GB2228232A - Making printed circuits - Google Patents

Making printed circuits Download PDF

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Publication number
GB2228232A
GB2228232A GB8928563A GB8928563A GB2228232A GB 2228232 A GB2228232 A GB 2228232A GB 8928563 A GB8928563 A GB 8928563A GB 8928563 A GB8928563 A GB 8928563A GB 2228232 A GB2228232 A GB 2228232A
Authority
GB
United Kingdom
Prior art keywords
substrate
coating
applying
screen
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8928563A
Other versions
GB8928563D0 (en
Inventor
John Michael Lowe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Technology Applications Co Ltd
Original Assignee
Technology Applications Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technology Applications Co Ltd filed Critical Technology Applications Co Ltd
Priority to KR1019900701909A priority Critical patent/KR910700599A/en
Priority to EP90900949A priority patent/EP0406376A1/en
Priority to JP2501774A priority patent/JPH03504065A/en
Priority to US07/585,070 priority patent/US5148355A/en
Priority to AU48250/90A priority patent/AU631595B2/en
Priority to BR898907268A priority patent/BR8907268A/en
Priority to PCT/GB1989/001536 priority patent/WO1990007858A2/en
Publication of GB8928563D0 publication Critical patent/GB8928563D0/en
Priority to DK201690A priority patent/DK201690A/en
Publication of GB2228232A publication Critical patent/GB2228232A/en
Priority to FI904210A priority patent/FI904210A0/en
Priority to FI904213A priority patent/FI91587C/en
Priority to EP91914883A priority patent/EP0556185B1/en
Priority to AU84210/91A priority patent/AU8421091A/en
Priority to DE69124260T priority patent/DE69124260T2/en
Priority to PCT/FI1991/000264 priority patent/WO1992003040A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Screen Printers (AREA)

Abstract

A method of making a printed circuit board comprising applying a first and second coating in a desired pattern to a substrate, the substrate (12) being disposed in a different relationship to coating apparatus used in applying a second coating from the relationship in which it is disposed in applying the first coating. Preferably a number of identical boards are screen-printed on a substrate (12) from which they are subsequently separated. The individual boards are positioned such that the same pattern may be applied when the substrate (12) is presented to coating means in any of a number of orientations each separated from the next by a fixed angle of rotation about an axis (A) at right angles to the substrate (12), the first coating being applied in one such orientation and the second after the screen and substrate respectively have been rotated in opposite directions, (S, B) each through 90 DEG . <IMAGE>

Description

1 MAKING PRINTED CIRCUITS This invention is concerned with making printed
circuits and is especially concerned with a method-of making a printed circuit in which a layer is applied in a desired pattern to a substrate.
In the manufacture of printed circuits it is known to apply a number of layers in desired patterns to the surface of a substrate, commonly an insulating board. The layers may be applied in a variety of ways, for example by first applying a sheet of copper material to the board and then etching away unrequired regions to leave a desired pattern or by applying coatings of suitable material to the surface of the board in a desired pattern to achieve the required effect. It is with this latter operation that the invention is concerned. The layers which are applied may be in the form of a conductive material or may be a resist which may be an electrically insulating material and/or a material which resists damage, e.g. by etching fluid or other operations, for example soldering. Solder is non adherent to most resists and such resists are commonly unaffected by temperatures encountered during soldering.
2 In some circumstances pin holes in one or more of the applied layers may cause problems, especially in an insulation area where pin holes may cause unintentional and, potentially, catastrophic connection between conducting layers.
It has been found that the risks of pinholes arising may be reduced by applying the, or each, insulating layer in two stages with the substrate disposed in a different relationship to coating apparatus in each stage, so that two coatings are applied with, for example, variation of coating direction or slight positional variation between coatings. This substantially reduces the risk that pin holes will cause a problem.
In one aspect the invention may be considered to provide a method of applying a layer in a desired pattern to a substrate for a printed circuit comprising applying a first coating in the desired pattern to the substrate and applying a second coating in the desired pattern to the substrate, the substrate being disposed in a different relationship to coating apparatus used in applying the second coating from the relationship in which it is disposed to coating apparatus used in applying the first coating.
3 Preferably, in methods in accordance with the invention the coating apparatus used is a screen printing apparatus. In one method the relationship of the board to the apparatus is changed by moving the position of the screen of the apparatus relative to the substrate through a very small distance e.g. a small part of the millimetre e.g. 0.05 mm. However, although this technique is satisfactory for some applications, the various conductors and other applied layers of many modern printed circuits are so close to one another that even this very small positional adjustment is unacceptable.
In another method in accordance with the invention which is, in some circumstances, an improvement over the method outlined in the last preceding paragraph, two separate but identical screens each having the same pattern are used. The first coating is applied using one of the screens and then this screen is removed and the other screen positioned in registration with the substrate and the second coating applied. The cost of production of suitable screens is very high and this method requires two screens. From an accuracy point of view the use of more than one screen can lead to added problems, for example distortion of the two screens may differ eg. if the screens are of slightly different 4 1 tensions. Thus while this method using two screens may be preferable to that described in the last preceding paragraph, it is still desirable to achieve further improvements in accuracy for some uses, as well as to avoid the expense of two screens, if possible.
In another prefered method in accordance with the invention where the coating apparatus is a screen printing apparatus, the relationship of the substrate to the apparatus is changed by rotating both the substrate and the screen through an angle, suitably 900, relative to the coating direction of the apparatus.
In carrying out the preferred method in accordance with the invention, preferably a number of identical circuit patterns are printed on a substrate; the circuit patterns are suitably printed to provide a corresponding number of individual circuit boards which are subsequently separated from the remainder of the substrate. Suitably the substrate is provided by an insulating sheet material on which the circuits are -t 1 1 printed and from which the individual circuit boards are severed after printing. In this preferred method the regions to which the desired pattern is to be applied are positioned such that the same pattern may be applied to the substrate when the substrate is presented to a pattern applying portion of the coating apparatus in any of a number of orientations, each separated from the next by a fixed angle of rotation about an axis at right angles to the substrate a centre of the substrate. The first coating is applied with the substrate in one such orientation, the substrate and pattern applying Portion are thereafter reiative2y rotated through said fixed angle (or a multiple thereof other than 3600), and then the second coating is applied. Suitably the fixed angle is 1800 and four regions to which a pattern is to be applied are present. By making this change in position of the pattern applying portion relative to the substrate, the second coating is applied to each region using a different pattern applying portion from that used to apply the first coating to the same region: the chance of a damaging pin hole appearing in precisely the same position of two different applying portions is very small.
1 i 6 In the preferred method in accordance with the invention this risk is reduced even further by not only ensuring that the second coating is applied to each region by a different pattern applying portion from the first coating but also that the second coating is applied in a different coating direction. In this preferred method, which uses a screen printing apparatus, the screen and substrate are rotated in opposite directions, each being rotated through an angle of 900.
There now follows a detailed description to be read with reference to the accompanying drawings of a method of making a printed circuit board embodying the invention. It will be realised this method has been selected for description to illustrate the invention by way of example.
In the accompanying drawings:
Figure 1 is a diagrammatic plan view of a screen with a corner broken away revealing a substrate above which the screen is positioned, in a position for applying a first coating; and 1 i 7 Figure 2 is a similar plan view showing the screen and substrate in position for applying a second coating.
A screen 10 of a screen printing apparatus is' positioned above a substrate provided by a rigid insulating sheet material 12 in contact with a surface of the sheet material 12, forming a base on which printed circuit boards are to be formed. The screen 10 and sheet material 12 are positioned for the first coating in register with one another as shown in Figure 1, that is with datums D1 and L1 in alignment and with datums D2 (not shown) and L2 in alignment. In register for the second coating (Figure 2) the datum D1 overlies the datum L2 whilst the datum D2 overlies datum Ll. Desired patterns P1 - P4 to be printed are shown in the drawings. The patterns are produced by multiple image photographic techniques and are, therefore, basically identical, although arranged in appropriate positions and orientations to enable the carrying out of the illustrative method.
In carrying out the illustrative method, with the screen 10 positioned relative to the sheet material 12 as shown in Figure 1, coating means of the screen printing apparatus is moved relative to the screen in a coating 8 direction C to apply a first coating of material, for example a resist, through the screen 10 to deposit the desired pattern P1 - P4 onto the base sheet material 12: material M, deposited on the sheet material 12 is indicated in Figure 1. After the first coating has been applied, the screen 10 is separated from the sheet material 12 and the screen 10 and sheet material 12 are rotated about an axis A at the centre of the base and perpendicular to the base and to the screen 10. The screen 10 is rotated in the direction indicated by the arrow S in Figure 1 and the base sheet material 12 is rotated in the direction indicated by the arrow B in Figure 1. The screen 10 and rotated through an angle of arrows S, B about the axis A sheet material 12 are each 900 as indicated by the until they occupy the positions in which they are shown in Figure 2. The screen 10 and sheet material 12 are put into register by ensuring that the datums are appropriately aligned. In this instance, however, the datum D1 is aligned with the datum L2 whilst the datum D2 (not shown) is aligned with the datum L1 (see Fi-gure 2). After the screen 10.and sheet material 12 have been moved into register, they are again moved into contact with one another and a second coating is applied by moving the coating means (e.g. a squeegee) in the coating direction indicated by the arrow i 1 9 C in Figure 2. The second coating is applied over the first coating but the second coating is applied by means of different ones of the patterns P1 P4 formed in the screen. For example the second coating applied over the material M1 shown in Figure 1 is applied by the pattern P1 in the screen 10 whilst pattern P3 in the screen 10 applies a second coating over material M2, the first coating of which was applied by the pattern Pl. Thus, not only is the second coating applied by coating means travelling in a coating direction C across the screen at an orientation of 900 to that in which the first coating is applied but also the actual patterns through which the second coating is applied are different. By this means it is ensured that the risk that any pin holes will occur in the applied material is pr.acti...ally zero.
After all the necessary layers have been applied to the sheet material 12 individual circuit boards are severed from the sheet material 12 by a suitable means for example routing, each of the boards carrying material applied by one of the patterns P1 - P4, there being four separate boards manufactured in this method.

Claims (10)

1. A method of applying a layer in a desired pattern to a substrate for a printed circuit comprising applying a first coating in the desired pattern to the substrate and applying a second coating in the desired pattern to the substrate, the substrate being disposed in a different relationship to coating apparatus used in applying the second coating from the relationship in which it is disposed to coating apparatus used in applying the first coating.
2. A method according to Claim 1 wherein the coating apparatus is a screen printing apparatus and the relationship of the substrate to the apparatus is changed by moving the position of the screen of the apparatus relative to the substrate through a very small distance between application of the first and second coatings.
3. A method according to Claim 1 wherein the coating apparatus is screen printing apparatus and the relationship of the substrate to the apparatus is changed by rotating both the substrate and the screen through an angle of 900 relative to a coating direction of the apparatus.
4. A method according to either one of Claims 1 and 3 wherein a number of identical or substantially identical circuit boards are printed on a substrate from which they are subsequently separated the boards being positioned such that the same pattern may be applied to the substrate when the substrate is presented to a pattern applying portion of the coating apparatus in any of a number of orientations each separated from the next by a fixed angle of rotation about an axis at right angles to the substrate at a centre of the substrate and wherein the first coating is applied with the substrate in one such orientation, the substrate and pattern applying portion are thereafter relatively rotated through said fixed angle (or a multiple thereof other than 3600), and then the second coating is applied.
5. A method according to Claim 4 wherein the fixed angle is 1800.
6. A method according to Claim 5 wherein the apparatus is a screen printing apparatus and the screen and substrate are rotated in opposite directions each through 900.
-1, %.
A 12
7. A method according to any one of Claims 4 to 6 wherein the substrate is a sheet material on which the circuits are printed and from which the individual circuit boards are severed after printing.
8. A method according to Claim 1 wherein the apparatus is a screen printing apparatus having two substantially identical screens one of which is used to apply the first coating and the other to apply the second coating.
9. A method of making a printed circuit substantially as hereinbefore described with reference to the accompanying drawings.
10. A printed circuit made by a method according to any one of the preceding claims.
Published 1990 at ThePatent Office. State House.66 71 High Holborn. LondonWC1R4TP.Purther copies maybe obtainedfrom The Patent Ofrice Sales Branch. St Mary Cray. Orpington. Kent BR5 3RD. Printed by Multiplex techniques ltd. St Mary Cray. Kent, Con. 157
GB8928563A 1988-12-24 1989-12-18 Making printed circuits Withdrawn GB2228232A (en)

Priority Applications (14)

Application Number Priority Date Filing Date Title
KR1019900701909A KR910700599A (en) 1988-12-24 1989-12-22 Printed Circuit Manufacturing Method
EP90900949A EP0406376A1 (en) 1988-12-24 1989-12-22 Improved method for making printed circuits
JP2501774A JPH03504065A (en) 1988-12-24 1989-12-22 Improved method for making printed circuits
US07/585,070 US5148355A (en) 1988-12-24 1989-12-22 Method for making printed circuits
AU48250/90A AU631595B2 (en) 1988-12-24 1989-12-22 Improved method for making printed circuits
BR898907268A BR8907268A (en) 1988-12-24 1989-12-22 PROCESS TO MAKE AN ELECTRICAL CONNECTION, PRINTED CIRCUIT BOARD, PROCESS TO PRODUCE A CONTACT PAD, PROCESS TO PRODUCE A CAPACITOR, PRINTED CIRCUIT AND PROCESS TO APPLY A LAYER IN A DESIRED PATTERN TO AN UNDERSTRATE
PCT/GB1989/001536 WO1990007858A2 (en) 1988-12-24 1989-12-22 Improved method for making printed circuits
DK201690A DK201690A (en) 1988-12-24 1990-08-22 PROCEDURE FOR THE MANUFACTURING OF PRINTED CIRCUITS
FI904210A FI904210A0 (en) 1988-12-24 1990-08-24 FOERBAETTRAT FOERFARANDE FOER TILLVERKNING AV TRYCKTA KRETSAR.
FI904213A FI91587C (en) 1989-12-18 1990-08-27 System for controlling the pressing elements of a harvester, in particular a grapple harvester
EP91914883A EP0556185B1 (en) 1989-12-18 1991-08-27 System for controlling the clamp means in a tree harvesting machine, especially grapple harvester
AU84210/91A AU8421091A (en) 1989-12-18 1991-08-27 System for controlling the clamp means in a tree harvesting machine, especially grapple harvester
DE69124260T DE69124260T2 (en) 1989-12-18 1991-08-27 SYSTEM FOR CONTROLLING THE CLAMPING DEVICES IN A HARVESTING DEVICE, IN PARTICULAR A DEVICE WITH GRIPPERS
PCT/FI1991/000264 WO1992003040A1 (en) 1989-12-18 1991-08-27 System for controlling the clamp means in a tree harvesting machine, especially grapple harvester

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8830251A GB2227887A (en) 1988-12-24 1988-12-24 Making printed circuits

Publications (2)

Publication Number Publication Date
GB8928563D0 GB8928563D0 (en) 1990-02-21
GB2228232A true GB2228232A (en) 1990-08-22

Family

ID=10649182

Family Applications (2)

Application Number Title Priority Date Filing Date
GB8830251A Withdrawn GB2227887A (en) 1988-12-24 1988-12-24 Making printed circuits
GB8928563A Withdrawn GB2228232A (en) 1988-12-24 1989-12-18 Making printed circuits

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB8830251A Withdrawn GB2227887A (en) 1988-12-24 1988-12-24 Making printed circuits

Country Status (3)

Country Link
KR (1) KR910700599A (en)
CA (1) CA2006585A1 (en)
GB (2) GB2227887A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04151899A (en) * 1990-10-15 1992-05-25 Cmk Corp Manufacture of electromagnetic wave shielded printed wiring boards
EP0865614A1 (en) * 1995-12-05 1998-09-23 Bisson, michel Contactless electronic transponder with printed loop antenna circuit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1095814A (en) * 1965-05-26 1967-12-20 Formica Int Improvements in colour printing
GB1158205A (en) * 1966-03-23 1969-07-16 Ibm Improvements in and relating to Printed Circuit Patterns.

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1170991A (en) * 1967-03-31 1969-11-19 Mini Of Technology Improvements in or relating to Capacitors.
CA911064A (en) * 1970-11-02 1972-09-26 Microsystems International Limited Thin film crossover structure and method
AT337292B (en) * 1971-09-02 1977-06-27 Siemens Ag METHOD OF MANUFACTURING A PCB
JPS5123870B2 (en) * 1972-10-02 1976-07-20
US4118595A (en) * 1977-06-06 1978-10-03 Bell Telephone Laboratories, Incorporated Crossovers and method of fabrication
FR2562335B1 (en) * 1984-04-03 1988-11-25 Rogers Corp FLEXIBLE MULTILAYER CIRCUIT WITH CONNECTIONS BETWEEN ULTRASONIC WELDED LAYERS

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1095814A (en) * 1965-05-26 1967-12-20 Formica Int Improvements in colour printing
GB1158205A (en) * 1966-03-23 1969-07-16 Ibm Improvements in and relating to Printed Circuit Patterns.

Also Published As

Publication number Publication date
CA2006585A1 (en) 1990-06-24
GB2227887A (en) 1990-08-08
GB8830251D0 (en) 1989-02-22
KR910700599A (en) 1991-03-15
GB8928563D0 (en) 1990-02-21

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