JP2002299800A - Method of forming circuit using printed-wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To flexibly deal with changes in a circuit by only having to prepare a standard printed wiring board. SOLUTION: Holes 5 are made in wiring patterns 3 on the printed wiring board 1, the continuity of prescribed interconnections is cut off, and a desired circuit is constituted. By constituting printed wiring board 1 of a flexible circuit sheet, it can be made to bend.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a circuit using a printed wiring board such as a flexible printed circuit (FPC) or a flexible flat cable (FFC).

[0002]

2. Description of the Related Art As a method of forming an internal circuit in an electric junction box of an automobile or the like, a method using an insulated wire and a press contact terminal (disclosed in Japanese Utility Model Application Laid-Open No. 1-103168), a bus bar and an insulating plate are used. Using the method, or
A method using a printed wiring board is known.

When an internal circuit is formed using a printed wiring board, it is customary to use a printed wiring board on which a circuit pattern required from the beginning is formed, and different internal circuits are required depending on a vehicle type, a grade, and the like. In such a case, a printed wiring board is designed and manufactured for each required circuit and prepared.

[0004]

However, designing and manufacturing a printed wiring board for each required internal circuit is expensive, and can flexibly cope with a small circuit change. There was a problem that it was not possible.

SUMMARY OF THE INVENTION An object of the present invention is to provide a circuit forming method using a printed wiring board which can flexibly cope with circuit changes only by preparing a standard printed wiring board in consideration of the above circumstances. And

[0006]

According to a first aspect of the present invention, a desired circuit is formed by forming a hole in a wiring pattern of a printed wiring board to interrupt conduction of a predetermined wiring. .

When a circuit is formed by the method of the present invention, various circuit changes are predicted in advance and a wiring pattern including an extra path is formed on a printed wiring board. Then, in making a certain circuit, unnecessary wires are opened and cut, and only the necessary wires are left in a conductive state to form a desired circuit. Therefore, it is possible to easily cope with a circuit change only by changing the position of the hole formed in the printed wiring board.

According to a second aspect of the present invention, there is provided a circuit forming method using the printed wiring board according to the first aspect, wherein the wiring pattern is formed in a lattice shape in which a vertical line and a horizontal line are mutually conductive at an intersection. It is characterized by being.

In the method of the present invention, since the wiring patterns are formed in a grid pattern, various circuits can be freely formed by preparing a printed wiring board having a standard pattern.

According to a third aspect of the present invention, there is provided a circuit forming method using the printed wiring board according to the first or second aspect, wherein the printed wiring board is formed of a flexible circuit sheet. And

In the method of the present invention, since a flexible circuit sheet is used as the printed wiring board, the printed wiring board can be bent, and can be housed compactly in, for example, an electrical junction box.

According to a fourth aspect of the present invention, a desired circuit is formed by stacking a plurality of printed wiring boards, and conducting the wiring patterns of the upper and lower printed wiring boards to each other at a position where the two wiring patterns overlap. It is characterized by the following.

According to the method of the present invention, a desired circuit is formed by mutually conducting the wiring patterns at the overlapping positions of the wiring patterns of a plurality of printed wiring boards. Changes can be easily accommodated.

[0014]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is an explanatory view of a first embodiment of the present invention.
1 is a printed wiring board, 2 is an insulating sheet constituting the printed wiring board, and 3 is a wiring pattern made of a conductor.

When a circuit required by the method of this embodiment is formed, a wiring pattern 3 including an extra route is formed on the printed wiring board 1 in advance by predicting various circuit changes. Then, in making a circuit, unnecessary wiring is cut by opening a hole 5 at a predetermined position, and only the necessary wiring is left in a conductive state to form a desired circuit. After that, by connecting the electric wire 10 to the end of the wiring pattern 3 using the terminal 7 as necessary, it can be used as a circuit. Therefore, the holes 5 formed in the printed wiring board 1
By simply changing the position, the circuit can be easily changed.

FIGS. 2A, 2B, and 2C show examples of connection portions between the electric wire 10 and the printed wiring board 1. FIG. FIG.
(A) is a method called so-called piercing.
Are penetrated through the printed wiring board 1 to connect the electric wire 10 and the wiring pattern. In the structure shown in FIG. 2B, the electric wire 10 and the wiring pattern are connected by welding the core wire of the electric wire 10 to the printed wiring board 1. FIG.
In the structure (c), the terminal 13 having the spring portion 13a is attached to the end of the electric wire 10, and the end of the printed wiring board 1 is sandwiched by the spring portion 13a to connect the exposed wiring pattern to the electric wire 10. are doing.

Here, the printed wiring board 1 may be formed as a hard board (a general printed board) having a certain degree of rigidity.
Circuit sheet having flexibility such as a circuit). When made as a flexible circuit sheet, it can be folded as shown in FIG. 3 and can be compactly accommodated in an electric junction box or the like.

FIG. 4 is an explanatory view of a second embodiment of the present invention.
1 is a printed wiring board, 2 is an insulating sheet constituting the printed wiring board, and 3 is a wiring pattern made of a conductor.

When a circuit required by the method of this embodiment is formed, a wiring pattern 3 including an extra path is formed on the printed wiring board 1 in advance by predicting various circuit changes. In making a circuit, unnecessary wires are cut by opening holes 5 at predetermined positions, and only necessary wires are left in a conductive state. At this time, if all the wiring patterns are necessary, all of them are left. Next, a plurality of printed wiring boards 1 are laminated, and the respective wiring patterns 3 of the upper and lower printed wiring boards 1 and 1 are electrically connected to each other at the overlapping position of both wiring patterns 3 as shown in FIG. In this way, a desired circuit is formed in all layers. The portions indicated by 15 in FIGS. 4 and 5 are conductive portions of the wiring patterns 3 in the upper layer and the lower layer. When a circuit is formed in this manner, it is possible to easily cope with a circuit change by changing the position where the wiring patterns of the printed wiring boards 1 and 1 stacked vertically are electrically connected.

As shown in FIG. 6A, a method for conducting the wiring patterns 3 is as follows: a method in which the piercing terminals 16 penetrate through both printed wiring boards 1;
As shown in (b), a method of welding the wiring patterns 3 using the ultrasonic horn 17 or a soldering iron can be adopted.

FIG. 7 is an explanatory view of a third embodiment of the present invention.
21 is a printed wiring board, 22 is an insulating sheet constituting the printed wiring board, and 23 is a wiring pattern made of a conductor.
In this case, the wiring pattern 23 is composed of the vertical line 23A and the horizontal line 23.
B are formed in a grid shape that is conductive to each other at the intersection.
Therefore, by preparing the printed wiring board 21 of the standard pattern and opening the holes 5 at unnecessary places to cut off the conduction of the wiring, various circuits can be freely created.
Note that not all holes are shown in the figure,
Representatively, a case where one wire is cut off and a case where two wires are cut off simultaneously at an intersection are shown.

FIG. 8 shows an example in which a plurality of printed wiring boards 21 shown in FIG. 7 are stacked. What is prepared is a printed wiring board 21 configured as a standard circuit sheet as shown in FIG. By forming holes 5A and 5B for blocking unnecessary wiring as shown in FIGS. 8B and 8C in the printed wiring board 21 having such a standard circuit, circuits of the first pattern are formed, respectively. The printed wiring board 21A having the printed circuit board 21A formed thereon and the circuit of the second pattern is formed. And these printed wiring boards 2
By laminating 1A and 21B as shown in FIG. 8D, they are combined as a circuit component. At this time, a rod-shaped member is skewered through the holes 5A and 5B, thereby forming the holes 5A and 5B.
Both printed wiring boards 21A and 21B can be laminated in an appropriate positional relationship while using A and 5B as positioning holes.

FIG. 9 shows an example in which a plurality of different printed wiring boards 31 are stacked. Please prepare Fig. 9
This is a printed wiring board 31 configured as a standard circuit sheet as shown in FIG. Positioning holes 34 are formed at four corners of the printed wiring board 31. The other points are the same as those of the printed wiring board 21 of FIG. FIG. 9 shows a printed circuit board 31 having such a standard circuit.
By forming holes 5A and 5B for blocking unnecessary wiring as shown in (b) and (c), a printed wiring board 31A on which a circuit of the first pattern is formed and a printed circuit on which a circuit of the second pattern is formed, respectively. The wiring board 31B is made. Then, as shown in FIG. 9D, these printed wiring boards 31A and 31B are laminated while aligning the positioning holes 34 to be combined as a circuit component. At that time, FIG.
As shown in (e), the difference in circuit pattern can be checked by confirming the positional relationship between the holes 5A and 5B of the upper printed wiring board 31A and the lower printed wiring board 31B.

[0025]

As described above, according to the first aspect of the present invention, it is possible to easily cope with a circuit change only by changing the position of the hole formed in the printed wiring board. Therefore,
Various circuits can be configured flexibly without increasing costs.

According to the second aspect of the present invention, since the wiring pattern of the printed wiring board is formed in a grid pattern, only the printed wiring board of the standard pattern is prepared, and the position where the hole is formed is appropriately selected. Thus, various circuits can be freely created.

According to the third aspect of the present invention, since a flexible circuit sheet is used as the printed wiring board, the printed wiring board can be compactly accommodated in an electric junction box or the like by bending the printed wiring board.

According to the fourth aspect of the present invention, it is possible to easily cope with a circuit change by changing a conductive position of a wiring pattern of a plurality of printed wiring boards. Therefore, various circuits can be configured flexibly without increasing costs.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a circuit forming method according to a first embodiment of the present invention.

FIGS. 2A to 2C are diagrams illustrating examples of connection portions between the electric wires and a printed wiring board according to the first embodiment.

FIG. 3 is a perspective view showing a state in which the printed wiring board of the first embodiment is bent.

FIG. 4 is an explanatory diagram of a circuit forming method according to a second embodiment of the present invention.

FIG. 5 is a conceptual diagram of a conductive portion in the second embodiment.

FIGS. 6A and 6B are explanatory views showing respective examples of a method of forming a conductive portion according to the second embodiment.

FIG. 7 is an explanatory diagram of a circuit forming method according to a third embodiment of the present invention.

FIGS. 8A and 8B are explanatory diagrams of a case where the printed wiring boards of the third embodiment are stacked, wherein FIG. 8A is a configuration diagram of a printed wiring board having a standard circuit, and FIG. FIG. 3C is a configuration diagram of a printed wiring board on which a circuit of a second pattern is formed, and FIG. 4D is a configuration diagram showing a state in which printed wiring boards of both patterns are stacked.

9A and 9B are explanatory diagrams of a case where the printed wiring board of the third embodiment provided with positioning holes is laminated, wherein FIG. 9A is a configuration diagram of a printed wiring board having a standard circuit, and FIG.
Configuration diagram of a printed wiring board on which a pattern circuit is formed,
(C) is a configuration diagram of a printed wiring board on which a circuit of the second pattern is formed, (d) is a configuration diagram showing a state in which printed wiring boards of both patterns are stacked, and (e) is a hole of both printed wiring boards stacked. It is a figure which shows the positional relationship of.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Printed wiring board 3 Wiring pattern 5, 5A, 5B hole 15 Conductive part 21, 21A, 21B, 31, 31A, 31B Printed wiring board 23 Wiring pattern 23A Vertical line 23B Horizontal line

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E317 AA30 CC03 CC60 GG16 5E338 AA01 AA03 AA12 CD15 EE32 5E343 AA33 EE33 EE43 ER51 GG11

Claims (4)

[Claims] 1. A circuit forming method using a printed wiring board, wherein a desired circuit is formed by opening a hole in a wiring pattern of the printed wiring board to interrupt conduction of a predetermined wiring. 2. The method for forming a circuit using a printed wiring board according to claim 1, wherein the wiring pattern is formed in a lattice shape in which a vertical line and a horizontal line are mutually conductive at an intersection. Circuit forming method using a printed wiring board. 3. A circuit forming method using a printed wiring board according to claim 1, wherein said printed wiring board is formed of a flexible circuit sheet. Circuit forming method using 4. A desired circuit is formed by laminating a plurality of printed wiring boards and conducting the wiring patterns of the upper and lower printed wiring boards to each other at an overlapping position of the two wiring patterns. A circuit forming method using a printed wiring board.