover the entire surface of the printed circuit board 2, and the direction orthogonal to the one direction on the insulating layer 4 ( In the illustrated case, the second circuit 5 is composed of conductive patterns 5a extending in parallel with each other in the lateral direction, and each conductive pattern of the first circuit 3 and the second circuit 5 is formed. Regarding a predetermined portion of 3a, 5a that should be connected to each other, a window 4a or a through hole penetrating vertically is provided in advance in a region of the insulating layer 4 corresponding to the portion, and in this region, the first Conductive pattern of circuit 3 and second circuit 5 3a, 5a, and by brought into contact with each other through the window 4a or through holes, predetermined matrix circuit as a whole is in earthenware pots by may be configured.

[0003]

[Problems to be solved by the device]

 However, in the circuit board 1 thus configured, the first circuit 3, the insulating layer 4, and the second circuit 5 are sequentially formed on the surface of the printed circuit board 1 in this order. Therefore, the conductive pattern 3a of the first circuit 3, the window or through hole 4a of the insulating layer 4, and the conductive pattern 5a of the second circuit 5 must be accurately positioned with respect to each other. Therefore, the conductive pattern 3a of the first circuit 3 and the conductive pattern 5a of the second circuit 5 should not be connected to each other in a region displaced from the window or through hole 4a of the insulating layer 4. There was something to do.

Therefore, there is a problem in that the above areas cannot be surely brought into contact with each other, and thus a desired electrical connection cannot be performed. Further, in order to reliably obtain the electrical connection, the window of the insulating layer 4 has to be made large, so that the wiring density cannot be increased. Further, when it is desired to change the entire circuit configuration, it is necessary to change the position of the window of the insulating layer 4 or the through hole 4a, which causes a problem that the design cannot be easily changed.

In view of the above points, the present invention can surely electrically connect predetermined portions of the first circuit and the second circuit to each other without requiring accurate positioning, and increase wiring density. The aim is to provide a circuit board that can easily respond to design changes.

[0006]

[Means for Solving the Problems]

 In order to achieve the above object, the circuit board according to the present invention comprises a first circuit composed of a thin metal wire with an insulating coating and fixed on the surface of the board so as to form a predetermined pattern. And a second circuit composed of an insulating coated metal thin wire which is similarly drawn and fixed so as to have a predetermined pattern, and is connected to each other in the first circuit and the second circuit. It is characterized in that the insulating film of the above-mentioned thin metal wires is removed by heating, pressurizing, etc., so that the desired portions are electrically connected to each other.

[0007]

[Action]

 According to the above configuration, the insulating film of the metal thin wire is removed by directly heating and pressurizing predetermined portions of the insulating metal wire of the first circuit and the second circuit to be connected to each other. Since the electrical connection is made by bringing the relevant parts into contact with each other, even if the second circuit is arranged with a slight deviation from the first circuit, the heating is performed accordingly. -By a simple process such as pressurization, the electrical connection at the above-mentioned predetermined points can be surely made.

In addition, when it is desired to change the entire circuit configuration configured by the first circuit and the second circuit, the first circuit and the second circuit are similarly formed, and the By electrically connecting the connection points by heating, pressurizing, etc., other circuit configurations can be easily realized.

[0009]

【Example】

 Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the drawings. FIG. 1 shows a circuit board according to the present invention, in which a circuit board 10 extends parallel to each other along a predetermined shape, that is, in one direction (vertical direction in the case shown) on a surface of a printed circuit board 11. A first circuit 12 composed of a thin metal wire 12a having an insulating film and extending from above the first circuit 12 in parallel with each other in a direction (lateral direction in the case shown) orthogonal to the one direction. The second circuit 13 composed of the insulating coated metal thin wire 13a.

Then, at the predetermined locations (A and B in the figure) to be connected to each other of the insulating coated metal thin wires 12a and 13a of the first circuit 12 and the second circuit 13, the locations A and B are connected. The insulating coating metal thin wires 12a and 13a are removed by heating, pressurizing, etc., and the insulating coating metal thin wires 12a and 13a are brought into contact with each other at the points A and B. Thereby, a predetermined matrix circuit can be configured as a whole.

The circuit board 10 according to the present invention is configured as described above. For example, even if the second circuit 13 is arranged with a slight deviation from the first circuit 12, By heating and pressurizing the intersecting portions of the insulating coated metal thin wires 12a and 13a forming the first circuit 12 and the second circuit 13, the electric power of the above-mentioned fixed portions A and B is increased. A reliable connection can be made.

In addition, when it is desired to change the entire circuit configuration configured by the first circuit 12 and the second circuit 13, the first circuit 12 and the second circuit 12 formed on the printed circuit board 11 in the same manner. By using the circuit 13 as it is and performing connection processing by heating, pressurizing, or the like at the changed connection portion, another circuit configuration can be easily realized. It is obvious that the connection between the layers can be the same as the connection between the first circuit and the second circuit even when the multilayer circuits are stacked.

[0013]

[Effect of the device]

 As described above, according to the present invention, the metal thin wire of the first circuit and the second circuit is directly heated / pressurized at a predetermined portion of the metal wire of the insulating film to be connected to each other. Since the electrical connection is made by removing the insulating film and bringing the relevant parts into contact with each other, even if the second circuit is arranged with a slight deviation from the first circuit, it should be adjusted accordingly. By a simple process such as heating and pressurizing, the electrical connection at the predetermined location can be surely performed. Also, if you want to change the overall circuit configuration consisting of the first circuit and the second circuit, form the first circuit and the second circuit in the same way, and change the connection point. Other circuit configurations can be easily realized by electrically connecting the components by heating, pressurizing, or the like. Thus, according to the present invention, the predetermined portions of the first circuit and the second circuit can be reliably electrically connected to each other without requiring accurate positioning, and the wiring density can be increased and the design can be changed. An extremely excellent circuit board that can easily cope with the above is provided.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing an embodiment of a circuit board according to the present invention.

FIG. 2 is a schematic plan view showing an example of a conventional circuit board.

3 is an enlarged cross-sectional view showing a part of the circuit board of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Circuit board 11 Printed circuit board 12 First circuit 12a Insulation coating metal thin wire 13 Second circuit 13a Insulation coating metal thin wire

Claims (1)

[Scope of utility model registration request] 1. A first circuit composed of an insulating coated metal thin wire that is drawn and fixed in a predetermined pattern on the surface of a substrate, and a predetermined pattern is similarly formed on the first circuit. And a second circuit consisting of an insulating coated metal thin wire fixed and routed in such a manner that the portions to be connected to each other of the first circuit and the second circuit are A circuit board, which is capable of being electrically connected to each other by removing the insulating coating of the thin metal wires.